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    Process of making a microstructured plastic mold
    1.
    发明授权
    Process of making a microstructured plastic mold 失效
    制造微结构塑料模具的工艺

    公开(公告)号：US5795519A

    公开(公告)日：1998-08-18

    申请号：US358397

    申请日：1994-12-19

    申请人： Walter Bacher ,  Peter Bley ,  Michael Harmening

    发明人： Walter Bacher ,  Peter Bley ,  Michael Harmening

    IPC分类号： B29C33/42 ,  B29C59/02 ,  B81B1/00 ,  C25D1/10

    CPC分类号： C25D1/10 ,  B29C59/022 ,  B29C59/026 ,  B81C99/009 ,  B29C2059/023

    摘要： In a process of making a microstructured plastic mold from which structures can be formed galvanically a compound layer including an electrically conductive and an insulating layer portion is provided and is heated, and impressed into the insulating layer portion is a tool which has microstructured bodies disposed thereon of a height corresponding at least to the thickness of the insulating layer portion and with rough front surfaces having points and ridges adapted to penetrate the electrically insulating layer thereby to expose the electrically insulating layer at the bottom of the cavities formed by microstructured bodies.

    摘要翻译： 在制造微结构的塑性模具的过程中，可以电气地形成结构，其中提供包括导电层和绝缘层部分的化合物层，并被加热并且被施加到绝缘层部分中，是具有设置在其上的微结构体的工具 其高度至少对应于绝缘层部分的厚度，并且具有适于穿透电绝缘层的点和脊的粗糙前表面，从而暴露由微结构体形成的空腔底部的电绝缘层。

    Process for producing microstructure components on a substrate
    2.
    发明授权
    Process for producing microstructure components on a substrate 失效
    在基材上生产微结构组分的方法

    公开(公告)号：US5759616A

    公开(公告)日：1998-06-02

    申请号：US401770

    申请日：1995-03-10

    申请人： Andreas Michel ,  Michael Harmening ,  Walter Bacher ,  Peter Bley ,  Robert Ruprecht ,  Alexander Both

    发明人： Andreas Michel ,  Michael Harmening ,  Walter Bacher ,  Peter Bley ,  Robert Ruprecht ,  Alexander Both

    IPC分类号： H01L21/3205 ,  B81B7/02 ,  G03F7/00 ,  B05D5/12

    CPC分类号： G03F7/00 ,  B81C1/00246 ,  B81C2203/0735

    摘要： In a process for producing microstructure components on a substrate which carries electronic microcircuits cooperating functionally with the microstructure components, a first layer of a plastic material which connects with the substrate is applied to the substrate and a second layer of a plastic material which includes a separating agent but which firmly connects with the first layer is applied to the first layer and a molding tool is then impressed into the second layer to form the desired microstructures or to form cavities into the plastic material, which, upon removal of the molding tool, are filled with a metal to form the desired microstructures on the substrate upon removal of the plastic material.

    摘要翻译： 在承载与微结构组件功能性配合的电子微电路的基板上生产微结构组件的方法中，将与衬底连接的塑料材料的第一层施加到衬底和塑料材料的第二层，该第二层包括分离 但是与第一层牢固连接的第一层被施加到第一层，然后将模制工具压入第二层中以形成期望的微结构或者在塑料材料中形成空腔，在移除成型工具之后， 填充金属以在去除塑料材料时在基底上形成所需的微结构。

    Tool for making a microstructured plastic mold
    3.
    发明授权
    Tool for making a microstructured plastic mold 失效
    制造微结构塑料模具的工具

    公开(公告)号：US5676983A

    公开(公告)日：1997-10-14

    申请号：US739160

    申请日：1996-10-30

    申请人： Walter Bacher ,  Peter Bley ,  Michael Harmening

    发明人： Walter Bacher ,  Peter Bley ,  Michael Harmening

    IPC分类号： B29C33/42 ,  B29C59/02 ,  B81B1/00 ,  C25D1/10 ,  B29C43/36

    CPC分类号： C25D1/10 ,  B29C59/022 ,  B29C59/026 ,  B81C99/009 ,  B29C2059/023

    摘要： For a process of making a microstructured plastic mold from which structures can be formed galvanically, a compound layer, including an electrically conductive and an insulating layer portion, is provided and is heated and impressed into the insulating layer portion, a tool is provided which has microstructured bodies disposed thereon of a height corresponding at least to the thickness of the insulating layer portion and with rough from surfaces having points and ridges adapted to penetrate the electrically insulating layer thereby to expose the electrically insulating layer at the bottom of the cavities formed by microstructured bodies.

    摘要翻译： 对于可以电气地形成结构的微结构化塑料模具的制造方法，提供包含导电绝缘层部分的化合物层，并将其加热并印刷到绝缘层部分中，提供具有 其上设置有至少对应于绝缘层部分的厚度的高度的微结构体，并且具有适于穿透电绝缘层的点和脊的表面的粗糙度，从而暴露由微结构化形成的空腔底部的电绝缘层 身体。

    Method of making molds for electrodeposition forming of microstructured bodies
    5.
    发明授权
    Method of making molds for electrodeposition forming of microstructured bodies 失效
    制备微结构体电极形成的方法

    公开(公告)号：US5073237A

    公开(公告)日：1991-12-17

    申请号：US672421

    申请日：1991-03-20

    申请人： Walter Bacher ,  Hans Biedermann ,  Michael Harmening

    发明人： Walter Bacher ,  Hans Biedermann ,  Michael Harmening

    IPC分类号： B29C33/38 ,  B29C59/02 ,  C25B11/03 ,  C25D1/10

    CPC分类号： C25D1/10 ,  B29C59/02 ,  B29C59/026 ,  B29C2059/023

    摘要： In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold. The microstructured negative mold is then ready for electrodeposition of a metal in the microstructure recesses using the electrically conductive film therein as an electrode.

    摘要翻译： 在具有微结构化凹部的模具的方法中，具有由导电材料的膜覆盖的连续的基底，用于在凹部中形成，通过电沉积，微结构化板状体将微结构主模压制成涂覆有热塑性材料的层 导电材料的膜在高于热塑性材料的软化温度的温度下使得其上具有导电膜的热塑性材料首先接触微结构表面，然后进入微结构中的凹槽。 然后将母模和热塑性材料冷却并除去母模，由此热塑性材料提供具有设置在凹槽基底上的连续导电膜的微结构的负模，而导电膜的其余部分被分开并设置 在微结构模具的其余部分上的孤立的手镯中。 然后使用其中的导电膜作为电极，使微结构化阴模用于电沉积微结构凹部中的金属。