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    Integrated optical detector in semiconductor reflector
    3.
    发明授权
    Integrated optical detector in semiconductor reflector 有权
    集成光检测器在半导体反射器

    公开(公告)号：US07782921B2

    公开(公告)日：2010-08-24

    申请号：US11092059

    申请日：2005-03-28

    申请人： Andrew C. Alduino ,  Mario J. Paniccia ,  Rami Cohen ,  Assia Barkai ,  Ansheng Liu

    发明人： Andrew C. Alduino ,  Mario J. Paniccia ,  Rami Cohen ,  Assia Barkai ,  Ansheng Liu

    IPC分类号： H01S5/00

    CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B2006/12104

    摘要： An electrical-optical coupling and detecting device. An apparatus according to an embodiment of the present invention includes a reflective surface defined on semiconductor material. The reflective surface is to reflect an incident optical beam towards an optical destination. An optical detector is monolithically integrated in the reflective surface of the semiconductor material. The optical detector arranged in the reflective surface of the semiconductor material is to detect the incident optical beam.

    摘要翻译： 一种电光耦合和检测装置。 根据本发明实施例的装置包括限定在半导体材料上的反射表面。 反射表面是将入射光束反射到光学目的地。 光学检测器单片集成在半导体材料的反射表面中。 布置在半导体材料的反射表面中的光学检测器是检测入射光束。

    Split socket optical interconnect
    5.
    发明授权
    Split socket optical interconnect 有权
    分离插座光互连

    公开(公告)号：US07344383B1

    公开(公告)日：2008-03-18

    申请号：US11647026

    申请日：2006-12-27

    申请人： Daoqiang Lu ,  Andrew C. Alduino ,  Henning Braunisch

    发明人： Daoqiang Lu ,  Andrew C. Alduino ,  Henning Braunisch

    IPC分类号： H01K12/00

    CPC分类号： G02B6/4201 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4284 ,  H01L2224/73204 ,  H01L2224/73253

    摘要： A split microprocessor socket is disclosed that provides a cavity created at an outer edge of the microprocessor socket. An optical module may be fitted in the cavity thus providing an optical fiber or waveguide connection directly to the socket. This low cost optical interconnect, closely packaged with the microprocessor, may alleviate bandwidth constraints associated with conventional electrical connections.

    摘要翻译： 公开了一种分立微处理器插座，其提供在微处理器插座的外边缘处产生的空腔。 可以将光学模块装配在空腔中，从而将光纤或波导连接直接连接到插座。 与微处理器紧密封装的这种低成本光互连可以减轻与传统电连接相关联的带宽约束。

    Method and apparatus providing an electrical-optical coupler
    6.
    发明授权
    Method and apparatus providing an electrical-optical coupler 有权
    提供电光耦合器的方法和装置

    公开(公告)号：US07306378B2

    公开(公告)日：2007-12-11

    申请号：US10840413

    申请日：2004-05-06

    申请人： Andrew C. Alduino ,  Mario J. Paniccia

    发明人： Andrew C. Alduino ,  Mario J. Paniccia

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4214 ,  G02B6/4201 ,  G02B6/4243 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/428

    摘要： An electrical-optical coupling device. An apparatus according to an embodiment of the present invention includes a first trench defined in a first semiconductor substrate. A first reflector is defined at a first end of the first trench in the first semiconductor substrate. The first reflector is angled with respect to an axis of the first trench. A first optical fiber is disposed in the first trench at a second end of the first trench. An optical source is mounted to the first semiconductor substrate proximate to the first trench. The optical source is optically coupled to the first optical fiber via the first reflector.

    摘要翻译： 一种电光耦合装置。 根据本发明的实施例的装置包括限定在第一半导体衬底中的第一沟槽。 第一反射器限定在第一半导体衬底中的第一沟槽的第一端。 第一反射器相对于第一沟槽的轴线成角度。 第一光纤在第一沟槽的第二端设置在第一沟槽中。 光源被安装到靠近第一沟槽的第一半导体衬底上。 光源通过第一反射器光耦合到第一光纤。

    Method and apparatus for adding/droping optical signals in a semiconductor substrate
    7.
    发明授权
    Method and apparatus for adding/droping optical signals in a semiconductor substrate 有权
    用于在半导体衬底中加/减光信号的方法和装置

