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    Continuous casting mold and a continuous casting method of copper alloy
    2.
    发明申请
    Continuous casting mold and a continuous casting method of copper alloy 审中-公开
    连铸模具和铜合金连铸方法

    公开(公告)号：US20060180293A1

    公开(公告)日：2006-08-17

    申请号：US11386924

    申请日：2006-03-23

    申请人： Yasuhiro Maehara ,  Mitsuharu Yonemura ,  Keiji Nakajima ,  Naotsugu Yoshida ,  Masahiro Aoki

    发明人： Yasuhiro Maehara ,  Mitsuharu Yonemura ,  Keiji Nakajima ,  Naotsugu Yoshida ,  Masahiro Aoki

    IPC分类号： B22D11/00

    CPC分类号： B22D11/143 ,  B22D11/004 ,  B22D11/059 ,  B22D11/12 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/10

    摘要： A continuous casting mold for a Cu alloy, using any one member selected from a glassy carbon, a metal-based self-lubricating composite or a graphite with a bulk density exceeding 1.92, at least for the mold member including the solidification starting position of the Cu alloy melt. A continuous casting mold for a Cu alloy, composed of any one member selected from a graphite, a ceramic and a metal member or of a combination of two or more parts of members thereof, in which at least the inner wall in the solidification starting position of the Cu alloy melt is coated with a self-lubricant or a metal-based self-lubricating composite material. A continuous casting method of a Cu alloy, comprised of giving, at the time of continuously casting the Cu alloy by an intermittent pulling out method, a vibration that has a frequency larger than the slab intermittent pulling out frequency by two orders or more and that has a component vertical to the pulling out direction of the slab, or continuously supplying a lubricant or an anti-sticking material between the inner wall of the mold and the slab.

    摘要翻译： 使用选自玻璃碳，金属基自润滑复合材料或体积密度超过1.92的石墨中的任何一种的Cu合金连续铸模，至少对于包括固化开始位置的模具构件 铜合金熔体。 一种用于Cu合金的连续铸造模具，其由选自石墨，陶瓷和金属构件中的任何一种构件或其两个或多个构件的组合组成，其中至少固化起始位置的内壁 的Cu合金熔体涂有自润滑剂或金属基自润滑复合材料。 一种Cu合金的连续铸造方法，其特征在于，通过间歇拉拔法将Cu合金连续铸造时，具有比板坯断续拉拔频率大2倍以上的振动， 具有与板坯的拉出方向垂直的部件，或者在模具的内壁和板坯之间连续供给润滑剂或防粘材料。

    Solid-state imaging device, method for manufacturing the same and imaging apparatus
    3.
    发明授权
    Solid-state imaging device, method for manufacturing the same and imaging apparatus 有权
    固态成像装置及其制造方法及成像装置

    公开(公告)号：US08189083B2

    公开(公告)日：2012-05-29

    申请号：US12496963

    申请日：2009-07-02

    申请人： Masashi Nakata ,  Haruhiko Ajisawa ,  Naotsugu Yoshida ,  Yasuhiro Nakana ,  Junichi Furukawa ,  Yoshinori Toumiya ,  Junichiro Fujimagari

    发明人： Masashi Nakata ,  Haruhiko Ajisawa ,  Naotsugu Yoshida ,  Yasuhiro Nakana ,  Junichi Furukawa ,  Yoshinori Toumiya ,  Junichiro Fujimagari

    IPC分类号： H04N5/335 ,  H01L31/062

    CPC分类号： H01L27/14632 ,  H01L27/14625 ,  H01L27/14629 ,  H01L27/14685 ,  H01L27/14687

    摘要： A solid-state imaging device includes a semiconductor substrate having a pixel region including a photoelectric conversion portion, a wiring portion including a conductor line and disposed on the semiconductor substrate with an insulating film therebetween, a metal pad connected to the conductor line, a pad-coating insulating film coating the metal pad, and a waveguide material layer. The wiring portion and the pad-coating insulating film each have an opening therein over the photoelectric conversion portion, and the openings continue from each other to define a waveguide opening having an open side and a closed side. The waveguide material layer is disposed in the waveguide opening and on the pad-coating insulating film with a passivation layer therebetween. The pad-coating insulating film has a thickness of 50 to 250 nm and a face defining the opening. The face is slanted so as to diverge toward the open side of the opening.

    摘要翻译： 固态成像装置包括具有包括光电转换部分的像素区域的半导体衬底，包括导体线的布线部分，并且在其间具有绝缘膜的半导体衬底上设置有连接到导体线的金属焊盘，衬垫 涂覆金属垫的涂层绝缘膜和波导材料层。 布线部分和焊盘覆盖绝缘膜在光电转换部分上各自具有开口，并且开口彼此连续地限定具有开放侧和封闭侧的波导开口。 波导材料层设置在波导管开口和焊垫涂层绝缘膜之间，其间具有钝化层。 垫涂层绝缘膜具有50至250nm的厚度和限定开口的面。 脸部倾斜以朝向开口的开放侧分开。

    SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGING APPARATUS
    4.
    发明申请
    SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGING APPARATUS 有权
    固态成像装置，其制造方法和成像装置

    公开(公告)号：US20100007779A1

    公开(公告)日：2010-01-14

    申请号：US12496963

    申请日：2009-07-02

    申请人： Masashi Nakata ,  Haruhiko Ajisawa ,  Naotsugu Yoshida ,  Yasuhiro Nakano ,  Junichi Furukawa ,  Yoshinori Toumiya ,  Junichiro Fujimagari

    发明人： Masashi Nakata ,  Haruhiko Ajisawa ,  Naotsugu Yoshida ,  Yasuhiro Nakano ,  Junichi Furukawa ,  Yoshinori Toumiya ,  Junichiro Fujimagari

    IPC分类号： H04N5/335 ,  H01L31/14 ,  H01L31/02 ,  H04N5/232 ,  H01L31/0232

    CPC分类号： H01L27/14632 ,  H01L27/14625 ,  H01L27/14629 ,  H01L27/14685 ,  H01L27/14687

    摘要： A solid-state imaging device includes a semiconductor substrate having a pixel region including a photoelectric conversion portion, a wiring portion including a conductor line and disposed on the semiconductor substrate with an insulating film therebetween, a metal pad connected to the conductor line, a pad-coating insulating film coating the metal pad, and a waveguide material layer. The wiring portion and the pad-coating insulating film each have an opening therein over the photoelectric conversion portion, and the openings continue from each other to define a waveguide opening having an open side and a closed side. The waveguide material layer is disposed in the waveguide opening and on the pad-coating insulating film with a passivation layer therebetween. The pad-coating insulating film has a thickness of 50 to 250 nm and a face defining the opening. The face is slanted so as to diverge toward the open side of the opening.

    摘要翻译： 固态成像装置包括具有包括光电转换部分的像素区域的半导体衬底，包括导体线的布线部分，并且在其间具有绝缘膜的半导体衬底上设置有连接到导体线的金属焊盘，衬垫 涂覆金属垫的涂层绝缘膜和波导材料层。 布线部分和焊盘覆盖绝缘膜在光电转换部分上各自具有开口，并且开口彼此连续地限定具有开放侧和封闭侧的波导开口。 波导材料层设置在波导管开口和焊垫涂层绝缘膜之间，其间具有钝化层。 垫涂层绝缘膜具有50至250nm的厚度和限定开口的面。 脸部倾斜以朝向开口的开放侧分开。