摘要:
An apparatus including an analog memory, a temperature sensor, a comparator, and a pulse circuit. The analog memory is charged to a reference voltage corresponding to a predetermined temperature of a printhead. The temperature sensor measures a thermal voltage of at least one of the plurality of local areas of the printhead. The comparator obtains a comparison result by comparing the reference voltage to the thermal voltage. The pulse circuit selectively transmits a series of warming pulses to the at least one of the plurality of local areas of the printhead based on the comparison result.
摘要:
Electronic circuitry compensates for variations or sags in electrical voltage within a thermal ink-jetting (TIJ) printing apparatus. Ground potential and other supply-related voltages are monitored and corresponding signals are provided. The signals are used, directly or by other circuitry, to affect the biasing of one or more transistors coupling TIJ resistors to supply voltage or ground nodes. Printing errors and related problems associated with voltage variations are reduced or eliminated accordingly.
摘要:
Electronic circuitry compensates for variations or sags in electrical voltage within a thermal ink-jetting (TIJ) printing apparatus. Ground potential and other supply-related voltages are monitored and corresponding signals are provided. The signals are used, directly or by other circuitry, to affect the biasing of one or more transistors coupling TIJ resistors to supply voltage or ground nodes. Printing errors and related problems associated with voltage variations are reduced or eliminated accordingly.
摘要:
A memory structure includes a memory storage element electrically coupled to a control element. The control element comprises a tunnel-junction device. The memory storage element may also comprise a tunnel-junction device. Methods for fusing a tunnel-junction device of a memory storage element without fusing a tunnel-junction device of an associated control element are disclosed. The memory storage element may have an effective cross-sectional area that is greater than an effective cross-sectional area of the control element. A reference element comprising a tunnel-junction device may be used with a current source to fuse a memory storage element without fusing a tunnel-junction device of an associated control element. Methods of making the memory structure and using it in electronic devices are disclosed.
摘要:
A memory structure includes a memory storage element electrically coupled to a control element. The control element comprises a tunnel-junction device. The memory storage element may also comprise a tunnel-junction device. Methods for fusing a tunnel-junction device of a memory storage element without fusing a tunnel-junction device of an associated control element are disclosed. The memory storage element may have an effective cross-sectional area that is greater than an effective cross-sectional area of the control element. A memory structure comprises a memory storage element, a control element comprising a tunnel-junction device electrically coupled to the memory storage element and configured to control the state of the memory storage element, and a reference element. The reference element is configured as a reference to protect the control element when selectively controlling the state of the memory storage element. The reference element may comprise a tunnel-junction device and be used with a current source to fuse a memory storage element without fusing a tunnel-junction device of an associated control element. Methods of making the memory structure and using it in electronic devices are disclosed.
摘要:
A memory storage device includes a memory cell configurable to have at least a first conductive state and includes a first and second conductor each electrically coupled to the memory cell. A regulation circuit is configured to regulate a sense voltage on the second conductor to be independent of a current conducted through the first conductor when the memory cell is configured to have the first conductive state.
摘要:
A memory array has a multiplicity of row conductors and a multiplicity of column conductors, the row conductors and column conductors being arranged to cross at cross-points, and has a memory cell disposed at each cross-point, each memory cell having a storage element and a control element coupled in series between a row conductor and a column conductor, and each control element including a silicon-rich insulator. Methods for fabricating the memory array are disclosed.
摘要:
Embodiments of the present invention provide a memory device. In one embodiment, the memory device comprises an array of memory cells configured to provide resistive states, a read circuit configured to sense the resistive states and a resistor. The resistor is configured to provide a resistance to the read circuit that is configured to select the resistor and sense the resistance to test the read circuit.
摘要:
An intermesh memory device includes memory components that each have a determinable resistance value and electronic switches that each control current through one or more of the memory components such that a potential is applied to the memory components. A first electronic switch of the intermesh memory device is electrically coupled to an input of a memory component and a second electronic switch is electrically coupled to an output of the memory component. The first electronic switch and the second electronic switch are configured together to apply a potential to the memory component.
摘要:
Tunnel-junction structures are fabricated by any of a set of related methods that form two or more tunnel junctions simultaneously. The fabrication methods disclosed are compatible with conventional CMOS fabrication practices, including both single damascene and dual damascene processes. The simultaneously formed tunnel junctions may have different areas. In some embodiments, tub-well structures are formed with sloped sidewalls. In some embodiments, an oxide-metal-oxide film stack on the sidewall of a tub-well is etched to form the tunnel junctions. Memory circuits, other integrated circuit structures, substrates carrying microelectronics, and other electronic devices made by the methods are disclosed.