    公开(公告)号：US06856732B2

    公开(公告)日：2005-02-15

    申请号：US09967365

    申请日：2001-09-28

    申请人： Ansheng Liu ,  Mario J. Paniccia ,  Remus Nicolaescu ,  Andrew C. Alduino ,  Ling Liao

    发明人： Ansheng Liu ,  Mario J. Paniccia ,  Remus Nicolaescu ,  Andrew C. Alduino ,  Ling Liao

    IPC分类号： G02B6/12 ,  G02B6/124 ,  G02F1/01 ,  G02F1/025 ,  G02B6/42

    CPC分类号： G02B6/124 ,  G02B2006/12097 ,  G02B2006/12135 ,  G02F1/0147 ,  G02F1/025 ,  G02F2201/307

    摘要： A semiconductor-based tunable add/drop method and apparatus. In one aspect of the present invention, a method according to an embodiment of the present invention includes splitting a first optical beam having multiple wavelengths into second and third optical beams with a first 3 dB optical coupler disposed in a semiconductor substrate. Portions of the second and third optical beams having a tunable wavelength are reflected back to the first 3 dB optical coupler with first and second pluralities of silicon and polysilicon interfaces, respectively, disposed along the semiconductor substrate. In another embodiment, the portions of the second and third optical beams having a tunable wavelength are reflected back to the first 3 dB optical coupler with first and second pluralities of modulated charged regions. Portions of the second and third optical beams not reflected are directed to a second 3 dB optical coupler disposed in the semiconductor substrate. The portions of the second and third optical beams not reflected are combined into a fourth optical beam with the second 3 dB optical coupler.

    摘要翻译： 一种基于半导体的可调加/减方法和装置。 在本发明的一个方面中，根据本发明实施例的方法包括：将具有多个波长的第一光束分成第二和第三光束，其中第一个3dB光耦合器设置在半导体衬底中。 具有可调谐波长的第二和第三光束的部分被分别沿着半导体衬底设置的第一和第二多个硅和多晶硅接口反射回到第一3d分量光耦合器。 在另一个实施例中，具有可调谐波长的第二和第三光束的部分被第一和第二多个调制带电区域反射回到第一3d分量光耦合器。 未反射的第二和第三光束的部分被引导到设置在半导体衬底中的第二3dB光耦合器。 未反射的第二和第三光束的部分与第二3dB光耦合器组合成第四光束。

    Method and apparatus for sensing a temperature along an optical path in semiconductor material
    9.
    发明授权
    Method and apparatus for sensing a temperature along an optical path in semiconductor material 有权
    用于感测半导体材料中沿着光路的温度的方法和装置

    公开(公告)号：US07231150B2

    公开(公告)日：2007-06-12

    申请号：US10279398

    申请日：2002-10-23

    申请人： Dean A. Samara-Rubio ,  Andrew C. Alduino ,  Christina A. Frost

    发明人： Dean A. Samara-Rubio ,  Andrew C. Alduino ,  Christina A. Frost

    IPC分类号： H04J14/02

    CPC分类号： G01K7/22

    摘要： A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material. A four-terminal resistor is defined in the semiconductor material. At least a portion of the optical path is directed through the four-terminal resistor. The four-terminal resistor includes a first pair of terminals between which a probe current is to be injected. The four-terminal resistor also includes a second pair of terminals between which a voltage drop is to be measured so as to determine a resistance along the portion of the optical path directed through the four-terminal resistor. Temperature may be derived from the determined resistance of the four-terminal resistor. In one embodiment, the temperature of the semiconductor material may then be controlled with a heater in response to the derived temperature.

    摘要翻译： 一种温度检测和控制方法及装置。 在本发明的一个方面，根据本发明的教导的装置包括设置在半导体材料中的光路。 半导体材料中限定了四端电阻。 光路的至少一部分被引导通过四端电阻。 四端电阻器包括第一对端子，在该第一对端子之间要注入探针电流。 四端电阻器还包括第二对端子，在其之间测量电压降，以便确定沿着通过四端电阻器的光路部分的电阻。 温度可以来自确定的四端电阻的电阻。 在一个实施例中，半导体材料的温度然后可以响应于所导出的温度用加热器来控制。