公开(公告)号：US20250079061A1

公开(公告)日：2025-03-06

申请号：US18456666

申请日：2023-08-28

Applicant: Allegro MicroSystems, LLC

Inventor： Paul A. David ,  Maurizio Salato ,  Andrew Thompson ,  Joseph Duigan ,  Andrew Bernard Keogh ,  William P. Taylor

IPC: H01F27/24 ,  H01F1/147 ,  H01F27/28 ,  H01F41/00

Abstract: Aspects of the present disclosure include galvanically-isolated (voltage-isolated) transformer-based integrated circuit (IC) packages providing cavities or spaces for an included magnetic core to underdo size changes due to magnetostriction without being constrained or substantially constrained, thus, providing for improved magnetic performance. The circuits, ICs and IC packages and modules may include various types of circuits. In some examples, IC packages or modules may include a galvanically-isolated gate driver or other high voltage circuit.

公开(公告)号：US20240355797A1

公开(公告)日：2024-10-24

申请号：US18302998

申请日：2023-04-19

Applicant: Allegro MicroSystems, LLC

Inventor： Maurizio Salato ,  Joseph Duigan ,  Andrew Bernard Keogh ,  Andrew Thompson ,  William P. Taylor ,  Vijay Mangtani

IPC: H01L25/16 ,  H01F27/26 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L25/16 ,  H01F27/263 ,  H01F27/266 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49575 ,  H01F27/022 ,  H01F27/2823

Abstract: Systems, structures, circuits, and methods provide integrated circuit (IC) packages or modules having a transformer initially fabricated without a core. First and second semiconductor dies are disposed on a lead frame or other substrate. First and second coils are configured to about an aperture region. A hole or aperture may be formed in the IC package in the aperture region so a core may be placed and received in the aperture at a later time, e.g., such as after testing. The core may be a soft ferromagnetic material, e.g., metal, ferrite, and/or or a moldable material. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The IC packages and modules may include various types of circuits; in some examples, IC packages or modules may include a galvanically isolated gate driver or other high voltage circuit.

公开(公告)号：US20250112170A1

公开(公告)日：2025-04-03

申请号：US18477755

申请日：2023-09-29

Applicant: Allegro MicroSystems, LLC

Inventor： Andrew Thompson

IPC: H01L23/552 ,  H01F17/00 ,  H01F17/04 ,  H01L23/31

Abstract: Aspects of the present disclosure include galvanically-isolated (voltage-isolated) transformer-based integrated circuit (IC) packages providing cavities or spaces, which can, in some examples, be formed by preferentially heating the included magnetic core or a material coating the magnetic core. The provision of a space around the magnetic core allows the magnetic core to underdo size changes due to magnetostriction during use without being constrained or substantially constrained, thus, providing for improved magnetic performance. The circuits, ICs and IC packages and modules may include various types of circuits. In some examples, IC packages or modules may include a galvanically-isolated gate driver or other high voltage circuit.

公开(公告)号：US12132469B2

公开(公告)日：2024-10-29

申请号：US17336005

申请日：2021-06-01

Applicant: Allegro MicroSystems, LLC

Inventor： Andrew Thompson ,  Joe Duigan ,  Karl Rinne

IPC: H01F27/28 ,  H01F5/04 ,  H01F17/00 ,  H01F27/00 ,  H01F27/02 ,  H01F27/40 ,  H01F41/04 ,  H03K17/0424 ,  H03K17/691

CPC classification number: H03K17/0424 ,  H01F5/04 ,  H01F17/00 ,  H01F27/00 ,  H01F27/02 ,  H01F27/027 ,  H01F27/28 ,  H01F27/2895 ,  H01F27/40 ,  H01F41/04 ,  H03K17/691

Abstract: The present application provides a packaged gate drive circuit having a transformer. The transformer which is used to transfer both signals and power from a primary side to a secondary side. The windings of the transformer are formed using a combination of tracks and wirebond wires. The transformer is positioned in a well formed using a first insulating material and covered with a second insulating material.