公开(公告)号：US20110042742A1

公开(公告)日：2011-02-24

申请号：US12917378

申请日：2010-11-01

申请人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L29/78

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

摘要翻译： 在沟槽栅极MIS器件中，沟槽内的栅极接触，从而不需要使栅极材料（通常为多晶硅）延伸到沟槽外部。 这避免了沟槽上角处的应力问题。 栅极金属和多晶硅之间的接触通常在位于器件的有源区域之外的栅极金属区域中形成。 描述了用于形成栅极金属和多晶硅之间的接触的各种构造，包括其中沟槽在接触区域中变宽的实施例。 由于在整个器件中多晶硅被回蚀到硅的顶表面之下，通常不需要多晶硅掩模，从而节省制造成本。

公开(公告)号：US09324858B2

公开(公告)日：2016-04-26

申请号：US12917378

申请日：2010-11-01

申请人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L29/76 ,  H01L29/78 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/423 ,  H01L29/66 ,  H01L29/06 ,  H01L29/10 ,  H01L29/40 ,  H01L29/872

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

摘要翻译： 在沟槽栅极MIS器件中，沟槽内的栅极接触，从而不需要使栅极材料（通常为多晶硅）延伸到沟槽外部。 这避免了沟槽上角处的应力问题。 栅极金属和多晶硅之间的接触通常在位于器件的有源区域之外的栅极金属区域中形成。 描述了用于形成栅极金属和多晶硅之间的接触的各种构造，包括其中沟槽在接触区域中变宽的实施例。 由于在整个器件中多晶硅被回蚀到硅的顶表面之下，通常不需要多晶硅掩模，从而节省制造成本。

公开(公告)号：US07335946B1

公开(公告)日：2008-02-26

申请号：US10898431

申请日：2004-07-22

申请人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L29/76

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

摘要翻译： 在沟槽栅极MIS器件中，沟槽内的栅极接触，从而不需要使栅极材料（通常为多晶硅）延伸到沟槽外部。 这避免了沟槽上角处的应力问题。 栅极金属和多晶硅之间的接触通常在位于器件的有源区域之外的栅极金属区域中形成。 描述了用于形成栅极金属和多晶硅之间的接触的各种构造，包括其中沟槽在接触区域中变宽的实施例。 由于在整个器件中多晶硅被回蚀到硅的顶表面之下，通常不需要多晶硅掩模，从而节省制造成本。

公开(公告)号：US06838722B2

公开(公告)日：2005-01-04

申请号：US10104811

申请日：2002-03-22

申请人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L29/423 ,  H01L21/336 ,  H01L21/768 ,  H01L21/8234 ,  H01L27/06 ,  H01L27/08 ,  H01L27/088 ,  H01L29/06 ,  H01L29/10 ,  H01L29/40 ,  H01L29/41 ,  H01L29/49 ,  H01L29/78 ,  H01L29/872 ,  H81L27/108

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

摘要翻译： 在沟槽栅极MIS器件中，沟槽内的栅极接触，从而不需要使栅极材料（通常为多晶硅）延伸到沟槽外部。 这避免了沟槽上角处的应力问题。 栅极金属和多晶硅之间的接触通常在位于器件的有源区域之外的栅极金属区域中形成。 描述了用于形成栅极金属和多晶硅之间的接触的各种构造，包括其中沟槽在接触区域中变宽的实施例。 由于在整个器件中多晶硅被回蚀到硅的顶表面之下，通常不需要多晶硅掩模，从而节省制造成本。

公开(公告)号：US07005347B1

公开(公告)日：2006-02-28

申请号：US10832776

申请日：2004-04-27

申请人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L21/336

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

公开(公告)号：US07868381B1

公开(公告)日：2011-01-11

申请号：US11982906

申请日：2007-11-05

申请人： Anup Bhalla ,  Domon Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Domon Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L27/108

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

摘要翻译： 在沟槽栅极MIS器件中，沟槽内的栅极接触，从而不需要使栅极材料（通常为多晶硅）延伸到沟槽外部。 这避免了沟槽上角处的应力问题。 栅极金属和多晶硅之间的接触通常在位于器件的有源区域之外的栅极金属区域中形成。 描述了用于形成栅极金属和多晶硅之间的接触的各种构造，包括其中沟槽在接触区域中变宽的实施例。 由于在整个器件中多晶硅被回蚀到硅的顶表面之下，通常不需要多晶硅掩模，从而节省制造成本。