公开(公告)号：US20220056589A1

公开(公告)日：2022-02-24

申请号：US17000239

申请日：2020-08-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Wei CHIANG ,  Shin-Luh TARNG ,  Chih-Pin HUNG ,  Shiu-Chih WANG ,  Yong-Da CHIU

IPC: C23C18/16 ,  H01L21/67 ,  H01L21/768

Abstract: An electroless semiconductor bonding structure, an electroless plating system and an electroless plating method of the same are provided. The electroless semiconductor bonding structure includes a first substrate and a second substrate. The first substrate includes a first metal bonding structure disposed adjacent to a first surface of the first substrate. The second substrate includes a second metal bonding structure disposed adjacent to a second surface of the second substrate. The first metal bonding structure connects to the second metal bonding structure at an interface by electroless bonding and the interface is substantially void free.

公开(公告)号：US20190244909A1

公开(公告)日：2019-08-08

申请号：US15891305

申请日：2018-02-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yong-Da CHIU ,  Shiu-Chih WANG ,  Shang-Kun HUANG ,  Ying-Ta CHIU ,  Shin-Luh TARNG ,  Chih-Pin HUNG

IPC: H01L23/532 ,  H01L23/00

CPC classification number: H01L23/53233 ,  H01L23/53238 ,  H01L24/06 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/161 ,  H05K2201/03 ,  H05K2201/09481

Abstract: A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.

公开(公告)号：US20190127573A1

公开(公告)日：2019-05-02

申请号：US15801116

申请日：2017-11-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chean-Cheng SU ,  Chih-Pin HUNG ,  Shin-Luh TARNG ,  Chaung Chi WANG ,  Chao Ming TSENG ,  Shiu-Chih WANG

IPC: C08L67/04 ,  H01L21/673 ,  C08K5/00 ,  C08K5/09 ,  C08K3/36 ,  C08K3/04 ,  C08K5/5419

Abstract: A polylactic acid resin composition includes about 100 parts by weight of a polylactic acid resin, about 0.001 to about 3 parts by weight of a nucleating agent and about 3 to about 70 parts by weight of a filler. The polylactic acid resin composition can be processed into a biodegradable molded article or other product having a high impact strength and a high heat deflection temperature.