Switching device
    1.
    发明授权
    Switching device 有权
    开关装置

    公开(公告)号:US07834286B2

    公开(公告)日:2010-11-16

    申请号:US12284171

    申请日:2008-09-19

    IPC分类号: H01H13/00

    摘要: An electrical switch device including a housing having an actuator cap movably mounted thereon and a plurality of contact switches disposed therein. The cap is operable to engage the contact switches within the housing to activate the switches in a selected sequence.

    摘要翻译: 一种电气开关装置,包括具有可移动地安装在其上的致动器盖的壳体和设置在其中的多个接触开关。 盖可操作以接合壳体内的接触开关,以选定的顺序激活开关。

    Switching device
    2.
    发明申请
    Switching device 有权
    开关装置

    公开(公告)号:US20090107820A1

    公开(公告)日:2009-04-30

    申请号:US12284171

    申请日:2008-09-19

    IPC分类号: H01H13/00

    摘要: An electrical switch device including a housing having an actuator cap movably mounted thereon and a plurality of contact switches disposed therein. The cap is operable to engage the contact switches within the housing to activate the switches in a selected sequence.

    摘要翻译: 一种电气开关装置,包括具有可移动地安装在其上的致动器盖的壳体和设置在其中的多个接触开关。 盖可操作以接合壳体内的接触开关,以选定的顺序激活开关。

    Process for producing microstructure components on a substrate
    3.
    发明授权
    Process for producing microstructure components on a substrate 失效
    在基材上生产微结构组分的方法

    公开(公告)号:US5759616A

    公开(公告)日:1998-06-02

    申请号:US401770

    申请日:1995-03-10

    摘要: In a process for producing microstructure components on a substrate which carries electronic microcircuits cooperating functionally with the microstructure components, a first layer of a plastic material which connects with the substrate is applied to the substrate and a second layer of a plastic material which includes a separating agent but which firmly connects with the first layer is applied to the first layer and a molding tool is then impressed into the second layer to form the desired microstructures or to form cavities into the plastic material, which, upon removal of the molding tool, are filled with a metal to form the desired microstructures on the substrate upon removal of the plastic material.

    摘要翻译: 在承载与微结构组件功能性配合的电子微电路的基板上生产微结构组件的方法中,将与衬底连接的塑料材料的第一层施加到衬底和塑料材料的第二层,该第二层包括分离 但是与第一层牢固连接的第一层被施加到第一层,然后将模制工具压入第二层中以形成期望的微结构或者在塑料材料中形成空腔,在移除成型工具之后, 填充金属以在去除塑料材料时在基底上形成所需的微结构。