公开(公告)号：US20160260546A1

公开(公告)日：2016-09-08

申请号：US15059047

申请日：2016-03-02

Applicant: TDK CORPORATION

Inventor： Masahiro MORI ,  Takayuki SAKAI ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/12

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/301 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a chip component and an external terminal. The external terminal includes a terminal electrode connection part, a mounting connection part, and a support part. The terminal electrode connection part is arranged to face an end surface electrode part of a terminal electrode of the chip component. The mounting connection part is connectable to a mounting surface. The support part faces one side surface of an element body of the chip component closest to the mounting surface so as to support the one side surface spaced from the mounting surface. A bonding region and a non-bonding region are formed between the terminal electrode connection part of the external terminal and the end surface electrode part of the terminal electrode. The non-bonding region is formed from the terminal electrode connection part to the support part.

Abstract translation: 电子设备包括芯片组件和外部终端。 外部端子包括端子电极连接部，安装连接部和支撑部。 端子电极连接部被配置为与芯片部件的端子电极的端面电极部相对。 安装连接部分可连接到安装表面。 支撑部分面向最靠近安装表面的芯片部件的元件主体的一个侧表面，以支撑与安装表面间隔开的一个侧表面。 在外部端子的端子电极连接部和端子电极的端面电极部之间形成接合区域和非接合区域。 非接合区域由端子电极连接部分形成到支撑部分。

公开(公告)号：US09224563B2

公开(公告)日：2015-12-29

申请号：US14190299

申请日：2014-02-26

Applicant: DENSO CORPORATION ,  Murata Manufacturing Co., Ltd.

Inventor： Toru Itabashi ,  Yuki Mikami ,  Ryoichi Shiraishi ,  Akihiro Yanagisawa ,  Shigeki Nishiyama

IPC: H02B1/18 ,  H01H85/02 ,  H01H85/50 ,  H01H85/46 ,  H01G2/16 ,  H01H69/02 ,  H01G2/18 ,  H01H85/48 ,  H05K1/18 ,  H05K1/02 ,  H02H5/04 ,  H01G2/00 ,  H02B1/04 ,  H01H39/00 ,  H01H73/24 ,  H01H71/10 ,  H05K3/34 ,  H01H85/10

CPC classification number: H01H85/0241 ,  H01G2/16 ,  H01G2/18 ,  H01H69/022 ,  H01H85/10 ,  H01H85/463 ,  H01H85/48 ,  H01H85/50 ,  H01H2085/0275 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10181 ,  H05K2201/10454 ,  H05K2201/10946

Abstract: A main body of an electronic part is formed in a rectangular pillared shape having a first and a second axial end surface. A first electrode is formed on the first axial end surface electrically and mechanically connected to a first wiring pattern formed on a board surface of a printed board. A second electrode is formed on the second axial end surface, to which one end of a fuse terminal is electrically connected. The other end of the fuse terminal is connected to a second wiring pattern of the printed board or a wiring member which is formed as an independent member from the printed board. A cut-off portion is formed in a connecting portion of the fuse terminal.

Abstract translation: 电子部件的主体形成为具有第一和第二轴向端面的矩形柱状。 第一电极形成在第一轴向端面上，电和机械地连接到形成在印刷电路板的电路板表面上的第一布线图案。 第二电极形成在第二轴向端面上，熔丝端子的一端电连接到该第二电极。 熔丝端子的另一端连接到印刷电路板的第二布线图案或与印刷电路板形成为独立构件的布线构件。 在熔丝端子的连接部分形成有切断部分。

公开(公告)号：US20150289369A1

公开(公告)日：2015-10-08

申请号：US14435686

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K1/09 ,  H05K1/18 ,  H05K1/02 ,  H01L23/495 ,  H05K1/05

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract translation: 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。

公开(公告)号：US09119320B2

公开(公告)日：2015-08-25

申请号：US13783722

申请日：2013-03-04

Applicant: Quanta Computer Inc.

