公开(公告)号：US20160200257A1

公开(公告)日：2016-07-14

申请号：US15078960

申请日：2016-03-23

Applicant: Apple Inc.

Inventor： Christopher D. PREST ,  Stephen P. ZADESKY ,  Trent WEBER ,  Lucy E. BROWNING

IPC: B60R7/04 ,  B60R11/02 ,  A45C11/00

CPC classification number: B60R7/04 ,  A45C11/00 ,  A45C2011/001 ,  A45C2011/002 ,  A45C2011/003 ,  B60R11/0211 ,  B60R11/0241 ,  B60R11/0252 ,  B60R2011/0003 ,  B60R2011/0057 ,  G06F1/1656 ,  G06F1/181 ,  H01L23/043 ,  H01L23/047 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H05K5/0004 ,  H05K5/0021 ,  H05K5/02 ,  H05K5/04 ,  H05K5/069 ,  H05K13/00 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

公开(公告)号：US20200100402A1

公开(公告)日：2020-03-26

申请号：US16262763

申请日：2019-01-30

Applicant: Apple Inc.

Inventor： Griffin L. SCHMITT ,  Benjamin S. BUSTLE ,  Kevin M. FROESE ,  Lucy E. BROWNING ,  Zhipeng ZHANG ,  Jaden A. BARNEY ,  Nan LI

IPC: H05K9/00 ,  H05K5/02 ,  H05K5/03 ,  H05K5/00

Abstract: A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.

公开(公告)号：US20180198196A1

公开(公告)日：2018-07-12

申请号：US15917083

申请日：2018-03-09

Applicant: Apple Inc.

Inventor： Colin M. ELY ,  Christopher D. PREST ,  Lucy E. BROWNING ,  Stephen B. LYNCH ,  Eric S. LAAKMANN ,  Paul L. NANGERONI

IPC: H01Q1/42 ,  H01Q1/24 ,  C23C28/00 ,  C23C14/16 ,  C23C16/06 ,  C23C14/58

CPC classification number: H01Q1/42 ,  C23C14/16 ,  C23C14/5853 ,  C23C16/06 ,  C23C28/322 ,  C23C28/345 ,  H01Q1/24 ,  H01Q1/243

Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.

公开(公告)号：US20200269765A1

公开(公告)日：2020-08-27

申请号：US16871918

申请日：2020-05-11

Applicant: Apple Inc.

Inventor： Christopher D. PREST ,  Stephen P. ZADESKY ,  Trent WEBER ,  Lucy E. BROWNING

IPC: B60R7/04 ,  A45C11/00 ,  B60R11/02 ,  G06F1/18 ,  H01L23/043 ,  H01L23/047 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H05K5/00 ,  H05K13/00 ,  G06F1/16 ,  H05K5/02 ,  H05K5/04 ,  H05K5/06

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

公开(公告)号：US20140361934A1

公开(公告)日：2014-12-11

申请号：US13973939

申请日：2013-08-22

Applicant: Apple Inc.

Inventor： Colin M. ELY ,  Christopher D. PREST ,  Lucy E. BROWNING ,  Stephen B. LYNCH ,  Eric S. LAAKMANN ,  Paul L. NANGERONI

IPC: H01Q1/24 ,  C23C28/04

CPC classification number: H01Q1/42 ,  C23C14/16 ,  C23C14/5853 ,  C23C16/06 ,  C23C28/322 ,  C23C28/345 ,  H01Q1/24 ,  H01Q1/243

Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.

Abstract translation: 提供了一种用于电子设备的外壳，包括包围有包括射频（RF）天线的音量的铝层）。 壳体包括与RF天线对准的窗口; 所述窗口包括填充所述铝层中的空腔的非导电材料; 以及与铝层和非导电材料相邻的薄的氧化铝层; 其中所述非导电材料和所述薄氧化铝层形成穿过所述窗口的RF透明路径。 还提供了一种用于包括集成RF天线的电子设备的外壳。 提供了如上所述制造用于电子设备的外壳的方法。

公开(公告)号：US20190135188A1

公开(公告)日：2019-05-09

申请号：US16180989

申请日：2018-11-05

Applicant: Apple Inc.

Inventor： Christopher D. PREST ,  Stephen P. ZADESKY ,  Trent WEBER ,  Lucy E. BROWNING

IPC: B60R7/04 ,  B60R11/02 ,  G06F1/18 ,  H01L23/043 ,  H01L23/047 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  A45C11/00 ,  H05K5/06 ,  H05K5/04 ,  H05K5/02 ,  H05K5/00 ,  G06F1/16 ,  H05K13/00

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

公开(公告)号：US20190106803A1

公开(公告)日：2019-04-11

申请号：US16215417

申请日：2018-12-10

Applicant: Apple Inc.

Inventor： Lucy E. BROWNING ,  Stephen B. LYNCH ,  Christopher D. PREST ,  Peter N. RUSSELL-CLARKE ,  Masashige TATEBE ,  Michael S. NASHNER ,  Daniel T. MCDONALD ,  Brian S. TRYON ,  Jody R. AKANA

IPC: C25D11/18 ,  B23K26/352 ,  B23K26/354 ,  C25D11/04 ,  C25D11/02 ,  C25D11/12

Abstract: The embodiments described herein relate to forming anodized films that have a white appearance. In some embodiments, an anodized film having pores with light diffusing pore walls created by varying the current density during an anodizing process is described. In some embodiments, an anodized film having light diffusing micro-cracks created by a laser cracking procedure is described. In some embodiments, a sputtered layer of light diffusing aluminum is provided below an anodized film. In some embodiments, light diffusing particles are infused within openings of an anodized layer.

公开(公告)号：US20160149298A1

公开(公告)日：2016-05-26

申请号：US14945335

申请日：2015-11-18

Applicant: Apple Inc.

Inventor： Colin M. ELY ,  Christopher D. PREST ,  Lucy E. BROWNING ,  Stephen B. LYNCH ,  Eric S. LAAKMANN ,  Paul L. NANGERONI

IPC: H01Q1/42 ,  H01Q1/24

CPC classification number: H01Q1/42 ,  C23C14/16 ,  C23C14/5853 ,  C23C16/06 ,  C23C28/322 ,  C23C28/345 ,  H01Q1/24 ,  H01Q1/243

Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.

Abstract translation: 提供了一种用于电子设备的外壳，包括包围有包括射频（RF）天线的音量的铝层）。 壳体包括与RF天线对准的窗口; 所述窗口包括填充所述铝层中的空腔的非导电材料; 以及与铝层和非导电材料相邻的薄的氧化铝层; 其中所述非导电材料和所述薄氧化铝层形成穿过所述窗口的RF透明路径。 还提供了一种用于包括集成RF天线的电子设备的外壳。 提供了如上所述制造用于电子设备的外壳的方法。