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    ELECTRONIC DEVICES
    3.
    发明申请
    ELECTRONIC DEVICES 审中-公开

    公开(公告)号：US20190232021A1

    公开(公告)日：2019-08-01

    申请号：US16261333

    申请日：2019-01-29

    申请人： ANALOG DEVICES, INC.

    发明人： Vikram Venkatadri ,  David Frank Bolognia

    IPC分类号： A61M25/01

    CPC分类号： A61M25/0127 ,  A61B5/062 ,  A61B2562/164 ,  A61M2025/0166

    摘要： An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.

    FLUID SENSOR CARTRIDGE
    4.
    发明公开
    FLUID SENSOR CARTRIDGE 审中-公开

    公开(公告)号：US20240035933A1

    公开(公告)日：2024-02-01

    申请号：US18361750

    申请日：2023-07-28

    申请人： Analog Devices, Inc.

    发明人： David Frank Bolognia ,  Erin Eda Evke

    IPC分类号： G01N1/20 ,  G01N33/49

    CPC分类号： G01N1/2035 ,  G01N33/49 ,  G01N2001/205 ,  G01N2001/1427

    摘要： A fluid sensor cartridge that can be used to monitor composition of constituent materials or characteristics of a sample fluid or a patient's blood. The fluid sensor cartridge can be connected in-line with a medical device during a medical treatment. The fluid sensor cartridge can utilize one or more valves, one or more channels, and one or more reservoirs to enable sampling, sensing, and calibrating of a sample fluid or a patient's blood in one container with minimal amounts of sample/blood and calibration fluid.

    Sensor package
    6.
    发明授权
    Sensor package 有权

    公开(公告)号：US11604084B2

    公开(公告)日：2023-03-14

    申请号：US17231995

    申请日：2021-04-15

    申请人： Analog Devices, Inc.

    发明人： David Frank Bolognia ,  Jiawen Bai

    IPC分类号： G01D11/24 ,  B81B7/00

    摘要： A sensor package is disclosed. The sensor package can include a housing that at least partially defines a flow channel. The sensor package can also include an electrically conductive spacer that is disposed on a surface of the housing in the flow channel. The sensor package can further include a sensor die that is disposed in and exposed to the flow channel. The sensor die electrically attached to the spacer such that the sensor die is elevated relative to the surface of the housing.

    FLUID DELIVERY DEVICE
    7.
    发明申请
    FLUID DELIVERY DEVICE 有权

    公开(公告)号：US20210322681A1

    公开(公告)日：2021-10-21

    申请号：US16851798

    申请日：2020-04-17

    申请人： Analog Devices, Inc.

    发明人： David Frank Bolognia ,  Brian Hall

    IPC分类号： A61M5/315 ,  A61M5/145 ,  A61M5/142

    摘要： A substance delivery device is disclosed. The substance delivery device includes a lever that includes a drive arm that is rotatable about a pivot. The substance delivery device also includes a pump that has a deformable chamber. The deformable chamber is configured to rotate the drive arm about the pivot towards a container so as to deform the container to drive a fluid substance from the container.

    Negative fillet for mounting an integrated device die to a carrier
    8.
    发明授权
    Negative fillet for mounting an integrated device die to a carrier 有权

    公开(公告)号：US11056455B2

    公开(公告)日：2021-07-06

    申请号：US16017986

    申请日：2018-06-25

    申请人： ANALOG DEVICES, INC.

    发明人： Vikram Venkatadri ,  David Frank Bolognia

    IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L27/146

    摘要： In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.