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公开(公告)号：US20210398940A1
公开(公告)日：2021-12-23
申请号：US16908928
申请日：2020-06-23
发明人： Min Ho Kim , Seok Ho Na , Dong Hyeon Park , Choong Hoe Kim , Woo Kyung Ju , Yun Seok Song , Dong Su Ryu
IPC分类号： H01L23/00
摘要： In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US11749637B2
公开(公告)日：2023-09-05
申请号：US16908928
申请日：2020-06-23
发明人： Min Ho Kim , Seok Ho Na , Dong Hyeon Park , Choong Hoe Kim , Woo Kyung Ju , Yun Seok Song , Dong Su Ryu
IPC分类号： B23K26/50 , H01L23/00 , B23K101/40
CPC分类号： H01L24/81 , B23K26/50 , H01L24/75 , B23K2101/40 , H01L2224/75263 , H01L2224/81048 , H01L2224/81201 , H05K2201/068
摘要： In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20230088061A1
公开(公告)日：2023-03-23
申请号：US18071318
申请日：2022-11-29
发明人： Dong Hyeon Park , Min Ho Kim , Dong Su Ryu , Seok Ho Na , Choong Hoe Kim , Yun Seok Song , Woo Kyung Ju , Dong Joo Park
IPC分类号： H01L23/00 , B23K1/005 , B23K26/067 , B23K26/06
摘要： In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20240162113A1
公开(公告)日：2024-05-16
申请号：US17985476
申请日：2022-11-11
发明人： Dong Hyeon Park , Yun Ah Kim , Seok Ho Na , Won Ho Choi , Dong Su Ryu , Jo Hyun Bae , Min Jae Kong , Jin Young Khim , Jae Yeong Bae , Dong Hee Kang
IPC分类号： H01L23/42 , H01L21/52 , H01L21/56 , H01L23/00 , H01L23/053 , H01L23/367 , H01L23/498
CPC分类号： H01L23/42 , H01L21/52 , H01L21/563 , H01L23/053 , H01L23/3672 , H01L23/49822 , H01L23/562 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204
摘要： In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20230411342A1
公开(公告)日：2023-12-21
申请号：US18240966
申请日：2023-08-31
发明人： Dong Hyeon Park , Min Ho Kim , Dong Su Ryu , Seok Ho Na , Choong Hoe Kim , Yun Seok Song , Woo Kyung Ju , Dong Joo Park
IPC分类号： H01L23/00 , B23K1/005 , B23K26/067 , B23K26/06
CPC分类号： H01L24/75 , H01L24/81 , B23K1/0056 , B23K26/067 , B23K26/0604 , B23K2101/40
摘要： In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20210398936A1
公开(公告)日：2021-12-23
申请号：US17244463
申请日：2021-04-29
发明人： Dong Hyeon Park , Min Ho Kim , Dong Su Ryu , Seok Ho Na , Choong Hoe Kim , Yun Seok Song , Woo Kyung Ju
摘要： In one example, a system can comprise a laser assisted bonding (LAB) tool comprising a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component comprising a first interconnect. The laser source can be configured to emit a first laser towards the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.
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