IMPLANTABLE OPTICAL SENSOR AND METHOD FOR MANUFACTURE
    1.
    发明申请
    IMPLANTABLE OPTICAL SENSOR AND METHOD FOR MANUFACTURE 有权
    可植入的光学传感器及其制造方法

    公开(公告)号:US20090156905A1

    公开(公告)日:2009-06-18

    申请号:US12116705

    申请日:2008-05-07

    IPC分类号: A61B5/00

    摘要: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.

    摘要翻译: 可植入医疗装置制造有密封的外壳和封装在外壳内的模块化组件。 模块化组件包括电路板,安装在电路板的顶表面上的电子部件和形成为具有由顶部边缘和底部边缘分开的外表面和内表面的壁,壁底边缘抵靠 电路板,使得壁围绕耦合到电路板的电子部件。 在一个实施例中,壁顶边缘与壳体耦合。

    Implantable optical sensor and method for manufacture
    2.
    发明授权
    Implantable optical sensor and method for manufacture 有权
    植入式光学传感器及其制造方法

    公开(公告)号:US08216134B2

    公开(公告)日:2012-07-10

    申请号:US12116705

    申请日:2008-05-07

    IPC分类号: A61B5/00

    摘要: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.

    摘要翻译: 可植入医疗装置制造有密封的外壳和封装在外壳内的模块化组件。 模块化组件包括电路板,安装在电路板的顶表面上的电子部件和形成为具有由顶部边缘和底部边缘分开的外表面和内表面的壁,壁底边缘抵靠 电路板,使得壁围绕耦合到电路板的电子部件。 在一个实施例中,壁顶边缘与壳体耦合。

    Optical sensor for medical device
    5.
    发明授权
    Optical sensor for medical device 有权
    医疗器械用光学传感器

    公开(公告)号:US08463343B2

    公开(公告)日:2013-06-11

    申请号:US12765396

    申请日:2010-04-22

    IPC分类号: A61B5/00

    摘要: An optical sensor for a medical device includes a fixed lens spacing between emit and receive modules to achieve target sensor sensitivity, while varying other sensor parameters in order to increase signal amplitude without increasing power demand. An optical sensor connected to a housing of a medical device includes a circuit board, an opto-electronic component, a wall, a lens, and a ferrule. The circuit board is arranged within the housing. The opto-electronic component is mounted on a surface of the circuit board. The wall protrudes from the surface of the circuit board and surrounds the opto-electronic component. The lens is offset from the surface of the circuit board. The ferrule is connected to the housing, the lens and the wall. An inner surface of the wall mates with an outer surface of the ferrule.

    摘要翻译: 用于医疗装置的光学传感器包括发射和接收模块之间的固定透镜间隔,以实现目标传感器灵敏度,同时改变其它传感器参数,以便增加信号幅度而不增加功率需求。 连接到医疗装置的壳体的光学传感器包括电路板,光电子部件,壁,透镜和套圈。 电路板布置在外壳内。 光电子部件安装在电路板的表面上。 壁从电路板的表面突出并围绕光电子部件。 透镜偏离电路板的表面。 套圈连接到外壳,透镜和墙壁。 壁的内表面与套圈的外表面配合。