公开(公告)号：US5759616A

公开(公告)日：1998-06-02

申请号：US401770

申请日：1995-03-10

申请人： Andreas Michel ,  Michael Harmening ,  Walter Bacher ,  Peter Bley ,  Robert Ruprecht ,  Alexander Both

发明人： Andreas Michel ,  Michael Harmening ,  Walter Bacher ,  Peter Bley ,  Robert Ruprecht ,  Alexander Both

IPC分类号： H01L21/3205 ,  B81B7/02 ,  G03F7/00 ,  B05D5/12

CPC分类号： G03F7/00 ,  B81C1/00246 ,  B81C2203/0735

摘要： In a process for producing microstructure components on a substrate which carries electronic microcircuits cooperating functionally with the microstructure components, a first layer of a plastic material which connects with the substrate is applied to the substrate and a second layer of a plastic material which includes a separating agent but which firmly connects with the first layer is applied to the first layer and a molding tool is then impressed into the second layer to form the desired microstructures or to form cavities into the plastic material, which, upon removal of the molding tool, are filled with a metal to form the desired microstructures on the substrate upon removal of the plastic material.

摘要翻译： 在承载与微结构组件功能性配合的电子微电路的基板上生产微结构组件的方法中，将与衬底连接的塑料材料的第一层施加到衬底和塑料材料的第二层，该第二层包括分离 但是与第一层牢固连接的第一层被施加到第一层，然后将模制工具压入第二层中以形成期望的微结构或者在塑料材料中形成空腔，在移除成型工具之后， 填充金属以在去除塑料材料时在基底上形成所需的微结构。