公开(公告)号：US5697425A

公开(公告)日：1997-12-16

申请号：US433480

申请日：1995-05-11

申请人： Akihiko Nanba ,  Chisato Yoshida ,  Takaharu Moriya ,  Naotsugu Yoshida ,  Yasuyuki Murata ,  Kazutoshi Hironaka ,  Mineo Muraki ,  Ujihiro Nishiike

发明人： Akihiko Nanba ,  Chisato Yoshida ,  Takaharu Moriya ,  Naotsugu Yoshida ,  Yasuyuki Murata ,  Kazutoshi Hironaka ,  Mineo Muraki ,  Ujihiro Nishiike

IPC分类号： B22D11/00 ,  B22D11/06 ,  B22D27/02 ,  B22D27/08 ,  B22D35/06

CPC分类号： B22D11/00 ,  B22D11/0622 ,  Y10S164/90

摘要： Thin cast sheets having an excellent quality are obtained by continuous casting in which a semi-solidified metal slurry is fed from a continuous production device of the semi-solidified metal slurry through a discharge nozzle provided with means for heating the nozzle itself into a twin roll type continuous strip caster, at where the slurry is rapidly quenched and solidified to fine a structure and dispersion of precipitate.

摘要翻译： PCT No.PCT / JP94 / 01315 Sec。 371日期1995年5月11日 102（e）日期1995年5月11日PCT 1994年8月9日PCT PCT。 公开号WO95 / 07780 日期1995年3月23日通过连续铸造获得具有优良质量的铸造片，其中通过设置有用于加热喷嘴的装置的排出喷嘴从半固化金属浆料的连续生产装置进料半固化金属浆料 本身进入双辊式连续带式连铸机，其中浆料被快速淬火和固化以精细沉淀物的结构和分散。

公开(公告)号：US06548620B2

公开(公告)日：2003-04-15

申请号：US09977415

申请日：2001-10-16

申请人： Yasuyuki Murata

发明人： Yasuyuki Murata

IPC分类号： C08G6506

CPC分类号： C08G59/145 ,  C08G59/245 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.

摘要翻译： 本发明提供四甲基联苯型高性能环氧树脂组合物和含有环氧树脂的可固化环氧树脂组合物，可用于电气和电子领域等。 四甲基联苯型环氧树脂组合物包含在碱金属化合物的存在下使4,4'-二羟基-3,3'，5,5'-四甲基联苯与表卤代醇反应得到的环氧树脂组合物。 该组合物的四甲基联苯醌的含量为0.5重量％以下，由以下结构式（1）表示的缩水甘油基化合物的含量为0.5重量％以下。 可固化环氧树脂组合物含有环氧树脂组合物和用于环氧树脂的固化剂。

公开(公告)号：US6063876A

公开(公告)日：2000-05-16

申请号：US85209

申请日：1998-05-27

申请人： Atsuhito Hayakawa ,  Yasuyuki Murata ,  Norio Tohriiwa

发明人： Atsuhito Hayakawa ,  Yasuyuki Murata ,  Norio Tohriiwa

IPC分类号： C08L63/02 ,  C08G59/06 ,  C08G59/24 ,  C08G59/62 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08G59/20

CPC分类号： H01L23/293 ,  C08G59/063 ,  C08G59/245 ,  C08L63/00 ,  H01L2924/0002

摘要： An epoxy resin composition which can be crushed at an ordinary temperature and which comprises respective components described below,(a) 10 to 80 parts by weight of a 4,4'-biphenol type epoxy resin which is crystalline at an ordinary temperature,(b) 20 to 90 parts by weight of a noncrystalline epoxy resin having a softening point of 35.degree. C. to 55.degree. C.

摘要翻译： （a）将常温下结晶的4,4'-联苯酚型环氧树脂10〜80重量份，（b）在常温下进行粉碎的环氧树脂组合物， ）20〜90重量份的软化点为35〜55℃的非结晶性环氧树脂。

公开(公告)号：US5756564A

公开(公告)日：1998-05-26

申请号：US806883

申请日：1997-02-25

申请人： Yasuyuki Murata ,  Yoshinori Nakanishi ,  Norio Tohriiwa

发明人： Yasuyuki Murata ,  Yoshinori Nakanishi ,  Norio Tohriiwa

IPC分类号： C08K3/36 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31 ,  C08L63/02

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01B3/40 ,  H01L2924/0002

摘要： To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d): (a) Epoxy resin (b) Epoxy resin hardener comprising a partially aromatic-esterified phenol aralkyl resin having a conversion of esterification of 10 to 90 mol % as the main component (c) Silica powder filler (d) Cure accelerator.

