公开(公告)号：US4703652A

公开(公告)日：1987-11-03

申请号：US803555

申请日：1985-12-02

申请人： Akio Itoh ,  Kazunori Sumi ,  Sigeo Saitoh ,  Hideo Sobue

发明人： Akio Itoh ,  Kazunori Sumi ,  Sigeo Saitoh ,  Hideo Sobue

IPC分类号： G01F23/296 ,  G01F23/22 ,  G01F23/28

CPC分类号： G01F23/2967 ,  Y10T29/42

摘要： Piezoelectric type liquid level sensor for detecting whether the level of various liquids such as oil of an internal combustion engine, a generator or the like is a predetermined value or higher or not, and method of making the sensor. The sensor is arranged to eliminate the influence of the weight of the lead wires on the vibration element and to facilitate its assembly. The sensor may be provided with a damper member for increasing the sensitivity.

摘要翻译： 压电型液位传感器，用于检测内燃机，发电机等的各种液体的液面是否为规定值以上，以及制造传感器的方法。 该传感器被布置成消除引线在振动元件上的重量的影响并便于其组装。 传感器可以设置有用于增加灵敏度的阻尼器构件。

公开(公告)号：US07592640B2

公开(公告)日：2009-09-22

申请号：US11739877

申请日：2007-04-25

申请人： Kazunori Sumi ,  Dai Aoki

发明人： Kazunori Sumi ,  Dai Aoki

IPC分类号： H01L21/00

CPC分类号： H01L25/0753 ,  H01L33/20 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： The disclosed subject matter relates to a light emitting semiconductor apparatus with reduced color unevenness and suppressed topical deterioration over time with regard to an amount and chromaticity of the illuminating light. The light emitting semiconductor apparatus of the disclosed subject matter can include three separate bonding pads. Among those, the centrally located bonding pad is die bonded to two types of light emitting devices which have an identical material and structure and almost equal sizes, but are different in orientation and direction characteristic of PN-electrodes. The bonding pad located in an outermost location is die-bonded to the light emitting device. In this case, the direction characteristic of a central light emitting device exhibits a substantial reverse conical form while the direction characteristic of the light emitting device exhibits a substantial conical form. The light emitting device mounted on the central bonding pad and the light emitting device mounted on the outermost bonding pad can have respective electrodes on the wire bonding side which are stitch-bonded to bonding wires.

摘要翻译： 所公开的主题涉及具有降低的颜色不均匀性并且相对于照明光的量和色度随时间抑制局部劣化的发光半导体装置。 所公开的主题的发光半导体器件可以包括三个单独的接合焊盘。 其中，中心定位的焊盘与两种具有相同材料和结构以及几乎相同尺寸但不同于PN电极的取向和方向特性的发光器件结合。 位于最外位置的接合焊盘被芯片接合到发光器件。 在这种情况下，中央发光元件的方向特性表现出大致的倒圆锥形状，而发光元件的方向特性表现出大致圆锥形。 安装在中心接合焊盘上的发光器件和安装在最外面的接合焊盘上的发光器件可以在引线接合侧具有针脚接合到接合线的各自的电极。

公开(公告)号：US20070262340A1

公开(公告)日：2007-11-15

申请号：US11739877

申请日：2007-04-25

申请人： Kazunori Sumi ,  Dai Aoki

发明人： Kazunori Sumi ,  Dai Aoki

IPC分类号： H01L33/00 ,  H01L29/24

CPC分类号： H01L25/0753 ,  H01L33/20 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： The disclosed subject matter relates to a light emitting semiconductor apparatus with reduced color unevenness and suppressed topical deterioration over time with regard to an amount and chromaticity of the illuminating light. The light emitting semiconductor apparatus of the disclosed subject matter can include three separate bonding pads. Among those, the centrally located bonding pad is die bonded to two types of light emitting devices which have an identical material and structure and almost equal sizes, but are different in orientation and direction characteristic of PN-electrodes. The bonding pad located in an outermost location is die-bonded to the light emitting device. In this case, the direction characteristic of a central light emitting device exhibits a substantial reverse conical form while the direction characteristic of the light emitting device exhibits a substantial conical form. The light emitting device mounted on the central bonding pad and the light emitting device mounted on the outermost bonding pad can have respective electrodes on the wire bonding side which are stitch-bonded to bonding wires.

摘要翻译： 所公开的主题涉及具有降低的颜色不均匀性并且相对于照明光的量和色度随时间抑制局部劣化的发光半导体装置。 所公开的主题的发光半导体器件可以包括三个单独的接合焊盘。 其中，中心定位的焊盘与两种具有相同材料和结构以及几乎相同尺寸的发光器件结合，但是PN电极的取向和方向特性不同。 位于最外位置的接合焊盘被芯片接合到发光器件。 在这种情况下，中央发光元件的方向特性表现出大致的倒圆锥形状，而发光元件的方向特性表现出大致圆锥形。 安装在中心接合焊盘上的发光器件和安装在最外面的接合焊盘上的发光器件可以在引线接合侧具有针脚接合到接合线的各自的电极。