公开(公告)号：USD920825S1

公开(公告)日：2021-06-01

申请号：US29692091

申请日：2019-05-22

Applicant: Analog Devices, Inc.

Designer： Jiawen Bai ,  Ryan Frazier ,  Ying Zhao ,  Shrenik Deliwala

公开(公告)号：US11604084B2

公开(公告)日：2023-03-14

申请号：US17231995

申请日：2021-04-15

Applicant: Analog Devices, Inc.

Inventor： David Frank Bolognia ,  Jiawen Bai

IPC: G01D11/24 ,  B81B7/00

Abstract: A sensor package is disclosed. The sensor package can include a housing that at least partially defines a flow channel. The sensor package can also include an electrically conductive spacer that is disposed on a surface of the housing in the flow channel. The sensor package can further include a sensor die that is disposed in and exposed to the flow channel. The sensor die electrically attached to the spacer such that the sensor die is elevated relative to the surface of the housing.

公开(公告)号：USD918756S1

公开(公告)日：2021-05-11

申请号：US29692090

申请日：2019-05-22

Applicant: Analog Devices, Inc.

Designer： Jiawen Bai ,  Ryan Frazier ,  Ying Zhao ,  Shrenik Deliwala

公开(公告)号：USD907515S1

公开(公告)日：2021-01-12

申请号：US29692091

申请日：2019-05-22

Applicant: Analog Devices, Inc.

Designer： Jiawen Bai ,  Ryan Frazier ,  Ying Zhao ,  Shrenik Deliwala

公开(公告)号：US20220333958A1

公开(公告)日：2022-10-20

申请号：US17231995

申请日：2021-04-15

Applicant: Analog Devices, Inc.

Inventor： David Frank Bolognia ,  Jiawen Bai

IPC: G01D11/24 ,  B81B7/00

Abstract: A sensor package is disclosed. The sensor package can include a housing that at least partially defines a flow channel. The sensor package can also include an electrically conductive spacer that is disposed on a surface of the housing in the flow channel. The sensor package can further include a sensor die that is disposed in and exposed to the flow channel. The sensor die electrically attached to the spacer such that the sensor die is elevated relative to the surface of the housing.

公开(公告)号：US20220291165A1

公开(公告)日：2022-09-15

申请号：US17654177

申请日：2022-03-09

Applicant: ANALOG DEVICES, INC.

Inventor： David Frank Bolognia ,  Jiawen Bai

IPC: G01N27/416 ,  A61M1/16 ,  A61M39/22

Abstract: A fluid sensor device can include a housing having an inlet and an outlet. The housing can have a fluid reservoir, a sensing assembly, a plunger, a valve, and a plurality of channels. The fluid sensor module can be used to sense constituents in a sample fluid (e.g. patient's blood or dialysate) during a treatment process, such as kidney dialysis procedures. The fluid sensor module can be connected in-line to a medical device to sense the sample fluid.

公开(公告)号：US20230226550A1

公开(公告)日：2023-07-20

申请号：US18009543

申请日：2021-06-10

Applicant: ANALOG DEVICES, INC.

Inventor： David Frank Bolognia ,  Jiawen Bai ,  Joyce Wu

IPC: B01L3/00

CPC classification number: B01L3/5029 ,  B01L2200/16 ,  B01L2300/043 ,  B01L2300/0645 ,  B01L2300/0663 ,  B01L2300/0832

Abstract: A sample testing device is disclosed. The sample testing device can include a first compartment that is configured to receive a test sample, a second compartment that is configured to receive the test sample, a separator that is disposed between and separating the first compartment and the second compartment, and a mechanical lock structure that is configured to lock and unlock a movement of the separator. When the mechanical lock is unlocked, the separator opens to transfer the test sample from the first compartment to the second compartment. The sample testing device can include a sensing assembly.

公开(公告)号：USD874964S1

公开(公告)日：2020-02-11

申请号：US29692092

申请日：2019-05-22

Applicant: Analog Devices, Inc.

Designer： Jiawen Bai ,  Ryan Frazier ,  Ying Zhao ,  Shrenik Deliwala

公开(公告)号：US20180248098A1

公开(公告)日：2018-08-30

申请号：US15475832

申请日：2017-03-31

Applicant: ANALOG DEVICES, INC.

Inventor： Jiawen Bai ,  David Bolognia

IPC: H01L35/30 ,  H01L35/10 ,  G08C17/00

CPC classification number: H01L35/30 ,  G08C17/00 ,  G08C2200/00 ,  H01L35/10

Abstract: An integrated device package can include a package substrate and a thermoelectric generator (“TEG”) device electrically connected to the package substrate. The TEG device can be configured to convert thermal energy to electrical current. A magnet can be disposed over a bottom side of the TEG device. The magnet can be configured to connect to a heat source and to define a thermally conductive pathway between the heat source and the TEG device. A heat sink can be attached to a top side of the TEG device.