公开(公告)号：US09865310B2

公开(公告)日：2018-01-09

申请号：US13404995

申请日：2012-02-24

申请人： Allan Cantle ,  Patrick Weber ,  Mark Gilliam ,  Prashant Joshi

发明人： Allan Cantle ,  Patrick Weber ,  Mark Gilliam ,  Prashant Joshi

IPC分类号： H05K1/11 ,  H05K1/14 ,  G11C5/04 ,  H05K3/34 ,  H01L25/065

CPC分类号： G11C5/04 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/2036 ,  H01L2924/00

摘要： Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array (FPGA), micro-processor (μP), or application-specific integrated circuit (ASIC). These interconnects provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.

公开(公告)号：US20050088201A1

公开(公告)日：2005-04-28

申请号：US10708753

申请日：2004-03-23

申请人： Malachy Devlin ,  Allan Cantle

发明人： Malachy Devlin ,  Allan Cantle

IPC分类号： G06F1/26 ,  H03K19/173

CPC分类号： G06F1/26

摘要： A module standard for integrated circuit such as FPGAs is provided in which power supply voltages for daughtercards are not fixed in advance. Instead programmable power supplies are provided and a method is provided in which each daughtercard can specify the required power supply voltage. Thus, unlike prior-art systems, this modular system is backward and forward compatible with chips, such as FPGAs, from many process generations allowing easy upgrading as new FPGA families become available. A motherboard or baseboard for use with this invention includes a plurality of module connectors into which compatible modules or “daughtercards” can be plugged and a plurality of programmable power supplies. In a preferred embodiment there are four sets of module connectors and sixteen programmable power supplies. This allows each module to have four independently specifiable power supply voltages. A module may also connect several power supplies together in order to obtain higher current at a single voltage. Various schemes are described to ensure that the programmable power supplies will never deliver too high a voltage to the components on the modules.

摘要翻译： 提供了诸如FPGA的集成电路的模块标准，其中子卡的电源电压不是预先固定的。 提供了相应的可编程电源，并且提供了一种方法，其中每个子卡可以指定所需的电源电压。 因此，与现有技术的系统不同，该模块化系统与许多过程代码的芯片（例如FPGA）向后和向前兼容，从而允许随着新的FPGA系列可用时的轻松升级。 用于本发明的主板或基板包括多个模块连接器，可插入兼容模块或“子卡”以及多个可编程电源。 在优选实施例中，存在四组模块连接器和十六个可编程电源。 这允许每个模块具有四个独立可指定的电源电压。 模块还可以将多个电源连接在一起，以便在单个电压下获得更高的电流。 描述了各种方案，以确保可编程电源不会向模块上的组件传递太高的电压。