摘要:
There is provided a image projection apparatus including an image generation unit for generating an image by using light emitted from a light source, comprising: a movable unit configured to hold the image generation unit and to be able to change a position of the image generation unit; and a drive unit configured to drive the movable unit to move, wherein the movable unit is disposed to move horizontally.
摘要:
A projection lens unit includes a plurality of lenses configured to transmit and emit image light generated by an image generating unit using light from a light source; a barrel configured to hold the plurality of projection lenses; and a heat radiator disposed on the barrel and configured to radiate heat of the barrel to an outside.
摘要:
An image projection apparatus includes an image generator configured to use light emitted from a light source to generate an image; a movable member in which the image generator is disposed, the movable member being movably supported; a fixed member being fixed and configured to movably support the movable member; and a mover configured to move the movable member. The mover includes a first pair of actuators facing each other in a first direction across the image generator, and a second pair of actuators facing each other in the second direction across the image generator. The first pair of actuators causes a driving force to operate on the movable member in a direction parallel to a second direction orthogonal to the first direction. The second pair of actuators causes a driving force to operate on the movable member in a direction parallel to the first direction.
摘要:
An image projection apparatus includes: a light source; a projection optical unit including a concave mirror and configured to guide a projection image on a projection surface; an air blower configured to generate a flow of air in a main body casing; a power supply circuit board configured to supply power to an electric component in the main body casing; and a light source drive circuit board configured to drive the light source. At least one of the power supply circuit board and the light source drive circuit board is fixed on a facing surface facing a rear side of the concave mirror, of the main body casing.
摘要:
A holding structure holds a reflecting mirror. The holding structure includes a reflecting mirror bracket holding the reflecting mirror; a protrusion disposed on the reflecting mirror; a protrusion supporting part disposed on the reflecting mirror bracket and supporting the protrusion; and a spacer disposed between the protrusion supporting part and the reflecting mirror bracket.
摘要:
An illumination optical system is provided that is configured to guide light emitted from a light source to an image generation unit that is arranged to be movable in a direction perpendicular to incoming light and is configured to generate an image by reflecting the incoming light. The illumination optical system includes a first lens that is arranged to be movable in a direction perpendicular to an optical axis of the first lens, a second lens that is arranged to be movable in a direction that changes a face-to-face distance between the first lens and the second lens, and a lens position control unit configured to displace the first lens and the second lens.
摘要:
A communication apparatus is used to share information via a communication network. The communication apparatus includes: a housing; a moving unit provided to be movable relatively with respect to the housing; a light projecting unit that projects light modulated based on image information, is provided in one of the housing or the moving unit, and includes a projector lens; and an image input unit that is to input an image, is provided in the other of the housing or the moving unit, and includes an image capturing lens. The moving unit is capable of moving relatively with respect to the housing between a covering position at which the projector lens and the image capturing lens are covered and an exposing position at which the projector lens and the image capturing lens are exposed.
摘要:
A manufacturing method of a thin film transistor includes forming a pair of source/drain electrodes on a substrate, such that the source/drain electrodes define a gap therebetween; forming low resistance conductive thin films, which define a gap therebetween, on the source/drain electrodes; and forming an oxide semiconductor thin film layer on upper surface of the low resistance conductive thin films and in the gap defined between the low resistance conductive thin films so that the oxide semiconductor thin film layer functions as a channel. The low resistance conductive thin films and the oxide semiconductor thin film layer are etched so that side surfaces of the resistance conductive thin films and corresponding side surfaces of the oxide semiconductor thin film layer coincide with each other in a channel width direction of the channel. A gate electrode is mounted over the oxide semiconductor thin film layer.
摘要:
An RTP packet generating unit 11 packetizes data into packets, and adds identification information to the header of each of the packets, the identification information identifying each of the packets. An RTP packet encrypting unit 13 divides data included in each of the generated packets into blocks, and encrypts the data included in each of the packets on a block-by-block basis using an encryption key which an encryption key sharing unit 12 shares with a receiving client in such a manner that, when encrypting a first block of the data, the packet encrypting unit encrypts it using the identification information for identifying each of the packets, which is contained, as an initial vector, in the header of each of the packets, and, when encrypting each subsequent block of the data, encrypts it according to an encryption method which uses an immediately-previously-encrypted block.
摘要:
A semiconductor device includes an oxide semiconductor thin film layer of zinc oxide. The (002) lattice planes of at least a part of the oxide semiconductor thin film layer have a preferred orientation along a direction perpendicular to a substrate of the semiconductor device and a lattice spacing d002 of at least 2.619 Å.