Inventor： Li-Cheng Shen

IPC: H05K1/18 ,  H05K13/00 ,  H01L23/13 ,  H01L25/16 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49551 ,  H01L23/49805 ,  H01L23/49827 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/182 ,  H05K1/184 ,  H05K3/3426 ,  H05K3/3436 ,  H05K13/00 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board.

Abstract translation: 公开了一种印刷电路板组件，其包括包括至少一个开口的印刷电路板和封装组件中的系统，其中封装组件中的系统包括封装模块中的系统和与封装模块中的系统结合的引线框架。 引线框架包括多个引脚。 封装组件中的系统嵌入印刷电路板的开口中。

公开(公告)号：US20140185214A1

公开(公告)日：2014-07-03

申请号：US13731127

申请日：2012-12-31

Applicant: Zhen Jia

Inventor： Zhen Jia

IPC: H05K7/20 ,  H05K3/34 ,  G06F1/18

CPC classification number: H05K7/20127 ,  G06F1/185 ,  G06F1/188 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y10T29/49144

Abstract: Disclosed are a method, system, and/or apparatus to stack a processor power module on a populated printed circuit board. A stacked processor power module includes a bare printed circuit board comprising a top surface and a bottom surface. The stacked processor power module also includes a first pair of metal lead legs coupled to an upper region of the bottom surface of the bare printed circuit board and a second pair of metal lead legs coupled to a lower region of the bottom surface of the bare printed circuit board. An integrated circuit board assembly includes a populated printed circuit board having a mounting region upon which to stack the stacked processor power module above the mounting region of the populated printed circuit board by coupling the first pair of metal lead legs and the second pair of metal lead legs to the mounting region.

Abstract translation: 公开了一种在填充的印刷电路板上堆叠处理器电源模块的方法，系统和/或装置。 堆叠的处理器电源模块包括裸露的印刷电路板，其包括顶表面和底表面。 堆叠的处理器功率模块还包括耦合到裸露印刷电路板的底表面的上部区域的第一对金属引线脚和耦合到裸露印刷电路板的底部表面的下部区域的第二对金属引脚 电路板。 集成电路板组件包括具有安装区域的填充印刷电路板，在该安装区域上，通过将第一对金属引线脚和第二对金属引线耦合在堆叠的处理器电源模块上而在堆叠的印刷电路板的安装区域上方 腿到安装区域。

公开(公告)号：US20130271924A1

公开(公告)日：2013-10-17

申请号：US13783722

申请日：2013-03-04

Applicant: QUANTA COMPUTER INC.

Inventor： Li-Cheng Shen

IPC: H05K1/18 ,  H05K13/00

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49551 ,  H01L23/49805 ,  H01L23/49827 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/182 ,  H05K1/184 ,  H05K3/3426 ,  H05K3/3436 ,  H05K13/00 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board

Abstract translation: 公开了一种印刷电路板组件，其包括包括至少一个开口的印刷电路板和封装组件中的系统，其中封装组件中的系统包括封装模块中的系统和与封装模块中的系统结合的引线框架。 引线框架包括多个引脚。 封装组件中的系统嵌入印刷电路板的开口中

公开(公告)号：US20120262838A1

公开(公告)日：2012-10-18

申请号：US13534000

申请日：2012-06-27

Applicant: Hideki OTSUKA ,  Kazuhiro YOSHIDA

Inventor： Hideki OTSUKA ,  Kazuhiro YOSHIDA

IPC: H01G4/228

CPC classification number: H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10636 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: In a ceramic capacitor, first and second electrode terminals each include a bonded-to-substrate portion, a first bonded-to-electrode portion bonded to a first edge of one of first and second external electrodes, a second bonded-to-electrode portion bonded to a second edge of the one of first and second external electrodes and disposed at a distance from the first bonded-to-electrode portion in the first directions, and a connecting portion connecting the first and second bonded-to-electrode portions and the bonded-to-substrate portion. W1/W0 is about 0.3 or more, and h/L is about 0.1 or more.

