SOLID ELECTROLYTIC CAPACITOR WITH IMPROVED VOLUMETRIC EFFICIENCY METHOD OF MAKING
    1.
    发明申请
    SOLID ELECTROLYTIC CAPACITOR WITH IMPROVED VOLUMETRIC EFFICIENCY METHOD OF MAKING 有权
    具有改进的体积效率方法的固体电解电容器

    公开(公告)号:US20090199378A1

    公开(公告)日:2009-08-13

    申请号:US12029538

    申请日:2008-02-12

    申请人: Antony Chacko

    发明人: Antony Chacko

    IPC分类号: H01G9/15

    摘要: A method of forming a capacitor includes the steps of: forming an anode with an anode wire extending there from; forming a dielectric on the anode; forming a cathode layer on the dielectric; providing a substrate comprising at least one via and at least two connectors; inserting the anode wire into a first via; forming an electrical connection between the anode wire and a first connector of the connectors; and forming an electrical connection between the cathode layer and a second connector.

    摘要翻译: 形成电容器的方法包括以下步骤:形成具有从其延伸的阳极线的阳极; 在阳极上形成电介质; 在电介质上形成阴极层; 提供包括至少一个通孔和至少两个连接器的基板; 将阳极线插入第一通孔中; 在阳极线和连接器的第一连接器之间形成电连接; 以及在所述阴极层和第二连接器之间形成电连接。

    Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive
    5.
    发明授权
    Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive 有权
    使用二次粘合剂改善固体电解电容器阴极连接完整性的方法

    公开(公告)号:US07495890B2

    公开(公告)日:2009-02-24

    申请号:US11499366

    申请日:2006-08-04

    申请人: Antony Chacko

    发明人: Antony Chacko

    IPC分类号: H01G9/00

    CPC分类号: H01G9/012

    摘要: A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.

    摘要翻译: 固体电解电容器主体通过二次粘合剂和用于形成电容器组件的方法附接到引线框架。 该组件由在阴极表面上形成导电粘合剂的芯片组成。 二次粘合剂邻近导电粘合剂放置。 引线框架连接到这些粘合剂上,粘合剂同时固化。 二次粘合剂可以是热固化或UV固化。 通过该方法形成的固体电解电容器显示引线框架和电容器体之间的粘附性提高。

    Conductive polymer dispersions for solid electrolytic capacitors
    8.
    发明授权
    Conductive polymer dispersions for solid electrolytic capacitors 有权
    固体电解电容器的导电聚合物分散体

    公开(公告)号:US08902567B2

    公开(公告)日:2014-12-02

    申请号:US13480156

    申请日:2012-05-24

    申请人: Antony Chacko

    发明人: Antony Chacko

    摘要: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.

    摘要翻译: 在阳极上具有阳极和电介质的电容器。 第一导电聚合物层在电介质上,其中第一导电聚合物层包含聚阴离子和第一粘合剂。 第二导电聚合物层在第一导电聚合物层之上,其中第二导电聚合物层包含聚阴离子和第二粘合剂,并且其中第一粘合剂比第二粘合剂更亲水。

    Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive
    9.
    发明申请
    Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive 有权
    使用二次粘合剂改善固体电解电容器阴极连接完整性的方法

    公开(公告)号:US20080030929A1

    公开(公告)日:2008-02-07

    申请号:US11499366

    申请日:2006-08-04

    申请人: Antony Chacko

    发明人: Antony Chacko

    IPC分类号: H01G9/00

    CPC分类号: H01G9/012

    摘要: A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.

    摘要翻译: 固体电解电容器主体通过二次粘合剂和用于形成电容器组件的方法附接到引线框架。 该组件由在阴极表面上形成导电粘合剂的芯片组成。 二次粘合剂邻近导电粘合剂放置。 引线框架连接到这些粘合剂上,粘合剂同时固化。 二次粘合剂可以是热固化或UV固化。 通过该方法形成的固体电解电容器显示引线框架和电容器体之间的粘附性提高。

    CONDUCTIVE POLYMER DISPERSIONS FOR SOLID ELECTROLYTIC CAPACITORS
    10.
    发明申请
    CONDUCTIVE POLYMER DISPERSIONS FOR SOLID ELECTROLYTIC CAPACITORS 有权
    用于固体电解电容器的导电聚合物分散体

    公开(公告)号:US20120300370A1

    公开(公告)日:2012-11-29

    申请号:US13480156

    申请日:2012-05-24

    申请人: Antony Chacko

    发明人: Antony Chacko

    IPC分类号: H01G9/042 B05D5/12

    摘要: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.

    摘要翻译: 在阳极上具有阳极和电介质的电容器。 第一导电聚合物层在电介质上,其中第一导电聚合物层包含聚阴离子和第一粘合剂。 第二导电聚合物层在第一导电聚合物层之上,其中第二导电聚合物层包含聚阴离子和第二粘合剂,并且其中第一粘合剂比第二粘合剂更亲水。