公开(公告)号：US20250011981A1

公开(公告)日：2025-01-09

申请号：US18757278

申请日：2024-06-27

Applicant: Apple Inc.

Inventor： Didio V Gomes ,  Francois R Jacob ,  Kathryn P Crews ,  Benjamin J Grena ,  Tirshathah A Hunter ,  Maurice P May ,  Daniel A Podhajny ,  Andrew L Rosenberg

IPC: D03D13/00 ,  D03D15/41 ,  D03D15/47 ,  D03D15/533

Abstract: Interlacing equipment may be used to form fabric such as woven fabric. The woven fabric may include warp strands and weft strands. In a Leno weave, a warp strand may include one or more covering strands twisted around a core strand. The covering strands and/or the core strand may be conductive to form a conductive warp strand. An electrical component may be mounted to the conductive warp strand. A first electrical connection may couple the electrical component to the core strand and a second electrical connection may couple the electrical component to the covering strand. The two electrical connections may be isolated from one another. A warp strand may have a first region in which the core includes a conductive strand and a second region in which the conductive strand forms part of the covering or is located on an outer surface of the covering.

公开(公告)号：US20250105228A1

公开(公告)日：2025-03-27

申请号：US18475054

申请日：2023-09-26

Applicant: Apple Inc.

Inventor： Kyusang Kim ,  David M Kindlon ,  Kishore N Renjan ,  Manoj Vadeentavida ,  Bilal Mohamed Ibrahim Kani ,  Benjamin J Grena ,  Ali N Ergun ,  Jerzy S Guterman ,  Jee Tung Tan ,  Steven Webster ,  Parin R Dedhia ,  Howell John Chua Toc ,  Mandar S Painaik ,  Abhay Maheshwari ,  Wyeman Chen ,  Yanfeng Chen ,  Andrew N Leopold ,  Jun Zhang ,  Dhruv Gaba

IPC: H01L25/16

Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

公开(公告)号：US20240417895A1

公开(公告)日：2024-12-19

申请号：US18735935

申请日：2024-06-06

Applicant: Apple Inc.

Inventor： Andrew L Rosenberg ,  Kathryn P Crews ,  Didio V Gomes ,  Weibing Gong ,  Benjamin J Grena ,  Francois R Jacob ,  Maurice P May ,  Daniel A Podhajny ,  Lia M Uesato

IPC: D03D1/00 ,  D03D13/00 ,  D03D25/00 ,  D04B21/20 ,  D04C3/00

Abstract: Interlacing equipment may be used to form fabric. A component detector may be used to feed strands such as a conductive strand to the interlacing equipment. One or more electrical components may be mounted to the conductive strand. The component detector may have a sensor configured to detect the presence of the electrical component as the conductive strand is fed to the interlacing equipment through the component detector. In response to detecting the component with the sensor, the interlacing equipment may automatically adjust interlacing operations in preparation for receiving the electrical component. For example, needles may be lowered in a knitting system, select warp strands may be raised and lowered in a weaving system, or a carrier may follow a modified path in a braiding system in response to detecting the electrical component. The fabric may have a different construction in regions where the electrical component is received.