公开(公告)号：US10224238B2

公开(公告)日：2019-03-05

申请号：US15268106

申请日：2016-09-16

Applicant: Apple Inc.

Inventor： Chang Ming Lu ,  Chia-Yu Chen ,  Chih Pang Chang ,  Ching-Sang Chuang ,  Hung-Che Ting ,  Jung Yen Huang ,  Sheng Hui Shen ,  Shih Chang Chang ,  Tsung-Hsiang Shih ,  Yu-Wen Liu ,  Yu Hung Chen ,  Kai-Chieh Wu ,  Lun Tsai ,  Takahide Ishii ,  Chung-Wang Lee ,  Hsing-Chuan Wang ,  Chin Wei Hsu ,  Fu-Yu Teng

IPC: H01L21/768 ,  H01L21/02 ,  H01L21/027 ,  H01L21/77

Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.

公开(公告)号：US20170294499A1

公开(公告)日：2017-10-12

申请号：US15268106

申请日：2016-09-16

Applicant: Apple Inc.

Inventor： Chang Ming Lu ,  Chia-Yu Chen ,  Chih Pang Chang ,  Ching-Sang Chuang ,  Hung-Che Ting ,  Jung Yen Huang ,  Sheng Hui Shen ,  Shih Chang Chang ,  Tsung-Hsiang Shih ,  Yu-Wen Liu ,  Yu Hung Chen ,  Kai-Chieh Wu ,  Lun Tsai ,  Takahide Ishii ,  Chung-Wang Lee ,  Hsing-Chuan Wang ,  Chin Wei Hsu ,  Fu-Yu Teng

IPC: H01L27/32 ,  H01L51/56 ,  H01L23/532 ,  H01L21/027 ,  H01L21/768 ,  H01L21/02

CPC classification number: H01L21/76834 ,  H01L21/02244 ,  H01L21/02252 ,  H01L21/02255 ,  H01L21/0273 ,  H01L21/7685 ,  H01L21/76877 ,  H01L21/77

Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.