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1.发明申请Method and Device for Separating Plates from Mechanically Brittle and Nonmetal Materials 有权从机械脆性和非金属材料中分离板的方法和装置公开(公告)号：US20090001118A1
公开(公告)日：2009-01-01
申请号：US11658067
申请日：2005-06-15
CPC分类号： C03B33/09 , C03B33/04 , Y10T225/12 , Y10T225/325
摘要： The invention concerns a method for separating plate-shaped workpieces of mechanically brittle and nonmetal materials along any contour desired, comprising the following steps: Scratching of separating lines along the contour up to a depth T by means of a cutting device in at least one side of the plate-shaped workpiece is hereby characterized in that the plate-shaped workpiece is stimulated to bending vibrations at a vibration amplitude along the separating lines, so that the plate-shaped workpiece is completely separated along the separating line.
摘要翻译： 本发明涉及一种用于沿着期望的任何轮廓分离机械脆性和非金属材料的板状工件的方法，包括以下步骤：通过至少一个侧面上的切割装置沿着轮廓划分直到深度T的分离线 其特征在于，板状工件被刺激以沿分离线的振动振幅弯曲振动，使得板状工件沿着分离线完全分离。
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2.发明授权Method and device for separating plates from mechanically brittle and nonmetal materials 有权从机械脆性和非金属材料中分离板的方法和装置公开(公告)号：US08763872B2
公开(公告)日：2014-07-01
申请号：US11658067
申请日：2005-06-15
IPC分类号： B26F3/00
CPC分类号： C03B33/09 , C03B33/04 , Y10T225/12 , Y10T225/325
摘要： The invention concerns a method for separating plate-shaped workpieces of mechanically brittle and nonmetal materials along any contour desired, comprising the following steps: Scratching of separating lines along the contour up to a depth T by means of a cutting device in at least one side of the plate-shaped workpiece is hereby characterized in that the plate-shaped workpiece is stimulated to bending vibrations at a vibration amplitude along the separating lines, so that the plate-shaped workpiece is completely separated along the separating line.
摘要翻译： 本发明涉及一种用于沿着期望的任何轮廓分离机械脆性和非金属材料的板状工件的方法，包括以下步骤：通过至少一个侧面上的切割装置沿着轮廓划分直到深度T的分离线 其特征在于，板状工件被刺激以沿分离线的振动振幅弯曲振动，使得板状工件沿着分离线完全分离。
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