摘要:
Blends of polyamide polyols and urethane diols are prepared by reacting alkyl (methyl) esters of polybasic acids (preferably dibasic acids) with excess alkanolamine (preferable ethanol amine propanol amine) to form the polyamide polyol of the polybasic acid and alkyl alcohol. The alkyl alcohol is removed and the excess ethanolamine is reacted with ethylene or propylene carbonate to form the urethane diol. This blend of urethane diol and polyamide polyol is useful in various polymer formulations.
摘要:
The process for preparing novel polymers by the reaction of a bicyclic amide acetal with sulfur at a temperature in the range of from about 25.degree. C. to about 200.degree. C. is described.
摘要:
The conversion of a carboxylic acid having the formula RCOOH wherein R is a hydrocarbon group having from 1 to 20 carbon atoms to its corresponding anhydride by contacting said carboxylic acid with a salt of at least one metal selected from the group consisting of palladium, cobalt, manganese, chromium, nickel, copper, rhodium, iron and thorium at a temperature in the range of from about 120.degree. to 300.degree. C. is described.
摘要:
An adhesive comprising a mixture of (A) a mixture of an isocyanate prepolymer and a polyepoxide which is essentially free of hydroxyl groups, and (B) a mixture of a polyol, a urethane catalyst and an epoxy curing catalyst and structures prepared by adhering substrates to one another by means of said adhesive are described.
摘要:
A process for removing water from its mixture with hydroxyl containing compounds by adding a bicyclic amide acetal to such mixture and allowing the water to react with the bicyclic amide acetal is disclosed.
摘要:
Fast curing adhesives which are free of solvent and have high heat resistant bonding strength composed of mixtures of polyols, polyepoxides and polyisocyanates are described.
摘要:
Fast curing adhesives which are free of solvent and have high heat resistant bonding strength composed of mixtures of polyols, polyepoxides and polyisocyanates are described.
摘要:
The process for modifying the surface of a filler or reinforcing material comprising contacting said surface with a bicyclic amide acetal at a temperature in the range of from about 60.degree. C. to about 350.degree. C. is described.
摘要:
An adhesive composition comprising(A) An epoxide resin component,(B) A hardener component, and incorporated in either or both/or (A) and (B) a thermoplastic polymer, mixtures thereof and application of said mixtures to substrate surfaces to adhere said surfaces together are described.