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公开(公告)号：US06254923B1
公开(公告)日：2001-07-03
申请号：US09099883
申请日：1998-01-12
IPC分类号： B05D512
CPC分类号： H01L21/67144 , H01L21/4853 , H01L2224/11334 , H01L2224/742 , H01L2924/01322 , H05K3/3478 , H05K3/3489 , H05K13/0465 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , Y10T29/49126 , Y10T29/49144
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
摘要翻译： 焊料颗粒220沉积在位于衬底301上的直接芯片连接（DCA）部位的金属化触点上。触点302涂覆有一层焊剂303.拾取头211位于焊料颗粒220的贮存器201中 并且颗粒被吸引到头部的端部213中的孔。 孔具有对应于衬底上的金属化接触的覆盖区的布置。 头211定位成邻近衬底301并且颗粒220被释放。 颗粒220粘附到涂覆在触点302上的焊剂303上。颗粒被回流，平整并再次涂覆有焊剂。 然后将集成电路芯片放置在平整浮雕501上，并且浮雕再次回流以将芯片附接到触点302上。
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公开(公告)号：US5570505A
公开(公告)日：1996-11-05
申请号：US455775
申请日：1995-05-31
IPC分类号： H05K1/11 , H01L25/04 , H01L25/18 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/42
CPC分类号： H05K1/141 , H05K3/403 , H05K2201/09181 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/42 , Y10T29/49144 , Y10T29/49165 , Y10T29/49789
摘要： A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic circuit assembly by connection pads 50, formed on the edge of the DCAM substrate 10. This enables easy visual inspection of solder joints between the DCAM and the assembly.DCAM substrates 10, are initially formed in a panel form 70, and vias 50, are drilled and filled with electrically conductive media 55, at predetermined connection points. The DCAM 10, is then excised from the parent panel 70, and the cut vias provide connection pads 55, along the edge of the substrate 10.
摘要翻译： 直接芯片连接模块（DCAM）10由在基板20上电连接到印刷电路40的一个或多个电子部件30组成.DCAM 10通过连接焊盘50结合到电子电路组件上， DCAM基板10的边缘。这使得能够容易地目视检查DCAM和组件之间的焊点。 DCAM基板10最初以面板形式70形成，并且在预定的连接点处钻出并填充有导电介质55的通孔50。 然后将DCAM 10从母板70切除，并且切割通孔沿着基板10的边缘提供连接焊盘55。
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公开(公告)号：US5471368A
公开(公告)日：1995-11-28
申请号：US254342
申请日：1994-06-03
IPC分类号： H05K1/11 , H01L25/04 , H01L25/18 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/42 , H05K7/02
CPC分类号： H05K1/141 , H05K3/403 , H05K2201/09181 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/42 , Y10T29/49144 , Y10T29/49165 , Y10T29/49789
摘要： A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic circuit assembly by connection pads 50, formed on the edge of the DCAM substrate 10. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 10, are initially formed in a panel form 70, and vias 50, are drilled and filled with electrically conductive media 55, at predetermined connection points. The DCAM 10, is then excised from the parent panel 70, and the cut vias provide connection pads 55, along the edge of the substrate 10.
摘要翻译： 直接芯片连接模块（DCAM）10由在基板20上电连接到印刷电路40的一个或多个电子部件30组成.DCAM 10通过连接焊盘50结合到电子电路组件上， DCAM基板10的边缘。这使得能够容易地目视检查DCAM和组件之间的焊点。 DCAM基板10最初以面板形式70形成，并且在预定的连接点处钻出并填充有导电介质55的通孔50。 然后将DCAM 10从母板70切除，并且切割通孔沿着基板10的边缘提供连接焊盘55。
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公开(公告)号：US5788143A
公开(公告)日：1998-08-04
申请号：US399265
申请日：1995-05-17
CPC分类号： H01L21/67144 , H01L21/4853 , H05K13/0465 , H05K3/3478 , H01L2224/11334 , H01L2224/742 , H01L2924/01322 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0485 , H05K2203/082 , H05K3/3489 , Y10T29/49126 , Y10T29/49144
摘要： Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.
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