公开(公告)号：US20140117388A1

公开(公告)日：2014-05-01

申请号：US13663016

申请日：2012-10-29

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yen-Ting Kuo ,  Ping-Cheng Hu ,  Yu-Fang Tsai

IPC: H01L33/62 ,  H01L33/52

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: Light-emitting semiconductor packages and related methods. The light-emitting semiconductor package includes a central barrier, a plurality of leads, a light-emitting device, a first encapsulant, a package body, and a second encapsulant. The light-emitting device is disposed in the interior space defined by the central barrier and is electrically connected to the leads surrounding the central barrier. The light-emitting device includes upper and lower light-emitting surfaces. The first encapsulant and the second encapsulant cover the upper and lower light-emitting surfaces, respectively. The package body encapsulates portions of the central barrier, portions of each of the leads, and the first encapsulant. The light-emitting semiconductor package can emit light from both the upper and lower sides thereof.

Abstract translation: 发光半导体封装及相关方法。 发光半导体封装包括中央屏障，多个引线，发光器件，第一密封剂，封装体和第二密封剂。 发光装置设置在由中央屏障限定的内部空间中，并且电连接到围绕中心屏障的引线。 发光装置包括上下发光面。 第一密封剂和第二密封剂分别覆盖上部和下部发光表面。 封装主体封装中央屏障的部分，每个引线的部分和第一密封剂。 发光半导体封装可以从其上侧和下侧发光。

公开(公告)号：US09059379B2

公开(公告)日：2015-06-16

申请号：US13663016

申请日：2012-10-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yen-Ting Kuo ,  Ping-Cheng Hu ,  Yu-Fang Tsai

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: Light-emitting semiconductor packages and related methods. The light-emitting semiconductor package includes a central barrier, a plurality of leads, a light-emitting device, a first encapsulant, a package body, and a second encapsulant. The light-emitting device is disposed in the interior space defined by the central barrier and is electrically connected to the leads surrounding the central barrier. The light-emitting device includes upper and lower light-emitting surfaces. The first encapsulant and the second encapsulant cover the upper and lower light-emitting surfaces, respectively. The package body encapsulates portions of the central barrier, portions of each of the leads, and the first encapsulant. The light-emitting semiconductor package can emit light from both the upper and lower sides thereof.

Abstract translation: 发光半导体封装及相关方法。 发光半导体封装包括中央屏障，多个引线，发光器件，第一密封剂，封装体和第二密封剂。 发光装置设置在由中央屏障限定的内部空间中，并且电连接到围绕中心屏障的引线。 发光装置包括上下发光面。 第一密封剂和第二密封剂分别覆盖上部和下部发光表面。 封装主体封装中央屏障的部分，每个引线的部分和第一密封剂。 发光半导体封装可以从其上侧和下侧发光。