公开(公告)号：US09942988B2

公开(公告)日：2018-04-10

申请号：US15281340

申请日：2016-09-30

Applicant: TDK Corporation

Inventor： Kazuharu Kitatani ,  Yasunobu Noguchi

IPC: H05K7/00 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K1/11 ,  H05K3/306 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10272

Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface of the base substrate; and an electronic component disposed on the mounting surface and including a plurality of terminals. At least one of the terminals is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion is inserted. A first insertion portion is provided in the component connecting end portion. The terminal is inserted through the first insertion portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface positioned closer to a rear surface of the base substrate than the component mounting surface. The soldering surface is on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes.

公开(公告)号：US20170347456A1

公开(公告)日：2017-11-30

申请号：US15165813

申请日：2016-05-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Francis J. CARNEY ,  Yusheng LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01L23/48 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/341 ,  H05K3/3431 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/10189 ,  H05K2201/10257 ,  H05K2201/10333 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/16

Abstract: A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

公开(公告)号：US20170332476A1

公开(公告)日：2017-11-16

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/02 ,  H01P3/08 ,  H01P3/06 ,  H05K1/14

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US20160233595A1

公开(公告)日：2016-08-11

申请号：US15022544

申请日：2014-06-02

Applicant: ADVANTEC SENSING AS

Inventor： Tore Gundersen

IPC: H01R12/58 ,  H01R43/02 ,  G01D5/24 ,  H05K1/14

CPC classification number: H01R12/58 ,  G01D5/24 ,  G01F23/265 ,  G01F23/268 ,  H01R43/0256 ,  H05K1/0201 ,  H05K1/144 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10303 ,  H05K2201/10356 ,  H05K2201/1059 ,  H05K2201/2036

Abstract: Connecting a capacitive measuring probe at elevated temperatures is achieved by direct attachment of metallic connecting components on a temperature substrate. A method and apparatus for a high temperature cable to circuit board connection involves a set or plurality of connecting elements that are soldered directly on the circuit board and a set or plurality of mating connecting elements that are soldered to a secondary circuit board having soldering pads for a cable.

Abstract translation: 在高温下连接电容测量探头是通过将金属连接部件直接连接在温度基板上实现的。 用于高温电缆到电路板连接的方法和装置包括直接焊接在电路板上的一组或多个连接元件，以及一组或多个匹配的连接元件，其被焊接到具有焊盘的焊盘的二次电路板 一根电缆

公开(公告)号：US20050266703A1

公开(公告)日：2005-12-01

申请号：US11140195

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环被焊接到基板和装置两者，并且在制造期间通过柔性非导电膜保持在适当的位置，其中形成有H形的切口并且插入导电环。 H形切口的内部部分延伸到导电环中，并在制造过程中将环保持在适当位置。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US06638638B2

公开(公告)日：2003-10-28

申请号：US09954026

申请日：2001-09-18

Applicant: Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

Inventor： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

IPC: B22F300

CPC classification number: H01L24/10 ,  B23K1/0008 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12014 ,  Y10T428/12222 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract translation: 焊料结构包括径向弯曲的外表面，其包围预定尺寸的空腔，用于在预定的导电接触点处柔性地接合两个具有不同性质的平面元件。 通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘，另一个平面元件具有相应的环形或圆形导电焊盘，由由焊料和助熔剂构成的球形焊料化合物分开， 可以在焊料化合物的熔化和随后的冷却期间产生焊料结构。 所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。

公开(公告)号：US06625883B2

公开(公告)日：2003-09-30

申请号：US09837423

申请日：2001-04-19

Applicant: Koji Soejima ,  Naoji Senba

Inventor： Koji Soejima ,  Naoji Senba

IPC: H01R900

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1111 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract translation: 公开了一种凸块结构，其具有中空体，用于电连接第一构件和第二构件。 还公开了一种制造凸块结构的方法，其具有以下步骤：制备具有凹模的模制板以模制凸块形成构件; 形成导电薄膜，以在模板的凹模中形成预定的空腔; 准备要传输导电薄膜的基板; 以及将形成在所述成型板上的导电性薄膜转移到所述基板。

公开(公告)号：US6086386A

公开(公告)日：2000-07-11

申请号：US862151

申请日：1997-05-22

Applicant: Joseph Fjelstad ,  Thomas H. DiStefano ,  Konstantine Karavakis ,  Anthony B. Faraci ,  Tan Nguyen

Inventor： Joseph Fjelstad ,  Thomas H. DiStefano ,  Konstantine Karavakis ,  Anthony B. Faraci ,  Tan Nguyen

IPC: H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R12/00

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1061 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49149

Abstract: A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有布置成规则网格图案的多个活动触点的片状体。 有源触点可以包括在片状元件的第一主表面上围绕片状元件中的孔向内延伸的几个片状金属突起。 支撑结构例如非隔离结构柱的格子阵列在片状元件的第二主表面上，并且每个柱电连接到一个活动触点。 柱的网格阵列和活动触点的网格阵列彼此偏移，使得活动触点被多个柱包围。 支柱支撑与柱连接的基板间隔开的片状元件。 其上具有凸起引线的微电子元件可以通过使凸起引线与活动触头接触，并使片状元件在一侧的凸起引线与另一侧上的柱之间偏转而接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US5900674A

公开(公告)日：1999-05-04

申请号：US781972

申请日：1996-12-23

Applicant: Robert John Wojnarowski ,  Barry Scott Whitmore

Inventor： Robert John Wojnarowski ,  Barry Scott Whitmore

IPC: H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01L23/40

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

公开(公告)号：US5468995A

公开(公告)日：1995-11-21

申请号：US270548

申请日：1994-07-05

Applicant: Leo M. Higgins, III

Inventor： Leo M. Higgins, III

IPC: H01L21/56 ,  H01L23/31 ,  H05K3/34 ,  H01L23/50

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/181 ,  H05K2201/0212 ,  H05K2201/10257 ,  Y02P70/613

Abstract: An array type semiconductor device (10 and 40) has compliant polymer columnar I/O connections (30) to accommodate thermally induced stress during device operation. The device has a semiconductor die (22) mounted to a substrate (12) and electrically connected thereto. A package body (28, 46) covers the semiconductor die and electrical connections (26, 42) to provide mechanical protection. The I/O contacts are formed from a polymer core (34) that is metallized to impart electrical conductivity to the contacts. The metallization (36, 38) may either be a plating around the polymer core or fillers embedded in the polymer. The aspect ratio of the polymer contacts is greater than one to provide compliance while maintaining high I/O density in the array. The metallized polymer contacts may be attached to the package substrate and to a PWB with joints (32) composed of either solder or a conductive adhesive.

Abstract translation: 阵列型半导体器件（10和40）具有柔性聚合物柱状I / O连接（30），以在器件操作期间适应热诱导的应力。 该装置具有安装到基板（12）并与其电连接的半导体管芯（22）。 封装主体（28,46）覆盖半导体管芯和电连接（26,42）以提供机械保护。 I / O触点由金属化的聚合物芯（34）形成，以赋予触点导电性。 金属化（36,38）可以是围绕聚合物芯的电镀或嵌入聚合物中的填料。 聚合物触点的长宽比大于1，以提供顺应性，同时保持阵列中的高I / O密度。 金属化聚合物触点可以连接到封装衬底和具有由焊料或导电粘合剂组成的接头（32）的PWB。