公开(公告)号：US20240276632A1

公开(公告)日：2024-08-15

申请号：US18625063

申请日：2024-04-02

申请人： CelLink Corporation

发明人： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Dongao Yang ,  Michael Lawrence Miller ,  Paul Henry Lego

IPC分类号： H05K1/02 ,  H01M50/519 ,  H05K1/11 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/44 ,  H05K3/46

CPC分类号： H05K1/0201 ,  H01M50/519 ,  H05K1/118 ,  H05K3/007 ,  H05K3/0073 ,  H05K3/06 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4623 ,  H05K3/046 ,  H05K3/064 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10037 ,  H05K2203/066 ,  Y02E60/10 ,  Y10T29/49156

摘要： A method of forming a flexible interconnect circuit is described. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

公开(公告)号：US20190254164A1

公开(公告)日：2019-08-15

申请号：US16252013

申请日：2019-01-18

申请人： FUJITSU LIMITED

发明人： Toshiki Iwai ,  Taiji Sakai

IPC分类号： H05K1/11 ,  H05K1/05 ,  H05K1/02 ,  H05K3/44 ,  H05K3/32 ,  H05K3/46

CPC分类号： H05K1/115 ,  H05K1/0298 ,  H05K1/056 ,  H05K3/32 ,  H05K3/445 ,  H05K3/46

摘要： A circuit board includes a first substrate of a fragile material, a first through-hole formed in the first substrate for allowing a screw for fixing the first substrate to a supporting body to be inserted through the first through-hole, a first step formed at an outer edge of a first region surrounding the first through-hole in the first substrate, and a second step formed along a direction from the first through-hole to the first step in the first region of the first substrate.

公开(公告)号：US20180146550A1

公开(公告)日：2018-05-24

申请号：US15557438

申请日：2016-03-11

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Markus MAIER

IPC分类号： H05K1/05 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K3/44

CPC分类号： H05K1/05 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/053 ,  H05K1/056 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/445 ,  H05K3/46 ,  H05K3/4608 ,  H05K2201/09509 ,  H05K2201/09554

摘要： A printed circuit board is provided which comprises a core layer of a conductive metal having a thickness between 30 micrometer and 120 micrometer, an upper dielectric layer and a lower dielectric layer sandwiching the core layer; an upper conductive layer arranged above the upper dielectric layer and a lower conductive layer arranged below the lower dielectric layer; at least one via passing from the upper conductive layer to the lower conductive layer and filled at least partially with the dielectric material of the upper and/or lower dielectric layer; and at least one and blind via, connecting the upper conductive layer with the core layer.

公开(公告)号：US20160276257A1

公开(公告)日：2016-09-22

申请号：US15159323

申请日：2016-05-19

申请人： DAI NIPPON PRINTING CO., LTD.

发明人： Satoru KURAMOCHI ,  Sumio KOIWA ,  Hidenori YOSHIOKA

IPC分类号： H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/13 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/065 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0665 ,  H01L2924/07025

摘要： A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

摘要翻译： 通孔电极基板包括基板，该基板包括从第一表面的第一孔到第二表面的第二孔延伸的通孔，第二孔的面积大于第一孔的面积， 所述孔在所述第一孔和所述第二孔之间具有最小孔径部分，其中在平面视图中，所述通孔中的所述最小孔径部分的面积在所述通孔的多个区域中最小， 并且与暴露于第一表面和第二表面之一的填料接触的至少一个气体排出构件。

公开(公告)号：US20160143132A1

公开(公告)日：2016-05-19

申请号：US14937625

申请日：2015-11-10

申请人： Samsung Electro-Mechanics Co., Ltd

发明人： Tae-Hong MIN ,  Myung-Sam KANG ,  Jung-Han LEE ,  Young-Gwan KO

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K1/11

CPC分类号： H05K1/0207 ,  H05K1/0272 ,  H05K3/002 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/064 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1105 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1572 ,  H05K2203/308

摘要： A circuit board includes: a core portion comprising a fluid path, the fluid path being open toward an outside of the circuit board to allow a fluid outside the circuit board to pass through the fluid path; and insulation layers disposed above and below the core portion.

摘要翻译： 电路板包括：芯部，包括流体路径，所述流体路径朝向所述电路板的外部开口，以允许所述电路板外部的流体通过所述流体路径; 以及设置在芯部上方和下方的绝缘层。

公开(公告)号：US09313903B2

公开(公告)日：2016-04-12

申请号：US13142113

申请日：2009-12-24

申请人： Sohei Samejima ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

发明人： Sohei Samejima ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

IPC分类号： H05K3/46 ,  H05K3/44 ,  H05K3/42

CPC分类号： H05K3/445 ,  H05K3/0011 ,  H05K3/40 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09809

摘要： A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.

