摘要:
A wiring circuit substrate comprises first circuit element means one one side of the substrate connected to electrode lines of X-Y matrix electrodes, respectively, and second circuit element means in the symmetrical position of the first circuit element means on the other side of the substrate connected to the electrode lines of the X-Y matrix electrodes, respectively, wherein each of leads of the first and the second circuit element means is connected to the output and input lines of the X-Y matrix electrodes via through holes, respectively.The first circuit element comprises integrated transisitors for driving the X-Y matrix electrodes. The second circuit element comprises integrated diodes for protecting an overcurrent in the X-Y matrix electrodes.
摘要:
An optical element that can reduce the etendue of emitted light emitted from the optical element without having depend on the etendue of light-emitting elements is provided with a plasmon-excitation layer that is interposed between two layers having dielectric properties wherein, taking the plasmon-excitation layer as a border, the effective dielectric constant of the emission-side portion that is the emission layer side is higher than the effective dielectric constant of the incident-side portion that is the side of a carrier-generating layer, and the dielectric constant between the plasmon-excitation layer and the carrier-generating layer is higher than the dielectric constant between the carrier-generating layer and the light-incident surface.
摘要:
This invention provides a method for efficiently producing a recombinant protein by allowing the recombinant protein to express in a eukaryotic cell and releasing the expressed recombinant protein to the outside of the cell. The invention provides a polynucleotide used for producing a recombinant protein in a host cell comprising a polynucleotide encoding a glycosylation sequence comprising a transitional endoplasmic reticulum signal sequence and the sequence represented by: Asn-X-(Thr/Ser) (wherein X is an amino acid other than proline) and a polynucleotide encoding a target protein, which would not be efficiently released to the outside of the cell even when a transitional endoplasmic reticulum signal sequence is fused. The polynucleotide releases the target protein to the outside of the host cell via sugar chain modification.
摘要:
A projector has a function to suppress unnecessary radiation (EMI) from a digital substrate even in a narrow space. To this end, the projector includes an input/output substrate arranged at the upper portion of the rear side of the digital substrate, being approximately in parallel to the bottom surface of the case by using a metal frame, and a shielding plate having a shielding surface with an approximately rectangular cross section, so as to cover a device mount surface of the digital substrate and at the same time, contact the shielding plate and the frame.
摘要:
A method for forming scribed grooves on a wafer and an apparatus for implementing the method. The method moves the cutting part such that its cutting edge forms an inverted trapezoid-shaped path, thereby reducing the scribing angle of the cutting edge to an acute angle. Consequently, the stress produced by the mechanical shock at the time of the scribing can be dispersed in the moving direction of the cutting edge and in a direction perpendicular to the surface of the wafer. The horizontal movement of the scribing cutting edge in the wafer enables the application of a sufficient load in a direction perpendicular to the scribing plane in the wafer. Consequently, vertical cracks are sufficiently generated, and the amount of dimensional deviation between the scribed groove and the cleaved plane is reduced. This method can produce chips featuring outside dimensions with higher precision and cleaved surfaces with high-quality mirror finish.
摘要:
A fastener member for molding which is a fastener tape which includes engaging elements on a top side of its substrate and also includes ridges which extend in a longitudinal direction on both edges of a back side of the substrate. The ridges project outwardly such that its outermost part is about 0.3-5 mm from the outer edge of the substrate. A process for producing a plastic molded article having the fastener members molded thereon, comprises fitting the above-mentioned fastener member in the recess of a mold such that the engaging elements on its surface are directed to the recess of the mold and the ridges of the fastener member substantially seal the gap between the fastener member and the sidewall of the recess of the mold, and injecting a resinous composition into the mold.
摘要:
An optical element is provided with a plasmon excitation layer that facilitates both the control of plasmon resonant conditions and the improvement of conversion efficiency. The plasmon excitation layer that is provided in the optical element generates surface plasmons, and the plasmon excitation layer is made up of metal and a dielectric.
摘要:
An optical element that is capable of reventing an increase in size while increasing the light intensity of fluorescent light includes: a light-guide plate (21) that propagates light incident from a light source (1); a phosphor layer (22) that is provided on the light-guide plate (21) and that generates fluorescent light by means of light from the light-guide plate (21); a metal layer (23) that is layered on the phosphor layer (22); and a diffraction grating that is formed at the interface of the phosphor layer (22) and the metal layer (23).
摘要:
An optical element that can reduce the etendue of emitted light emitted from the optical element without having depend on the etendue of light-emitting elements is provided with a plasmon-excitation layer that is interposed between two layers having dielectric properties wherein, taking the plasmon-excitation layer as a border, the effective dielectric constant of the emission-side portion that is the emission layer side is higher than the effective dielectric constant of the incident-side portion that is the side of a carrier-generating layer, and the dielectric constant between the plasmon-excitation layer and the carrier-generating layer is higher than the dielectric constant between the carrier-generating layer and the light-incident surface.
摘要:
A method for forming scribed grooves on a wafer and an apparatus for implementing the method. The method moves the cutting part such that its cutting edge forms an inverted trapezoid-shaped path, thereby reducing the scribing angle of the cutting edge to an acute angle. Consequently, the stress produced by the mechanical shock at the time of the scribing can be dispersed in the moving direction of the cutting edge and in a direction perpendicular to the surface of the wafer. The horizontal movement of the scribing cutting edge in the wafer enables the application of a sufficient load in a direction perpendicular to the scribing plane in the wafer. Consequently, vertical cracks are sufficiently generated, and the amount of dimensional deviation between the scribed groove and the cleaved plane is reduced. This method can produce chips featuring outside dimensions with higher precision and cleaved surfaces with high-quality mirror finish.