公开(公告)号：US09505612B2

公开(公告)日：2016-11-29

申请号：US14577337

申请日：2014-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Jae-Wung Lee ,  Jaibir Sharma ,  Navab Singh

IPC: H01L29/00 ,  B81C1/00

CPC classification number: B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L2924/1461

Abstract: A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.

Abstract translation: 一种用于微机电系统（MEMS）器件的薄膜封装（TFE）的方法，包括提供衬底; 在基板上形成MEMS器件; 形成与所述MEMS器件相邻的一个或多个蚀刻通道; 在MEMS器件下面提供一个或多个空腔; 以及在MEMS器件上形成一个或多个空腔。

公开(公告)号：US20150175408A1

公开(公告)日：2015-06-25

申请号：US14577337

申请日：2014-12-19

Applicant: Agency for Science, Technology and Research

Inventor： Jae-Wung Lee ,  Jaibir Sharma ,  Navab Singh

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L2924/1461

Abstract: A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.

Abstract translation: 一种用于微机电系统（MEMS）器件的薄膜封装（TFE）的方法，包括提供衬底; 在基板上形成MEMS器件; 形成与所述MEMS器件相邻的一个或多个蚀刻通道; 在MEMS器件下面提供一个或多个空腔; 以及在MEMS器件上形成一个或多个空腔。

公开(公告)号：US20160289064A1

公开(公告)日：2016-10-06

申请号：US15104182

申请日：2014-12-16

Applicant: Agency for Science, Technology and Research

Inventor： Jae-Wung Lee ,  Jaibir Sharma ,  Navab Singh

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81C1/00293 ,  B81C1/00825 ,  B81C2203/0145 ,  B81C2203/0154 ,  B81C2203/0172 ,  H01L21/56 ,  H01L23/28 ,  H01L23/3135 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating encapsulated microelectromechanical system (MEMS) devices, comprising: providing a substrate having one or more MEMS devices formed thereon; depositing a sacrificial layer over the substrate and the one or more MEMS devices; patterning the sacrificial layer to define one or more cavities in the sacrificial layer and around the one or more MEMS devices; forming a cap layer over the sacrificial layer and the one or more cavities, the cap layer having one or more etch holes defined therein; removing the sacrificial layer by etching the sacrificial layer at least through the one or more etch holes; and depositing a sealing layer over the cap layer and the one or more etch holes to encapsulate the one or more MEMS devices, the substrate, and the cap layer.

Abstract translation: 一种制造封装的微机电系统（MEMS）器件的方法，包括：提供其上形成有一个或多个MEMS器件的衬底; 在所述衬底和所述一个或多个MEMS器件上沉积牺牲层; 图案化所述牺牲层以在所述牺牲层中并围绕所述一个或多个MEMS器件限定一个或多个空腔; 在所述牺牲层和所述一个或多个空腔上形成覆盖层，所述盖层具有限定在其中的一个或多个蚀刻孔; 通过至少通过所述一个或多个蚀刻孔蚀刻所述牺牲层来去除所述牺牲层; 以及在所述盖层和所述一个或多个蚀刻孔上沉积密封层以封装所述一个或多个MEMS器件，所述衬底和所述覆盖层。