公开(公告)号：US20170364158A1

公开(公告)日：2017-12-21

申请号：US15621930

申请日：2017-06-13

Applicant: Apple Inc.

Inventor： Xiaonan Wen ,  Wei Lin ,  James E. Pedder ,  Xiaofan Niu ,  Nathan K. Gupta ,  Po-Jui Chen ,  Robert W. Rumford ,  Pavan O. Gupta ,  Jui-Ming Yang

IPC: G06F3/01 ,  G06F3/02 ,  G06F3/0354 ,  G06F3/041

CPC classification number: G06F3/016 ,  G06F3/0202 ,  G06F3/03547 ,  G06F3/0412 ,  G06F2203/014 ,  H01L41/0986

Abstract: In some embodiments, a haptic actuator includes piezoelectric material and a pattern of voltage electrodes coupled to a surface of the piezoelectric material. The voltage electrodes are individually controllable to supply voltage to different portions of the piezoelectric material. Different sections of the piezoelectric material are operable to deflect, producing haptic output at those locations, in response to the application of the voltage. Differing voltages may be provided to one or more of the voltage electrodes to affect the location of the deflection, and thus the haptic output. In various embodiments, a haptic output system incorporates a sealed haptic element. The sealed haptic element includes a piezoelectric component that is coupled to one or more flexes and is sealed and/or enclosed by the flex(es) and an encapsulation or sealing material.

公开(公告)号：US10098224B1

公开(公告)日：2018-10-09

申请号：US15871585

申请日：2018-01-15

Applicant: Apple Inc.

Inventor： Yindar Chuo ,  Nathan K. Gupta ,  Po-Jui Chen ,  Wei Lin ,  Wei-Hao Sun ,  Jui-Ming Yang

IPC: H05K1/00 ,  H05K1/02 ,  H01R12/77 ,  H01R12/59 ,  H05K1/03 ,  B32B38/00 ,  H01R43/02

Abstract: Reinforcement components for electrical connections with limited accessibility Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, a reinforcement component may be compressed between two portions of a first electronic component in order to deform the reinforcement component for filling in a void between the reinforcement component and a coupling formed between the first electronic component and a second electronic component. The first electronic component may be a flexible circuit component that may be folded over the reinforcement component prior to the reinforcement component being compressed. This may enable the reinforcement component to be effectively positioned with respect to the first electronic component prior to being deformed for reinforcing one or more couplings made between the first electronic component and the second electronic component.

公开(公告)号：US20180081441A1

公开(公告)日：2018-03-22

申请号：US15621966

申请日：2017-06-13

Applicant: Apple Inc.

Inventor： James E. Pedder ,  Supratik Datta ,  Karan Jain ,  Jui-Ming Yang ,  Pavan O. Gupta ,  Robert W. Rumford ,  Wei Lin ,  Xiaofan Niu ,  Xiaonan Wen

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/044

CPC classification number: G06F3/016 ,  G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F3/04886 ,  G06F2203/04105 ,  H01L41/0973

Abstract: An electronic device is configured to provide localized haptic feedback to a user on one or more regions or sections of a surface of the electronic device. The localized haptic feedback is provided by an array of piezoelectric haptic actuators below the surface of the electronic device. Actuators within the array of piezoelectric haptic actuators are separately controllable by a control circuit layer. The control circuit layer includes control circuitry, a master flexible circuit which passes between rows of actuators, and an array of slave flexible circuits. Each slave flexible circuit is connected to the master flexible circuit and an actuator. In further examples, the array of piezoelectric haptic actuators provides a unified structure for detecting touch and force inputs.

公开(公告)号：US20170357325A1

公开(公告)日：2017-12-14

申请号：US15622017

申请日：2017-06-13

Applicant: Apple Inc.

Inventor： Jui-Ming Yang ,  Nathan K. Gupta ,  Po-Jui Chen ,  Teera Songatikamas ,  Kyle J. Campiotti ,  Robert L. Sheridan ,  Xiaonan Wen ,  Xiaofan Niu ,  James E. Pedder

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/044

CPC classification number: G06F3/016 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044

Abstract: An electronic device configured to provide localized haptic feedback to a user on one or more regions or sections of a surface of the electronic device. A support structure is positioned below the surface, and one or more haptic actuators are coupled to the support structure. In some examples, the support structure is shaped or configured to amplify a response to a haptic actuator. When a haptic actuator is actuated, the support structure deflects, which causes the surface to bend or deflect at a location that substantially corresponds to the location of the activated haptic actuator. In some examples, prior to providing haptic feedback, at least one haptic actuator is electrically pre-stressed to place the haptic actuator(s) in a pre-stressed state. When haptic feedback is to be provided, at least one haptic actuator transitions from the pre-stressed state to a haptic output state to produce one or more deflections in the surface. In other examples, a haptic structure incorporates a piezoelectric element that is shaped to reduce the overall cost of the haptic structure while still providing high actuation performance.