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    MEMS STRUCTURE
    1.
    发明公开
    MEMS STRUCTURE 审中-公开

    公开(公告)号：US20230331546A1

    公开(公告)日：2023-10-19

    申请号：US17724157

    申请日：2022-04-19

    申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

    发明人： FAN HU ,  WEN-CHUAN TAI ,  LI-CHUN PENG ,  HSIANG-FU CHEN

    IPC分类号： B81C3/00

    CPC分类号： B81C3/001 ,  B81C2201/0118 ,  B81C2203/0109 ,  B81C2203/0172

    摘要： A MEMS package is provided. The MEMS package includes a metallization layer, a planarization structure, a MEMS device structure, a cap structure and a pressure adjustment element. The planarization structure has an inner sidewall defining a first cavity exposing the metallization layer. The MEMS device structure is bonded to the planarization structure. The MEMS device structure includes a movable element over the first cavity. The cap structure is bonded to the MEMS device structure and has an inner sidewall defining a second cavity facing the movable element. The pressure adjustment element is disposed in the second cavity.

    Thin Film Encapsulation of Electrodes
    9.
    发明申请
    Thin Film Encapsulation of Electrodes 审中-公开
    电极薄膜封装

    公开(公告)号：US20160289064A1

    公开(公告)日：2016-10-06

    申请号：US15104182

    申请日：2014-12-16

    申请人： Agency for Science, Technology and Research

    发明人： Jae-Wung Lee ,  Jaibir Sharma ,  Navab Singh

    IPC分类号： B81B7/00 ,  B81C1/00

    CPC分类号： B81B7/0058 ,  B81C1/00293 ,  B81C1/00825 ,  B81C2203/0145 ,  B81C2203/0154 ,  B81C2203/0172 ,  H01L21/56 ,  H01L23/28 ,  H01L23/3135 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of fabricating encapsulated microelectromechanical system (MEMS) devices, comprising: providing a substrate having one or more MEMS devices formed thereon; depositing a sacrificial layer over the substrate and the one or more MEMS devices; patterning the sacrificial layer to define one or more cavities in the sacrificial layer and around the one or more MEMS devices; forming a cap layer over the sacrificial layer and the one or more cavities, the cap layer having one or more etch holes defined therein; removing the sacrificial layer by etching the sacrificial layer at least through the one or more etch holes; and depositing a sealing layer over the cap layer and the one or more etch holes to encapsulate the one or more MEMS devices, the substrate, and the cap layer.

    摘要翻译： 一种制造封装的微机电系统（MEMS）器件的方法，包括：提供其上形成有一个或多个MEMS器件的衬底; 在所述衬底和所述一个或多个MEMS器件上沉积牺牲层; 图案化所述牺牲层以在所述牺牲层中并围绕所述一个或多个MEMS器件限定一个或多个空腔; 在所述牺牲层和所述一个或多个空腔上形成覆盖层，所述盖层具有限定在其中的一个或多个蚀刻孔; 通过至少通过所述一个或多个蚀刻孔蚀刻所述牺牲层来去除所述牺牲层; 以及在所述盖层和所述一个或多个蚀刻孔上沉积密封层以封装所述一个或多个MEMS器件，所述衬底和所述覆盖层。