Abstract translation: 在陶瓷电容器中，第一和第二电极端子各自包括接合到衬底部分，第一接合电极部分接合到第一和第二外部电极之一的第一边缘，第二接合电极部分 接合到第一外部电极和第二外部电极中的一个的第二边缘并且在第一方向上与第一接合电极部分设置一定距离，以及连接第一和第二接合电极部分和第二接合电极部分的连接部分， 键合到衬底部分。 W1 / W0为约0.3以上，h / L约为0.1以上。

公开(公告)号：US20120012365A1

公开(公告)日：2012-01-19

申请号：US13107911

申请日：2011-05-14

Applicant: GABE CHERIAN ,  Don Ellison Saunders

Inventor： GABE CHERIAN ,  Don Ellison Saunders

IPC: H05K1/00

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling and thermal fluctuations. The invention more specifically shows certain improvements related to its mother patent application, called Thermal Flex Contact Carrier (TFCC), where the improvements allow the height of the contact elements to be now not restricted anymore by the size of the spaces or distances between the contact pads of the devices to be attached together. Certain improvements to the carrier wafer are also shown.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环和热波动的不期望的影响的手段和方法。 本发明更具体地示出了与其母版专利申请（称为热弹性接触载体（TFCC））相关的某些改进，其中改进使得接触元件的高度现在不再受限于接触的空间或距离之间的距离 要连接在一起的设备的垫。 还示出了对载体晶片的某些改进。

公开(公告)号：US20100193939A1

公开(公告)日：2010-08-05

申请号：US12686590

申请日：2010-01-13

Applicant: Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi

Inventor： Yuichi TAGUCHI ,  Akinori Shiraishi ,  Mitsutoshi Higashi

IPC: H01L23/48 ,  H01L23/488

CPC classification number: B81B7/0074 ,  H01L24/16 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10454 ,  H05K2201/10727 ,  H05K2201/10946 ,  H01L2924/00 ,  H01L2224/48

Abstract: A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.

Abstract translation: 布线基板包括硅基板，形成为在厚度方向上穿透硅基板的通孔，形成在硅基板的两个表面和侧表面上的绝缘层和通孔的内表面，形成在 所述通孔，形成在所述硅衬底的至少一个表面上并连接到所述穿透电极的布线层和连接到所述布线层并形成为从所述硅衬底的一个表面延伸到其侧表面的金属线端子 。 电子装置的侧面上的金属线端子与安装基板连接，使得其中电子部件安装在布线基板上的电子装置的基板方向与安装基板的基板方向正交地交叉。

公开(公告)号：US20080291602A1

公开(公告)日：2008-11-27

申请号：US11753090

申请日：2007-05-24

Applicant: Daniel Devoe

Inventor： Daniel Devoe

IPC: H01G4/232 ,  B23P19/00

CPC classification number: H01G4/232 ,  H01G4/38 ,  H01G13/006 ,  H05K1/0203 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10469 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10659 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/53174

Abstract: A capacitor device, which is mountable on a substrate, has an electrically conductive bottom lead frame with a bottom plate mountable substantially parallel to, and in contact with, the substrate and an electrically conductive top lead frame having a top plate spaced apart from the bottom plate and a first transition portion having a first end connected to the top plate and a second end, opposite the first end, electrically connectable to the substrate. Multilayer capacitors are mounted between the top plate and the bottom plate. The capacitors have opposed end terminations electrically connected to the top and bottom plates, such that internal electrode plates are substantially nonparallel to the substrate.

Abstract translation: 可安装在基板上的电容器装置具有导电底部引线框架，其具有可安装为基本上平行于基板并与其接触的底板，以及导电顶部引线框架，其具有与底部间隔开的顶板 板和第一过渡部分，其具有连接到顶板的第一端和与第一端相对的第二端，其可电连接到基板。 多层电容器安装在顶板和底板之间。 电容器具有电连接到顶板和底板的相对端端，使得内部电极板基本上不平行于衬底。