摘要翻译： 提供一种固化性优异的半导体封装用环氧树脂组合物，能够得到低吸湿性的固化物。 环氧树脂组合物包含以下组分（a），（b），（c）和（d）：（a）环氧树脂（b）包含具有酯化转化率的部分芳族酯化苯酚芳烷基树脂的环氧树脂固化剂 以10〜90mol％为主成分（c）二氧化硅粉末填料（d）固化促进剂。

公开(公告)号：US5185388A

公开(公告)日：1993-02-09

申请号：US884247

申请日：1992-05-11

申请人： Yasuyuki Murata ,  Isako Konishi ,  Ryohei Tanaka ,  Yoshinori Nakanishi

发明人： Yasuyuki Murata ,  Isako Konishi ,  Ryohei Tanaka ,  Yoshinori Nakanishi

IPC分类号： C08G59/32 ,  C08L61/04 ,  C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08G59/3218 ,  C08L61/04 ,  C08L63/00

摘要： An electrical encapsulation composition is disclosed comprising (a) an epoxy resin which is the product of glycidating a polyphenolic compound which is the condensation product of (i) a substituted phenol which can be represented by the formula ##STR1## in which each R is selected independently from hydrogen, C.sub.1-5 alkyl and phenyl, with the provisos that at least two R groups are not hydrogen and that the R groups may be bonded in a ring structure, and (ii) an aromatic aldehyde or aromatic ketone having a phenolic hydroxyl group as represented by the general formula ##STR2## in which R' is selected from hydrogen, C.sub.1-5 alkyl and phenyl, R" is selected from C.sub.1-5 alkyl, phenyl, methoxy and halogen, and n is an integer from 0 to 4; (b) a curing agent for the epoxy resin; and (c) an inorganic filler.

摘要翻译： 公开了一种电气封装组合物，其包含（a）环氧树脂，其是将多酚化合物缩水化产物的产物，所述多酚化合物是（i）可以由其中每个R选择的式“IMAGE”表示的取代苯酚的缩合产物 独立于氢，C 1-5烷基和苯基，条件是至少两个R基团不是氢并且R基团可以键合在环结构中，和（ii）具有酚羟基的芳族醛或芳族酮 其中R'选自氢，C 1-5烷基和苯基，R“选自C 1-5烷基，苯基，甲氧基和卤素，n是0的整数。 到4; （b）环氧树脂的固化剂; 和（c）无机填料。

公开(公告)号：US5597876A

公开(公告)日：1997-01-28

申请号：US625839

申请日：1996-04-01

申请人： Yasuyuki Murata ,  Yoshinori Nakanishi ,  Mitsukazu Ochi

发明人： Yasuyuki Murata ,  Yoshinori Nakanishi ,  Mitsukazu Ochi

IPC分类号： C08G59/62 ,  C08G59/20 ,  C08G59/24 ,  C08L63/00

CPC分类号： C08L63/00 ,  C08G59/245 ,  C08G59/621

摘要： An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.

摘要翻译： 提供一种环氧树脂组合物，其包含双酚型环氧树脂和衍生自在芳环上的相邻位置处具有2个或更多个酚羟基的多元酚化合物的多元酚树脂固化剂。 可以获得在高温下具有优异稳定性和强度的固化产物，作为粘合剂，铸件，密封材料，模制品和层压材料。

公开(公告)号：US5149730A

公开(公告)日：1992-09-22

申请号：US537316

申请日：1990-06-13

申请人： Yasuyuki Murata ,  Isako Konishi ,  Ryohei Tanaka ,  Yoshinori Nakanishi

发明人： Yasuyuki Murata ,  Isako Konishi ,  Ryohei Tanaka ,  Yoshinori Nakanishi

IPC分类号： H01L23/29 ,  C08G59/20 ,  C08G59/24 ,  C08G59/62 ,  C08L63/00 ,  C08L63/02 ,  H01B3/40 ,  H01L23/31

CPC分类号： H01B3/40 ,  C08G59/245 ,  C08L63/00

摘要： An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

摘要翻译： 提供了包含4,4'-二羟基联苯的二缩水甘油醚，三酚固化剂，固化促进剂和无机填料的电气封装配方。 该组合物快速固化并且在高温操作下表现出优异的抗开裂性。

