公开(公告)号：US20170156111A1

公开(公告)日：2017-06-01

申请号：US15431628

申请日：2017-02-13

Applicant: Apple Inc.

Inventor： Patrick Y. LAW ,  Keith COX ,  John M. ANANNY ,  Stephen D. STERZ ,  Derek J. DICARLO ,  Gaurav KAPOOR ,  Jason L. PANG ,  Alex J. CRUMLIN

IPC: H04W52/02 ,  H04L12/26

CPC classification number: H04W52/028 ,  H04B1/385 ,  H04L43/16 ,  H04W52/0261 ,  H04W52/027 ,  H04W52/0277 ,  H04W52/0287 ,  Y02D70/00 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/166 ,  Y02D70/26

Abstract: The subject matter of the disclosure relates to low temperature power throttling at a mobile device to reduce the likelihood of an unexpected power down event in cold weather environments. A mobile device employing a power management solution may be configured to determine that a monitored temperature at the mobile device (at the battery of the mobile device) is below a first threshold level, and whether a hardware component (such as a camera) is active or inactive. Then, based on these determinations, the mobile device can select a throttle setting from a first set of throttle settings when the hardware component is active, and a second set of throttle settings when the hardware component is inactive. Subsequently the mobile device can throttle power consumption for one or more components of the mobile device according to the selected throttle setting.

公开(公告)号：US20180084636A1

公开(公告)日：2018-03-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. PAKULA ,  Daniel W. JARVIS ,  Gregory N. STEPHENS ,  Ian A. SPRAGGS ,  Vu Thanh VO ,  Amir SALEHI ,  Dennis R. PYPER ,  Alex J. CRUMLIN ,  Corey S. PROVENCHER ,  Derek J. WALTERS ,  Michael V. YEH

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/148 ,  H05K7/20963 ,  H05K9/0033 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10257

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.