Electronic circuit unit having mounting structure with high soldering reliability
    1.
    发明申请
    Electronic circuit unit having mounting structure with high soldering reliability 审中-公开
    电子电路单元具有焊接可靠性高的安装结构

    公开(公告)号:US20040207975A1

    公开(公告)日:2004-10-21

    申请号:US10823209

    申请日:2004-04-13

    Abstract: An electronic circuit unit contains a circuit board having an upper face on which electronic components are mounted and a lower face having a plurality of first land portions, and a connector member disposed at a lower portion of the circuit board, wherein the connector member has an insulating resin portion, a metallic shield plate embedded in the insulating resin portion, and connector terminals which are provided with first terminals protruding from an upper face of the insulating resin portion and second terminals protruding from a lower face of the insulating resin portion, and the connector terminals are configured such that the first terminals over the upper face are electrically connected to the first land portions and the second terminals over the lower face are electrically connectable to second land portions of a mother substrate.

    Abstract translation: 电子电路单元包括具有安装电子部件的上表面的电路板和具有多个第一接地部的下表面,以及设置在电路板的下部的连接器部件,其中,连接器部件具有 绝缘树脂部分,嵌入在绝缘树脂部分中的金属屏蔽板以及连接器端子,其连接器端子设置有从绝缘树脂部分的上表面突出的第一端子和从绝缘树脂部分的下表面突出的第二端子, 连接器端子构造成使得上表面上的第一端子电连接到第一接地部分,并且在下表面上的第二端子可电连接到母板的第二接地部分。

    Miniaturized transmitter-receiver unit
    2.
    发明申请
    Miniaturized transmitter-receiver unit 失效
    小型发射机 - 接收机组

    公开(公告)号:US20030027532A1

    公开(公告)日:2003-02-06

    申请号:US10195202

    申请日:2002-07-15

    CPC classification number: H04B1/408 H05K1/16

    Abstract: A transmitter-receiver unit has an antenna patch and an IF circuit, between which there is a large frequency difference, on a first side of a multilayer substrate. A high frequency circuit (including a local oscillator and a demodulation unit) except for the IF circuit is provided on a second side of the multilayer substrate. A ground conductive pattern is provided in the interior of the multilayer substrate. The circuit conductive pattern exposed at the second side of the multilayer substrate and a feeding point of the antenna patch conduct to each other through a through hole.

    Abstract translation: 发射机 - 接收机单元在多层基板的第一侧上具有天线贴片和IF电路,在其间具有大的频率差。 除了IF电路之外的高频电路(包括本地振荡器和解调单元)设置在多层基板的第二侧。 在多层基板的内部设置接地导电图案。 在多层基板的第二面露出的电路导电图案和天线贴片的馈电点通过通孔相互导电。

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