Tiled Processor Communication Fabric
    2.
    发明公开

    公开(公告)号:US20230419585A1

    公开(公告)日:2023-12-28

    申请号:US17808392

    申请日:2022-06-23

    Applicant: Apple Inc.

    CPC classification number: G06T15/005 G06F9/3887

    Abstract: Techniques are disclosed relating to processor communications fabrics. In some embodiments, a processor includes multiple client circuitry and fabric circuitry that includes at least first and second instances of a tile. The tile may include: client inputs configured to interface with client circuits, tile inputs configured to interface with one or more other tile instances, and communication resources assignable to the client inputs and tile inputs. The communications resources may include: multiple internal links, client outputs configured to interface with client circuits, and tile outputs configured to interface with one or more other tile instances. Control circuitry may, in a given cycle, assign communication resources of a given tile instance to at least a portion of the client inputs and tile inputs for a next cycle, based on priority information. The control circuitry may update priority information based on assignment results over multiple cycles.

    Shared Control Bus for Graphics Processors

    公开(公告)号:US20220237028A1

    公开(公告)日:2022-07-28

    申请号:US17158943

    申请日:2021-01-26

    Applicant: Apple Inc.

    Abstract: Techniques are disclosed relating to a shared control bus for communicating between primary control circuitry and multiple distributed graphics processor units. In some embodiments, a set of multiple processor units includes first and second graphics processors, where the first and second graphics processors are coupled to access graphics data via respective memory interfaces. A shared workload distribution bus is used to transmit control data that specifies graphics work distribution to the multiple graphics processing units. The shared workload distribution bus may be arranged in a chain topology, e.g., to connect the workload distribution circuitry to the first graphics processor and connect the first graphics processor to the second graphics processor such that the workload distribution circuitry communicates with the second graphics processor via the shared workload distribution bus connection to the first graphics processor. Disclosed techniques may facilitate graphics work distribution for a scalable number of processors.

    Tiled processor communication fabric

    公开(公告)号:US11941742B2

    公开(公告)日:2024-03-26

    申请号:US17808392

    申请日:2022-06-23

    Applicant: Apple Inc.

    CPC classification number: G06T15/005 G06F9/3887

    Abstract: Techniques are disclosed relating to processor communications fabrics. In some embodiments, a processor includes multiple client circuitry and fabric circuitry that includes at least first and second instances of a tile. The tile may include: client inputs configured to interface with client circuits, tile inputs configured to interface with one or more other tile instances, and communication resources assignable to the client inputs and tile inputs. The communications resources may include: multiple internal links, client outputs configured to interface with client circuits, and tile outputs configured to interface with one or more other tile instances. Control circuitry may, in a given cycle, assign communication resources of a given tile instance to at least a portion of the client inputs and tile inputs for a next cycle, based on priority information. The control circuitry may update priority information based on assignment results over multiple cycles.

    Shared Control Bus for Graphics Processors
    5.
    发明公开

    公开(公告)号:US20240054014A1

    公开(公告)日:2024-02-15

    申请号:US18493993

    申请日:2023-10-25

    Applicant: Apple Inc.

    Abstract: Techniques are disclosed relating to a shared control bus for communicating between primary control circuitry and multiple distributed graphics processor units. In some embodiments, a set of multiple graphics processor units including at least first and second graphics processors on different semiconductor substrates that are packaged in a multi-chip module, where the first and second graphics processors are coupled to access graphics data via respective memory interfaces. The shared workload distribution bus may include: one or more interfaces between respective graphics processors on the same semiconductor substrate and at least one cross-substrate interface between the different semiconductor substrates. Workload distribution circuitry may transmit, via the shared workload distribution bus, control data that specifies graphics work distribution to the multiple graphics processor units. Packet control circuitry may modify packets from at least one of the one or more interfaces for transmission via the cross-substrate interface.

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