Abstract:
An electronic circuit unit contains a circuit board having an upper face on which electronic components are mounted and a lower face having a plurality of first land portions, and a connector member disposed at a lower portion of the circuit board, wherein the connector member has an insulating resin portion, a metallic shield plate embedded in the insulating resin portion, and connector terminals which are provided with first terminals protruding from an upper face of the insulating resin portion and second terminals protruding from a lower face of the insulating resin portion, and the connector terminals are configured such that the first terminals over the upper face are electrically connected to the first land portions and the second terminals over the lower face are electrically connectable to second land portions of a mother substrate.
Abstract:
A transmitter-receiver unit has an antenna patch and an IF circuit, between which there is a large frequency difference, on a first side of a multilayer substrate. A high frequency circuit (including a local oscillator and a demodulation unit) except for the IF circuit is provided on a second side of the multilayer substrate. A ground conductive pattern is provided in the interior of the multilayer substrate. The circuit conductive pattern exposed at the second side of the multilayer substrate and a feeding point of the antenna patch conduct to each other through a through hole.