摘要翻译： 制造印刷电路板（10）的方法包括以下步骤：形成包括具有初级通孔（3a）的碳纤维增强塑料的芯体; 在所述芯的下表面上形成第一粘合构件（4a）以覆盖所述主通孔（3a）; 将绝缘构件加载到所述主通孔（3a）中; 在所述芯的上表面上形成第二粘合构件（4b）; 在所述第一粘合部件（4a）的下方形成第三粘接部件（6a）。 在第二粘合部件（4b）上形成第四粘合部件（6b）; 并在芯上形成互连。

公开(公告)号：US20160066431A1

公开(公告)日：2016-03-03

申请号：US14938354

申请日：2015-11-11

申请人： Mitsubishi Electric Corporation

发明人： Sohei SAMEJIMA ,  Tsuyoshi OZAKI ,  Hiroyuki OSUGA ,  Teruhiko KUMADA

IPC分类号： H05K3/00 ,  H05K3/40

CPC分类号： H05K3/445 ,  H05K3/0011 ,  H05K3/02 ,  H05K3/40 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09809

摘要： A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.

摘要翻译： 制造印刷电路板（10）的方法包括以下步骤：形成包括具有主通孔（3a）的碳纤维增强塑料的芯体; 在所述芯的下表面上形成第一粘合构件（4a）以覆盖所述主通孔（3a）; 将绝缘构件加载到所述主通孔（3a）中; 在所述芯的上表面上形成第二粘合构件（4b）; 在所述第一粘合部件（4a）的下方形成第三粘接部件（6a）。 在第二粘合部件（4b）上形成第四粘合部件（6b）; 并在芯上形成互连。

公开(公告)号：US20160037653A1

公开(公告)日：2016-02-04

申请号：US14699808

申请日：2015-04-29

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Dong Hun KANG ,  Joung Suk LEE

IPC分类号： H05K3/42 ,  H05K3/46 ,  H05K1/11

CPC分类号： H05K3/429 ,  H05K1/0225 ,  H05K1/115 ,  H05K3/445 ,  H05K2201/09509 ,  H05K2203/061

摘要： There are provided an insulating film, a printed circuit board including the insulating film, and a method of manufacturing the printed circuit board. The insulating film includes a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material.

摘要翻译： 提供绝缘膜，包括绝缘膜的印刷电路板以及制造印刷电路板的方法。 绝缘膜包括第一绝缘材料; 第二绝缘材料; 以及设置在所述第一绝缘材料和所述第二绝缘材料之间的金属薄膜。

公开(公告)号：US09173290B2

公开(公告)日：2015-10-27

申请号：US13552526

申请日：2012-07-18

申请人： William S. McKinley ,  Steve T. Nicholas ,  Jeffery A. Dean

发明人： William S. McKinley ,  Steve T. Nicholas ,  Jeffery A. Dean

IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K3/46 ,  H05K1/18 ,  H05K3/42 ,  H05K3/44

CPC分类号： H05K1/0353 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/183 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K3/4688 ,  H05K3/4697 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2203/049 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.

摘要翻译： 本发明涉及图1所示类型的印刷电路板（PWB）的制造方法。 1和所得的PWB。 这样的PWB包括第一衬底和第二衬底和金属层的交替层。 PWB的层2金属化是具有可配置的热膨胀系数（CTE）的复合工程金属材料的厚层，以提供相对于安装在PWB上的射频（RF）部件的CTE匹配，并且具有显着的散热 性能消散由RF组件产生的热量。 该复合金属层还为RF部件提供接地平面。

公开(公告)号：US20140174794A1

公开(公告)日：2014-06-26

申请号：US14061266

申请日：2013-10-23

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Joon Seok KANG ,  Kwang Jik Lee ,  Sang Hyun Shin ,  Hye Suk Shin

IPC分类号： H05K1/02 ,  C25D11/02

CPC分类号： C25D11/022 ,  C25D11/246 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/445 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2203/0315 ,  H05K2203/1147

摘要： A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material.

摘要翻译： 具有增强的绝缘电阻和导热性的散热基板及其制造方法。 散热基板的制造方法包括：准备金属基板; 在金属基板上进行阳极氧化处理以形成阳极氧化层; 用绝缘材料填充阳极氧化层的表面孔; 在阳极氧化层上形成金属布线层。 通过用绝缘材料填充在阳极氧化处理中形成的表面孔，可以获得高绝缘电阻和导热性。