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公开(公告)号:US20080019049A1
公开(公告)日:2008-01-24
申请号:US11833973
申请日:2007-08-04
申请人: Annayya Deshpande , Hoodin Hamidi , Icko Iben , Kevin Luong , Sassan Shahidi , Abel Taina
发明人: Annayya Deshpande , Hoodin Hamidi , Icko Iben , Kevin Luong , Sassan Shahidi , Abel Taina
IPC分类号: G11B5/60
CPC分类号: G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
摘要翻译: 具有复合空气轴承表面的磁头读/写模块,以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面,前部,后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面,底面,前部,后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中,芯片的空气轴承表面基本上与基板的空气轴承表面对准。
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公开(公告)号:US20060227457A1
公开(公告)日:2006-10-12
申请号:US11449443
申请日:2006-06-07
申请人: Annayya Deshpande , Hoodin Hamidi , Icko Iben , Kevin Luong , Sassan Shahidi , Abel Taina
发明人: Annayya Deshpande , Hoodin Hamidi , Icko Iben , Kevin Luong , Sassan Shahidi , Abel Taina
IPC分类号: G11B5/187
CPC分类号: G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
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公开(公告)号:US20070094866A1
公开(公告)日:2007-05-03
申请号:US11559311
申请日:2006-11-13
申请人: Robert Biskeborn , Annayya Deshpande , Calvin Lo , Kevin Luong , Abel Taina , Artemio-Juan Torres
发明人: Robert Biskeborn , Annayya Deshpande , Calvin Lo , Kevin Luong , Abel Taina , Artemio-Juan Torres
IPC分类号: G11B5/127
CPC分类号: G11B5/3173 , G11B5/1871 , G11B5/3103 , G11B5/3116 , G11B5/3163 , G11B5/584 , G11B5/588 , Y10T29/49021 , Y10T29/49032 , Y10T29/49044 , Y10T29/53165
摘要: A plurality of apparatuses and methods are provided for improving the manufacture and operational characteristics of thin magnetic film heads. Various embodiments of the present invention provide an apparatus and method for attaching a thin film head to a beam. Other embodiments of the present invention include a system, method and apparatus for dicing a thin film head on a wafer.
摘要翻译: 提供了多种装置和方法来改善薄磁头的制造和操作特性。 本发明的各种实施例提供了一种用于将薄膜头附接到梁的装置和方法。 本发明的其它实施例包括用于在薄片上切割薄膜头的系统,方法和装置。
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公开(公告)号:US20070062028A1
公开(公告)日:2007-03-22
申请号:US11469170
申请日:2006-08-31
申请人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
发明人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
CPC分类号: G11B5/39 , G11B5/40 , Y10T29/49021 , Y10T29/49036 , Y10T29/49041 , Y10T29/49048
摘要: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.
摘要翻译: 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面(TBS)的边缘的边缘。 然后,例如通过研磨,形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。
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公开(公告)号:US20050124141A1
公开(公告)日:2005-06-09
申请号:US11036148
申请日:2005-01-14
申请人: Annayya Deshpande , Calvin Lo , Kevin Luong , Artemio Torres
发明人: Annayya Deshpande , Calvin Lo , Kevin Luong , Artemio Torres
CPC分类号: B28D5/022
摘要: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.
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公开(公告)号:US20050122631A1
公开(公告)日:2005-06-09
申请号:US10727788
申请日:2003-12-03
申请人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
发明人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
CPC分类号: G11B5/39 , G11B5/40 , Y10T29/49021 , Y10T29/49036 , Y10T29/49041 , Y10T29/49048
摘要: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.
摘要翻译: 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面(TBS)的边缘的边缘。 然后,例如通过研磨,形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。
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公开(公告)号:USD722794S1
公开(公告)日:2015-02-24
申请号:US29437551
申请日:2012-11-18
申请人: Kevin Luong
设计人: Kevin Luong
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公开(公告)号:USD631394S1
公开(公告)日:2011-01-25
申请号:US29358301
申请日:2010-03-25
申请人: Kevin Luong
设计人: Kevin Luong
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公开(公告)号:USD700783S1
公开(公告)日:2014-03-11
申请号:US29426467
申请日:2012-07-06
申请人: Kevin Luong
设计人: Kevin Luong
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