公开(公告)号：US20050248270A1

公开(公告)日：2005-11-10

申请号：US10839513

申请日：2004-05-05

申请人： Amalkumar Ghosh ,  Michael Boroson ,  Fridrich Vazan ,  Joseph Yokajty ,  George Olin

发明人： Amalkumar Ghosh ,  Michael Boroson ,  Fridrich Vazan ,  Joseph Yokajty ,  George Olin

IPC分类号： H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H05B33/00 ,  H05B33/04

CPC分类号： H01L51/5259 ,  H01L27/3297 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5262

摘要： An encapsulated OLED device includes a substrate having a predetermined glass seal area and defining a sealed region and one or more OLED unit(s) provided over the substrate, each OLED unit having a light-emitting portion including at least one first electrode, at least one second electrode spaced from the first electrode, and an organic EL media layer provided between the first and second electrodes, wherein the light-emitting portion is provided within the sealed region. The device also includes an inorganic protection layer provided over the glass seal area and over at least a portion of the sealed region, a cover provided over the substrate and OLED unit(s), and sintered glass frit seal material provided in the glass seal area and in contact with both the cover and the inorganic protection layer to bond the cover to the inorganic protection layer and provide sealing against moisture penetration into the sealed region.

摘要翻译： 封装的OLED器件包括具有预定玻璃密封区域并限定密封区域的衬底和设置在衬底上的一个或多个OLED单元，每个OLED单元至少包括至少一个第一电极的发光部分 与第一电极间隔开的一个第二电极和设置在第一和第二电极之间的有机EL介质层，其中发光部分设置在密封区域内。 该装置还包括设置在玻璃密封区域上方以及至少一部分密封区域的无机保护层，设置在基板和OLED单元上的盖，以及设置在玻璃密封区域中的烧结玻璃料密封材料 并且与盖和无机保护层接触以将盖粘合到无机保护层并提供密封以防止湿气渗透到密封区域中。

公开(公告)号：US20050212419A1

公开(公告)日：2005-09-29

申请号：US10807486

申请日：2004-03-23

申请人： Fridrich Vazan ,  Amalkumar Ghosh ,  George Olin ,  Jeffrey Serbicki ,  Joseph Yokajty ,  Steven Van Slyke

发明人： Fridrich Vazan ,  Amalkumar Ghosh ,  George Olin ,  Jeffrey Serbicki ,  Joseph Yokajty ,  Steven Van Slyke

IPC分类号： H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H05B33/00

CPC分类号： H01L51/5256 ,  H01L27/3244 ,  H01L27/3281 ,  H01L51/56

摘要： A method of encapsulating a plurality of OLED devices formed on a common substrate includes stacking a number of repeating assemblies of patterned layers over the OLED devices while leaving outermost portions of electrical interconnects of such encapsulated devices accessible for connecting electrical leads thereto.

摘要翻译： 封装形成在公共衬底上的多个OLED器件的方法包括在OLED器件上堆叠多个图案化层的重复组件，同时留下这种封装器件的电互连件的最外部分，用于连接电引线。