公开(公告)号：US20180084636A1

公开(公告)日：2018-03-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. PAKULA ,  Daniel W. JARVIS ,  Gregory N. STEPHENS ,  Ian A. SPRAGGS ,  Vu Thanh VO ,  Amir SALEHI ,  Dennis R. PYPER ,  Alex J. CRUMLIN ,  Corey S. PROVENCHER ,  Derek J. WALTERS ,  Michael V. YEH

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/148 ,  H05K7/20963 ,  H05K9/0033 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10257

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.