公开(公告)号：US20240073591A1

公开(公告)日：2024-02-29

申请号：US17895984

申请日：2022-08-25

Applicant: Apple Inc.

Inventor： Marco BARATELLI ,  Claudio NOTARANGELO ,  Matthew A. DONARSKI ,  Mo C. CHAN

IPC: H04R1/28

CPC classification number: H04R1/2888

Abstract: Implementations of the subject technology provide an acoustic module with fins integrated within the acoustic module to reduce acoustic noise. Airflow caused by pressure changes due to an oscillating diaphragm can be diverted by the fins within the acoustic module. The diverted airflow provide a more uniform airflow distribution within the acoustic module, which leads to a lower peak velocity and less unwanted noise. Fins may include a curved or crescent shape and may be spaced in a certain manner to divert the airflow.

公开(公告)号：US20230379609A1

公开(公告)日：2023-11-23

申请号：US18144789

申请日：2023-05-08

Applicant: Apple Inc.

Inventor： Scott C. GRINKER ,  Ali N. ERGUN ,  Anthony D. MINERVINI ,  Claudio NOTARANGELO ,  Matthew A. DONARSKI

IPC: H04R1/04 ,  H04R1/08 ,  H04R1/02

CPC classification number: H04R1/04 ,  H04R1/083 ,  H04R1/025 ,  H04R2499/11 ,  H04R2400/11

Abstract: Implementations of the subject technology provide for a microphone in the front volume of a speaker. The speaker and the microphone may be provided in a single speaker assembly. The microphone may be implemented as an error microphone or a feedback microphone. The microphone may be mounted to a speaker frame of the speaker, with a sound-sensitive element of the microphone in the front volume of the speaker on a first side of the speaker frame, and with conductive contacts for the microphone disposed on an opposing second side of the speaker frame.

公开(公告)号：US20220360886A1

公开(公告)日：2022-11-10

申请号：US17315228

申请日：2021-05-07

Applicant: Apple Inc.

Inventor： Oliver LEONHARDT ,  Anthony P. GRAZIAN ,  Claudio NOTARANGELO

IPC: H04R1/28 ,  H04R1/02 ,  G06F1/16

Abstract: Aspects of the subject technology relate to electronic devices having speakers with resonators, such as Helmholtz resonators, acoustically coupled to the front volume of the speaker. A speaker module for an electronic device may include multiple resonators, including a first resonator that is acoustically separate from, and at least partially disposed within a second resonator. An acoustic barrier between the first resonator and the second resonator may have a liquid resistance that is different from a liquid resistance that is provided between the first resonator and a back volume of the speaker module and/or between an external environment of the speaker. In one or more implementations, a third resonator may be provided, that is spatially separated from first and second nested and/or adjacent resonators.

公开(公告)号：US20220322011A1

公开(公告)日：2022-10-06

申请号：US17220890

申请日：2021-04-01

Applicant: Apple Inc.

Inventor： Claudio NOTARANGELO ,  Onur ILKORUR ,  Matthew A. DONARSKI ,  Christopher WILK

IPC: H04R7/12 ,  H04R9/06

Abstract: Implementations of the subject technology provide vented audio transducers such as vented speakers. A speaker assembly may define a first volume under a dome of the speaker and a second volume under a surround of the speaker. The first volume and the second volume may be separated by a speaker structure such as a voice coil. By venting the first volume to the second volume, the disclosed vented speakers can provide a flatter response at high frequencies and lower distortion relative to conventional speakers, by equalizing the pressure under the diaphragm during operation.