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Patent Agency Ranking
公开(公告)号：US20180109659A1
公开(公告)日：2018-04-19
申请号：US15593252
申请日：2017-05-11
Applicant: Apple Inc.
Inventor： Xiao Ying ZHAO , Timothy S. LUI , Tyler B. CATER , Rasamy PHOUTHAVONG , Scott A. MYERS , Benjamin J. POPE , David A. HURRELL , Christopher R. XYDIS , Edward S. HUO , Richard Hung Minh DINH , Michael W. FIRKA , Martin J. AUCLAIR , Kurtis J. MUNDELL , Salome BAVETTA , Paul LEUTHEUSER , Hani ESMAEILI , Kevin M. FROESE , Ihtesham H. CHOWDHURY , Tang Yew TAN , Eric W. BATES , Yaocheng ZHANG
CPC classification number: H05K5/0217 , G06F1/1626 , G06F1/1633 , G06F1/1684 , G06F1/1698 , H01H9/04 , H04B1/3816 , H04M1/0249 , H04M1/026 , H04M1/18 , H04R1/025 , H04R1/44 , H04R2499/11 , H05K7/1461
Abstract: An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.
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公开(公告)号：US20180110143A1
公开(公告)日：2018-04-19
申请号：US15593253
申请日：2017-05-11
Applicant: Apple Inc.
Inventor： Xiao Ying ZHAO , Timothy S. LUI , Tyler B. CATER , Rasamy PHOUTHAVONG , Scott A. MYERS , Benjamin J. POPE , David A. HURRELL , Christopher R. XYDIS , Edward S. HUO , Richard Hung Minh DINH , Michael W. FIRKA , Martin J. AUCLAIR , Kurtis J. MUNDELL , Salome BAVETTA , Paul LEUTHEUSER , Hani ESMAEILI , Kevin M. FROESE , Ihtesham H. CHOWDHURY , Tang Yew TAN , Eric W. BATES , Yaocheng ZHANG
CPC classification number: H05K5/0217 , G06F1/1626 , G06F1/1633 , G06F1/1684 , G06F1/1698 , H01H9/04 , H04B1/3816 , H04M1/0249 , H04M1/026 , H04M1/18 , H04R1/025 , H04R1/44 , H04R2499/11 , H05K7/1461
Abstract: An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.
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公开(公告)号：US20230239610A1
公开(公告)日：2023-07-27
申请号：US17583135
申请日：2022-01-24
Applicant: Apple Inc.
Inventor： Justin D. Crosby , Kevin M. FROESE , Tzu Hung Huang
CPC classification number: H04R1/2876 , H03H9/205 , H04R1/04 , H04R2499/11 , H04R2499/15 , H04M1/026
Abstract: Aspects of the subject technology relate to electronic devices having microphones. An electronic device may include a microphone and a resonator for the microphone. The resonator may be formed in a device structure that is spatially separated from the microphone. The resonator may be formed in an interior wall of a housing of the electronic device, or in a support structure within an enclosure of the electronic device. A resonator and/or one or more damping features, may reduce a resonance effect, on the microphone, of a resonant cavity within the enclosure of the electronic device and adjacent the microphone.
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公开(公告)号：US20230239611A1
公开(公告)日：2023-07-27
申请号：US17583137
申请日：2022-01-24
Applicant: Apple Inc.
Inventor： Justin D. Crosby , Kevin M. FROESE , Tzu Hung Huang
CPC classification number: H04R1/2876 , H03H9/17 , H05K5/03 , H05K5/0017 , H04R1/04 , H04R2499/15 , H04R2499/11 , H04M1/026
Abstract: Aspects of the subject technology relate to electronic devices having microphones. An electronic device may include a microphone and a resonator for the microphone. The resonator may be formed in a device structure that is spatially separated from the microphone. The resonator may be formed in an interior wall of a housing of the electronic device, or in a support structure within an enclosure of the electronic device. A resonator and/or one or more damping features, may reduce a resonance effect, on the microphone, of a resonant cavity within the enclosure of the electronic device and adjacent the microphone.
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公开(公告)号：US20200100402A1
公开(公告)日：2020-03-26
申请号：US16262763
申请日：2019-01-30
Applicant: Apple Inc.
Inventor： Griffin L. SCHMITT , Benjamin S. BUSTLE , Kevin M. FROESE , Lucy E. BROWNING , Zhipeng ZHANG , Jaden A. BARNEY , Nan LI
Abstract: A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.
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