公开(公告)号：US20140271343A1

公开(公告)日：2014-09-18

申请号：US14288962

申请日：2014-05-28

Applicant: Antaya Technologies Corp.

Inventor： Jennie S. Hwang ,  John Pereira ,  Alexandra Mary Mackin ,  Joseph C. Gonsalves

IPC: B23K35/26

CPC classification number: B23K35/26 ,  B23K35/24 ,  B60R16/02 ,  B60Y2410/115 ,  C03C27/046 ,  C22C1/02 ,  C22C28/00 ,  H05K1/0306 ,  H05K3/3457

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract translation: 焊料组合物包括约4重量％至约25重量％的锡，约0.1重量％至约8重量％的锑，约0.03重量％至约4重量％的铜，约0.03重量％至约4重量％的镍，约66 至约90重量％的铟和约0.5重量％至约9重量％的银。 该组合物还可以包含约0.2重量％至约6重量％的锌，并且独立地包含约0.01重量％至约0.3重量％的锗。 组合物可以用于将电连接器焊接到玻璃部件上的电接触表面。

公开(公告)号：US09975207B2

公开(公告)日：2018-05-22

申请号：US14288962

申请日：2014-05-28

Applicant: Antaya Technologies Corp.

Inventor： Jennie S. Hwang ,  John Pereira ,  Alexandra Mary Mackin ,  Joseph C. Gonsalves

IPC: B23K35/00 ,  B23K1/00 ,  B23K35/26 ,  B23K35/24 ,  C03C27/04 ,  C22C28/00 ,  C22C1/02 ,  B60R16/02 ,  H05K1/03 ,  H05K3/34

CPC classification number: B23K35/26 ,  B23K35/24 ,  B60R16/02 ,  B60Y2410/115 ,  C03C27/046 ,  C22C1/02 ,  C22C28/00 ,  H05K1/0306 ,  H05K3/3457

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.