中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.013 seconds)

    INTEGRATED GESTURE SENSOR MODULE
    2.
    发明申请
    INTEGRATED GESTURE SENSOR MODULE 审中-公开
    集成式传感器模块

    公开(公告)号：US20140340302A1

    公开(公告)日：2014-11-20

    申请号：US14276238

    申请日：2014-05-13

    Applicant: ANALOG DEVICES, INC.

    Inventor： Dipak Sengupta ,  Shrenik Deliwala ,  Ying Zhao ,  Bruce Fried ,  William Schoppee ,  Woodrow Beckford

    IPC: G06F3/042 ,  G06F3/01

    CPC classification number: G06F3/042 ,  G06F3/017 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/73265 ,  Y10T29/49826 ,  H01L2924/00012

    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

    Abstract translation: 集成的手势传感器模块包括光学传感器芯片，专用集成电路（ASIC）裸片和设置在单个封装中的光发射器管芯。 光学传感器管芯和ASIC管芯可以设置在封装的第一腔中，并且光发射器管芯可以设置在封装的第二腔中。 第二空腔可以是圆锥形或阶梯形的，使得限定空腔的开口随着距离光发射器管芯的上表面的距离而增加。 光发射器管芯的上表面可以高于光学传感器管芯的上表面。 位于第一和第二腔之间的光学屏障可以包括预成型，层压或陶瓷封装，模塑料和/或金属化通孔的一部分。

    Apparatus for integrated circuit packaging
    3.
    发明授权
    Apparatus for integrated circuit packaging 有权
    集成电路封装设备

    公开(公告)号：US08610254B2

    公开(公告)日：2013-12-17

    申请号：US13783095

    申请日：2013-03-01

    Applicant: Analog Devices, Inc.

    Inventor： Ying Zhao

    IPC: H01L23/495

    CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

    Abstract translation: 公开了诸如涉及集成电路封装的装置。 在一个实施例中，芯片封装包括：具有顶表面和背离顶表面的底表面的封装。 该封装还包括包括多个引线的引线框架。 每个引线包括通过封装的底表面的边缘之一暴露的暴露部分。 曝光部分具有长度。 沿着封装的底表面的一个边缘定位的暴露部分中的至少一个具有与沿着边缘的其它暴露部分不同的长度。 包装还可以包括通过底面的角部暴露的虚拟垫。 当封装被附接到印刷电路板时，该配置可以增强封装的焊点可靠性。

    APPARATUS FOR INTEGRATED CIRCUIT PACKAGING
    4.
    发明申请
    APPARATUS FOR INTEGRATED CIRCUIT PACKAGING 有权
    集成电路包装设备

    公开(公告)号：US20130168839A1

    公开(公告)日：2013-07-04

    申请号：US13783095

    申请日：2013-03-01

    Applicant: ANALOG DEVICES, INC.

    Inventor： Ying Zhao

    IPC: H01L23/495

    CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

    Abstract translation: 公开了诸如涉及集成电路封装的装置。 在一个实施例中，芯片封装包括：具有顶表面和背离顶表面的底表面的封装。 该封装还包括包括多个引线的引线框架。 每个引线包括通过封装的底表面的边缘之一暴露的暴露部分。 曝光部分具有长度。 沿着封装的底表面的一个边缘定位的暴露部分中的至少一个具有与沿着边缘的其它暴露部分不同的长度。 包装还可以包括通过底面的角部暴露的虚拟垫。 当封装被附接到印刷电路板时，该配置可以增强封装的焊点可靠性。

    Integrated gesture sensor module
    6.
    发明授权
    Integrated gesture sensor module 有权

    公开(公告)号：US10884551B2

    公开(公告)日：2021-01-05

    申请号：US14276238

    申请日：2014-05-13

    Applicant: ANALOG DEVICES, INC.

    Inventor： Dipak Sengupta ,  Shrenik Deliwala ,  Ying Zhao ,  Bruce Fried ,  William Schoppee ,  Woodrow Beckford

    IPC: G06F3/042 ,  G06F3/01

    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

Patent Agency Ranking