PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES
    1.
    发明申请
    PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES 审中-公开
    探头卡组件探头控制机制

    公开(公告)号:US20100039133A1

    公开(公告)日:2010-02-18

    申请号:US12191083

    申请日:2008-08-13

    IPC分类号: G01R1/073

    CPC分类号: G01R31/2891 G01R1/07342

    摘要: A probe card assembly includes a first probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, a second probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, and a controlling mechanism coupled to the first and second probe heads for controlling movement of the first and second probe heads in a first direction substantially parallel to the respective surfaces more than in a second direction substantially normal to the respective surfaces.

    摘要翻译: 探针卡组件包括第一探针头,其具有设置在相应表面上的接触元件,用于与对应的电子器件的相应端子形成电触点;第二探针头,其具有设置在相应表面上的接触元件,用于与对应的端子相应的端子形成电触头 电子设备和耦合到第一和第二探针头的控制机构,用于控制第一和第二探头在基本上平行于相应表面的第一方向上比基本上垂直于各个表面的第二方向更大的运动。

    Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies
    2.
    发明授权
    Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies 有权
    用于调节机电组件的热诱导运动的装置和方法

    公开(公告)号:US07688063B2

    公开(公告)日:2010-03-30

    申请号:US12165325

    申请日:2008-06-30

    IPC分类号: G01R31/02

    摘要: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

    摘要翻译: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括:补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构,并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

    APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES
    3.
    发明申请
    APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES 有权
    用于调整电子机械装置的热诱导运动的装置和方法

    公开(公告)号:US20090206860A1

    公开(公告)日:2009-08-20

    申请号:US12165325

    申请日:2008-06-30

    IPC分类号: G01R1/04

    摘要: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

    摘要翻译: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括:补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构,并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。