公开(公告)号：US07285602B2

公开(公告)日：2007-10-23

申请号：US10792859

申请日：2004-03-05

申请人： Yasuyuki Murata ,  Atsuhito Hayakawa ,  Akihiro Itou

发明人： Yasuyuki Murata ,  Atsuhito Hayakawa ,  Akihiro Itou

IPC分类号： C08L63/02 ,  C08L63/04 ,  B32B3/04 ,  B32B3/10

CPC分类号： C08G59/04 ,  Y10T428/24264 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/31511

摘要： A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation

摘要翻译： 颗粒状环氧树脂通过在常温下粉碎固体的环氧树脂制成，并且由于其熔体粘度低，其中分子量为500以下的组分的总含量为n < 下述通式（1）中的O 1〜O 0和/或以下通式（2）中的n≥2以上的成分为50质量％以上 或下述通式（1）中的n≥0的成分中的分子量为400以下的成分的总含量和/或n≥2的成分， 下述通式（2）中的 = 0为整个环氧树脂的20质量％以上。 粒状环氧树脂中分子量为200以下的低分子量化合物的含量为0.3质量％以下。 颗粒状环氧树脂容易处理，因为它在储存和运输过程中几乎不会堵塞

公开(公告)号：US06255365B1

公开(公告)日：2001-07-03

申请号：US09360963

申请日：1999-07-27

申请人： Atsuhito Hayakawa ,  Yasuyuki Murata

发明人： Atsuhito Hayakawa ,  Yasuyuki Murata

IPC分类号： C08K336

CPC分类号： H01L23/293 ,  C08G59/38 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  C08L61/04 ,  H01L2924/00

摘要： An epoxy resin composition comprising (a) an epoxy resin comprising a mixture of the following components: (1) about 50-95 parts by weight of a novolak type epoxy resin, and (2) about 5-50 parts by weight of 4,4′-biphenol type epoxy resin (b) a phenolic resin represented by the general formula (II) (where R, which may be the same or different, represents an alkyl group having 1-10 carbon atoms, a substituted or unsubstituted phenyl group, a substituted or unsubstituted aralkyl group, an alkoxyl group or a halogen atom; Z, which may be the same or different, represents a divalent hydrocarbon group having 1-15 carbon atoms, provided that at least one Z is a divalent hydrocarbon group having 5-15 carbon atoms; n is a number of 0-8 on the average value; and i, which may be the same or different, is an integer of 0-3) as an epoxy resin hardener, (c) an inorganic filler, and (d) a curing accelerator.

摘要翻译： 一种环氧树脂组合物，其包含（a）包含以下组分的混合物的环氧树脂：（1）约50-95重量份的酚醛清漆型环氧树脂，和（2）约5-50重量份的4， 4'-联苯酚型环氧树脂（b）由通式（II）表示的酚醛树脂（其中R可以相同或不同，表示具有1-10个碳原子的烷基，取代或未取代的苯基 取代或未取代的芳烷基，烷氧基或卤素原子; Z可以相同或不同，表示具有1-15个碳原子的二价烃基，条件是至少一个Z是具有 5-15个碳原子; n是平均值为0-8的数; i可以相同或不同，为0-3的整数）作为环氧树脂固化剂，（c）无机填料 ，（d）固化促进剂。

公开(公告)号：US5739186A

公开(公告)日：1998-04-14

申请号：US566574

申请日：1995-11-28

申请人： Atsuhito Hayakawa ,  Yasuyuki Murata ,  Yoshinori Nakanishi ,  Norio Tohriiwa

发明人： Atsuhito Hayakawa ,  Yasuyuki Murata ,  Yoshinori Nakanishi ,  Norio Tohriiwa

IPC分类号： C08G59/22 ,  C08G59/24 ,  C08G59/32 ,  C08G59/38 ,  H01L23/29 ,  C08L63/00 ,  C08G59/00

CPC分类号： C08G59/245 ,  C08G59/226 ,  C08G59/3218 ,  C08G59/38 ,  H01L23/293 ,  H01L2924/0002

摘要： The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

摘要翻译： 本发明涉及一种用于半导体封装的环氧树脂组合物，其至少包括环氧树脂，硬化剂，无机填料和促进剂，其中所述环氧树脂是由约20至约90重量份的4,4'- 双酚F型环氧树脂和约10至约80重量份具有位于苯基核之间的极性极性烃基（Z）的多羟基酚醛环氧树脂或双酚型环氧树脂。