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    Determining locations on a wafer to be reviewed during defect review
    3.
    发明授权
    Determining locations on a wafer to be reviewed during defect review 有权
    确定在缺陷审查期间待审查的晶圆上的位置

    公开(公告)号：US07904845B2

    公开(公告)日：2011-03-08

    申请号：US11950961

    申请日：2007-12-05

    申请人： Christophe Fouquet ,  Gordon Abbott ,  Ellis Chang ,  Zain K. Saidin

    发明人： Christophe Fouquet ,  Gordon Abbott ,  Ellis Chang ,  Zain K. Saidin

    IPC分类号： G06F17/50

    CPC分类号： G03F1/84 ,  G03F7/7065

    摘要： Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. The defects do not include defects detected on the wafer. The method also includes determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.

    摘要翻译： 提供了各种方法，设计，缺陷评估工具和用于在缺陷评估期间确定待检查的晶片上的位置的系统。 一种计算机实现的方法包括获取由两个或更多个检查系统检测到的缺陷的坐标。 缺陷不包括在晶片上检测到的缺陷。 该方法还包括通过将缺陷的坐标转换为晶片上的坐标来确定在缺陷审查期间待审查的晶片上的位置的坐标，使得可以使用在位置处执行的缺陷评估的结果来确定是否 缺陷导致晶片上的系统缺陷。

    METHODS, DESIGNS, DEFECT REVIEW TOOLS, AND SYSTEMS FOR DETERMINING LOCATIONS ON A WAFER TO BE REVIEWED DURING DEFECT REVIEW
    4.
    发明申请
    METHODS, DESIGNS, DEFECT REVIEW TOOLS, AND SYSTEMS FOR DETERMINING LOCATIONS ON A WAFER TO BE REVIEWED DURING DEFECT REVIEW 有权
    方法，设计，缺陷评估工具和系统，用于确定在缺陷评估期间待审查的水平位置

    公开(公告)号：US20080163140A1

    公开(公告)日：2008-07-03

    申请号：US11950961

    申请日：2007-12-05

    申请人： Christophe Fouquet ,  Gordon Abbott ,  Ellis Chang ,  Zain K. Saidin

    发明人： Christophe Fouquet ,  Gordon Abbott ,  Ellis Chang ,  Zain K. Saidin

    IPC分类号： G06F17/50

    CPC分类号： G03F1/84 ,  G03F7/7065

    摘要： Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. The defects do not include defects detected on the wafer. The method also includes determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.

    摘要翻译： 提供了各种方法，设计，缺陷评估工具和用于在缺陷评估期间确定待检查的晶片上的位置的系统。 一种计算机实现的方法包括获取由两个或更多个检查系统检测到的缺陷的坐标。 缺陷不包括在晶片上检测到的缺陷。 该方法还包括通过将缺陷的坐标转换为晶片上的坐标来确定在缺陷审查期间待审查的晶片上的位置的坐标，使得可以使用在位置处执行的缺陷检查的结果来确定是否 缺陷导致晶片上的系统缺陷。

    Use of design information and defect image information in defect classification
    5.
    发明授权
    Use of design information and defect image information in defect classification 有权
    在缺陷分类中使用设计信息和缺陷图像信息

    公开(公告)号：US08175373B2

    公开(公告)日：2012-05-08

    申请号：US12371863

    申请日：2009-02-16

    申请人： Gordon Abbott ,  Christophe Fouquet ,  Ori Tadmor ,  Takuji Tada

    发明人： Gordon Abbott ,  Christophe Fouquet ,  Ori Tadmor ,  Takuji Tada

    IPC分类号： G06K9/00

    CPC分类号： G06T7/0006 ,  G06K2209/19 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： Defects observed by imaging tools may be classified by automatic comparison of features observed in a defect image with design information relating to corresponding portions of the image. Defect information may be generated from a defect image from a defect imaging tool. Design information relating to one or more structures to be formed on the substrate in a vicinity of the defect may be retrieved. The defect may be classified based on a combination of the defect information from the defect image and design information relating to one or more structures to be formed on the substrate in the vicinity of the defect.

    摘要翻译： 通过成像工具观察到的缺陷可以通过将缺陷图像中观察到的特征与与图像的对应部分有关的设计信息进行自动比较来分类。 可以从缺陷成像工具的缺陷图像生成缺陷信息。 可以检索与在缺陷附近形成在基板上的一个或多个结构相关的设计信息。 可以基于来自缺陷图像的缺陷信息和与要在缺陷附近的基板上形成的一个或多个结构相关的设计信息的组合来分类缺陷。

    USE OF DESIGN INFORMATION AND DEFECT IMAGE INFORMATION IN DEFECT CLASSIFICATION
    6.
    发明申请
    USE OF DESIGN INFORMATION AND DEFECT IMAGE INFORMATION IN DEFECT CLASSIFICATION 有权
    设计信息的使用和缺陷分类中的图像信息缺陷

    公开(公告)号：US20100208979A1

    公开(公告)日：2010-08-19

    申请号：US12371863

    申请日：2009-02-16

    申请人： Gordon Abbott ,  Christophe Fouquet ,  Ori Tadmor ,  Takuji Tada

    发明人： Gordon Abbott ,  Christophe Fouquet ,  Ori Tadmor ,  Takuji Tada

    IPC分类号： G06K9/00 ,  G06K9/62

    CPC分类号： G06T7/0006 ,  G06K2209/19 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： Defects observed by imaging tools may be classified by automatic comparison of features observed in a defect image with design information relating to corresponding portions of the image. Defect information may be generated from a defect image from a defect imaging tool. Design information relating to one or more structures to be formed on the substrate in a vicinity of the defect may be retrieved. The defect may be classified based on a combination of the defect information from the defect image and design information relating to one or more structures to be formed on the substrate in the vicinity of the defect.

    摘要翻译： 通过成像工具观察到的缺陷可以通过将缺陷图像中观察到的特征与与图像的对应部分有关的设计信息进行自动比较来分类。 可以从缺陷成像工具的缺陷图像生成缺陷信息。 可以检索与在缺陷附近形成在基板上的一个或多个结构相关的设计信息。 可以基于来自缺陷图像的缺陷信息和与要在缺陷附近的基板上形成的一个或多个结构相关的设计信息的组合来分类缺陷。