公开(公告)号：US11712516B2

公开(公告)日：2023-08-01

申请号：US16851798

申请日：2020-04-17

Applicant: Analog Devices, Inc.

Inventor： David Frank Bolognia ,  Brian Hall

IPC: A61M5/148 ,  A61M5/315 ,  A61M5/142 ,  A61M5/145

CPC classification number: A61M5/1483 ,  A61M5/14244 ,  A61M5/14593 ,  A61M5/31586 ,  A61M2005/14204 ,  A61M2005/14513 ,  A61M2205/0272 ,  A61M2205/3334

Abstract: A substance delivery device is disclosed. The substance delivery device includes a lever that includes a drive arm that is rotatable about a pivot. The substance delivery device also includes a pump that has a deformable chamber. The deformable chamber is configured to rotate the drive arm about the pivot towards a container so as to deform the container to drive a fluid substance from the container.

公开(公告)号：US20210322681A1

公开(公告)日：2021-10-21

申请号：US16851798

申请日：2020-04-17

Applicant: Analog Devices, Inc.

Inventor： David Frank Bolognia ,  Brian Hall

IPC: A61M5/315 ,  A61M5/145 ,  A61M5/142

Abstract: A substance delivery device is disclosed. The substance delivery device includes a lever that includes a drive arm that is rotatable about a pivot. The substance delivery device also includes a pump that has a deformable chamber. The deformable chamber is configured to rotate the drive arm about the pivot towards a container so as to deform the container to drive a fluid substance from the container.

公开(公告)号：US10732265B1

公开(公告)日：2020-08-04

申请号：US16382042

申请日：2019-04-11

Applicant: Analog Devices, Inc.

Inventor： Krishnan Ramaswamy Parameswaran ,  Xu Tang ,  Ying-Ju Wang ,  Weidong Wang ,  David Bolognia ,  Scott Robert Davis ,  Christophe Antoine ,  Brian Hall

IPC: G01S7/481 ,  H01S5/022 ,  G02F1/295 ,  H01S5/00 ,  H01S5/024 ,  G02B26/08 ,  H01S3/23

Abstract: An optical illuminator assembly such as an integrated module can provide an illumination source for use in applications such as optical detection. A peak output power of the module can be enhanced as compared to other approaches, such as by one or more of controlling parasitic effects along an electrical pathway used to drive an optical emitter circuit included as a portion of the module, or by providing thermal management including establishing thermal conduction pathways through opposite surfaces of an optical emitter circuit such as an integrated circuit die comprising a solid-state optical emitter. Control schemes can be used that power various cells or functional blocks of the optical emitter independently. Thermal regulation can be provided by an active heat transfer element such as a thermoelectric cooler (TEC). An optical illuminator assembly can be optically coupled to a beam-steering device or other elements, such as using a self-aligning mechanical configuration.

公开(公告)号：US11296005B2

公开(公告)日：2022-04-05

申请号：US16580655

申请日：2019-09-24

Applicant: Analog Devices, Inc.

Inventor： Brian Hall ,  David Frank Bolognia

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L23/66 ,  H01L23/48

Abstract: An integrated device package is disclosed. The integrated device package can include a substrate that has an upper side and a lower side opposite the upper side. The integrated device package can include an integrated device die that is mounted to the lower side of the substrate. The integrated device die has a first side facing the lower side of the substrate and a second side opposite the first side. The package can include a molding material in which the integrated device die is at least partially embedded. The package can include a thermally conductive element coupled to the second side of the integrated device die. At least a portion of the thermally conductive element can be exposed through the molding material. The thermally conductive element can be a heat sink. The package can include an interconnect that is configured to provide an external connection. The interconnect extends at least partially through the molding material from the lower side of the substrate.

公开(公告)号：US11587839B2

公开(公告)日：2023-02-21

申请号：US16859665

申请日：2020-04-27

Applicant: Analog Devices, Inc.

Inventor： David Frank Bolognia ,  Brian Hall

IPC: H01L23/20 ,  H01L23/495 ,  C25B9/63

Abstract: A device is disclosed. The device includes a housing that defines a chamber. The chamber is to be at least partially filled with an electrolyte material. The device also includes a plurality of electrodes that are at least partially embedded in the housing and exposed to the chamber. The device further includes an access port that provides fluid communication between an interior of the housing and the outside environs.

公开(公告)号：US20210090970A1

公开(公告)日：2021-03-25

申请号：US16580655

申请日：2019-09-24

Applicant: Analog Devices, Inc.

Inventor： Brian Hall ,  David Frank Bolognia

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48 ,  H01L23/66

Abstract: An integrated device package is disclosed, The integrated device package can include a substrate that has an upper side and a lower side opposite the upper side. The integrated device package can include an integrated device die that is mounted to the lower side of the substrate. The integrated device die has a first side facing the lower side of the substrate and a second side opposite the first side. The package can include a molding material in which the integrated device die is at least partially embedded. The package can include a thermally conductive element coupled to the second side of the integrated device die. At least a portion of the thermally conductive element can be exposed through the molding material. The thermally conductive element can be a heat sink. The package can include an interconnect that is configured to provide an external connection. The interconnect extends at least partially through the molding material from the lower side of the substrate.