TAPE HEAD READ/WRITE MODULE
    1.
    发明申请
    TAPE HEAD READ/WRITE MODULE 失效
    磁带读/写模块

    公开(公告)号:US20080019049A1

    公开(公告)日:2008-01-24

    申请号:US11833973

    申请日:2007-08-04

    IPC分类号: G11B5/60

    摘要: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

    摘要翻译: 具有复合空气轴承表面的磁头读/写模块,以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面,前部,后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面,底面,前部,后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中,芯片的空气轴承表面基本上与基板的空气轴承表面对准。

    Tape head read/write module
    2.
    发明申请

    公开(公告)号:US20060227457A1

    公开(公告)日:2006-10-12

    申请号:US11449443

    申请日:2006-06-07

    IPC分类号: G11B5/187

    摘要: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

    METHOD FOR PRODUCING AND INSPECTING TAPE HEAD AIR-SKIVING EDGES
    4.
    发明申请
    METHOD FOR PRODUCING AND INSPECTING TAPE HEAD AIR-SKIVING EDGES 审中-公开
    用于生产和检查带头气垫的方法

    公开(公告)号:US20070062028A1

    公开(公告)日:2007-03-22

    申请号:US11469170

    申请日:2006-08-31

    IPC分类号: G11B5/127 H04R31/00

    摘要: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

    摘要翻译: 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面(TBS)的边缘的边缘。 然后,例如通过研磨,形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。

    Zipper pull
    8.
    外观设计
    Zipper pull 有权
    拉链拉

    公开(公告)号:USD631394S1

    公开(公告)日:2011-01-25

    申请号:US29358301

    申请日:2010-03-25

    申请人: Kevin Luong

    设计人: Kevin Luong