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公开(公告)号：US5788143A
公开(公告)日：1998-08-04
申请号：US399265
申请日：1995-05-17
CPC分类号： H01L21/67144 , H01L21/4853 , H05K13/0465 , H05K3/3478 , H01L2224/11334 , H01L2224/742 , H01L2924/01322 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , H05K3/3489 , Y10T29/49126 , Y10T29/49144
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
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公开(公告)号：US06254923B1
公开(公告)日：2001-07-03
申请号：US09099883
申请日：1998-01-12
IPC分类号： B05D512
CPC分类号： H01L21/67144 , H01L21/4853 , H01L2224/11334 , H01L2224/742 , H01L2924/01322 , H05K3/3478 , H05K3/3489 , H05K13/0465 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , Y10T29/49126 , Y10T29/49144
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
摘要翻译： 焊料颗粒220沉积在位于衬底301上的直接芯片连接（DCA）部位的金属化触点上。触点302涂覆有一层焊剂303.拾取头211位于焊料颗粒220的贮存器201中 并且颗粒被吸引到头部的端部213中的孔。 孔具有对应于衬底上的金属化接触的覆盖区的布置。 头211定位成邻近衬底301并且颗粒220被释放。 颗粒220粘附到涂覆在触点302上的焊剂303上。颗粒被回流，平整并再次涂覆有焊剂。 然后将集成电路芯片放置在平整浮雕501上，并且浮雕再次回流以将芯片附接到触点302上。
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公开(公告)号：US5445313A
公开(公告)日：1995-08-29
申请号：US99689
申请日：1993-07-29
CPC分类号： H01L21/67144 , H01L21/4853 , H05K13/0465 , H05K3/3478 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , H05K3/3489
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
摘要翻译： 焊料颗粒220沉积在位于衬底301上的直接芯片连接（DCA）部位的金属化触点上。触点302涂覆有一层焊剂303.拾取头211位于焊料颗粒220的贮存器201中 并且颗粒被吸引到头部的端部213中的孔。 孔具有对应于衬底上的金属化接触的覆盖区的布置。 头211定位成邻近衬底301并且颗粒220被释放。 颗粒220粘附到涂覆在触点302上的焊剂303上。颗粒被回流，平整并再次涂覆有焊剂。 然后将集成电路芯片放置在平整浮雕501上，并且浮雕再次回流以将芯片附接到触点302上。
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