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公开(公告)号：US4511403A
公开(公告)日：1985-04-16
申请号：US112781
申请日：1980-01-16
申请人： Alfred P. Orio , Leonard R. Levy , Michael Gulla
发明人： Alfred P. Orio , Leonard R. Levy , Michael Gulla
CPC分类号： C23C18/31
摘要： This invention is for an immersion tin plating composition capable of depositing tin over metallic surfaces displaceable by tin and to processes using the same. The composition is characterized by an inhibitor that improves the plating characteristics of the solution and permits an increased ratio of thiourea to tin at a relatively high tin concentration without formation of "black tin". The tin plating compositions of this invention are capable of providing an increased yield of good quality tin compared to prior art tin plating compositions.
摘要翻译： 本发明涉及一种浸锡电镀组合物，其能够在由锡可置换的金属表面上沉积锡，并使用该镀锡组合物。 组合物的特征在于改善溶液的电镀特性的抑制剂，并且允许在相对高的锡浓度下硫脲与锡的比例增加而不形成“黑锡”。 与现有技术的镀锡组合物相比，本发明的镀锡组合物能够提供优质锡的提高的产率。
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公开(公告)号：US4130454A
公开(公告)日：1978-12-19
申请号：US822002
申请日：1977-09-30
摘要： This invention is directed to an etchant and to a process for its use. The etchant comprises a synergistic combination of hydrogen peroxide and molybdenum as oxidants in acidic solution. The combination of oxidants provides for sustained etching at an exalted rate. The etchant is useful for etching metals, especially copper and its alloys, and is particularly useful in the manufacture of printed circuit boards.
摘要翻译： 本发明涉及一种蚀刻剂及其使用方法。 蚀刻剂包括作为氧化剂在酸性溶液中的过氧化氢和钼的协同组合。 氧化剂的组合提供以高达率的持续蚀刻。 蚀刻剂对于蚀刻金属，特别是铜及其合金是有用的，并且在印刷电路板的制造中特别有用。
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公开(公告)号：US4144119A
公开(公告)日：1979-03-13
申请号：US822003
申请日：1977-09-30
摘要： This invention is directed to an etchant and to a process for its use. The etchant comprises sulfuric acid activated with hydrogen peroxide or the synergistic combination of hydrogen peroxide and molybdenum. The etchant is characterized by a source of phosphate ions as an inhibitor against attack on tin, especially immersion tin, as well as several other metals such as nickel and alloys of nickel such as gold alloys. The etchant is especially useful for etching copper and its alloys in the presence of a tin etch resist, and therefore, provides a new procedure for the fabrication of printed circuit boards using immersion tin as an etch resist.
摘要翻译： 本发明涉及一种蚀刻剂及其使用方法。 蚀刻剂包括用过氧化氢活化的硫酸或过氧化氢和钼的协同组合。 蚀刻剂的特征在于磷酸根离子作为防止对锡的侵蚀的抑制剂，特别是浸锡，以及若干其它金属如镍和镍合金如金合金。 蚀刻剂对于在锡蚀刻抗蚀剂存在下蚀刻铜及其合金特别有用，因此提供了使用浸锡作为抗蚀剂制造印刷电路板的新方法。
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