公开(公告)号：US11121094B2

公开(公告)日：2021-09-14

申请号：US16447222

申请日：2019-06-20

申请人： AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.

发明人： Yoshio Matsuda ,  Kenji Nishikawa ,  Seiichiro Sato ,  Yoshihiko Ikemoto

IPC分类号： H01L23/552 ,  H01L21/48 ,  H01L23/495

摘要： A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

公开(公告)号：US11715676B2

公开(公告)日：2023-08-01

申请号：US17155248

申请日：2021-01-22

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Kenji Nishikawa

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49524 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/37011 ,  H01L2224/40245 ,  H01L2224/84815

摘要： A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die. An electronic device is attached to the die pad top side. A conductive clip is connected to the substrate and the electronic device, and the conductive clip comprises a plate portion attached to the device top side with a conductive material, a clip connecting portion connected to the plate portion and the lead, and channels disposed to extend inward from a lower side of the plate portion above the device top side. The conductive material is disposed within the channels. In another example, the plate portion comprises a lower side having a first sloped profile in a first cross-sectional view such that an outer section of the first sloped profile towards a first edge portion of the plate portion is spaced away from the electronic device further than an inner section of the first sloped profile towards a central portion of the plate portion. Other examples and related methods are also disclosed herein.