MICRO-PERFORATION OVERMOLDING GATE
    2.
    发明申请
    MICRO-PERFORATION OVERMOLDING GATE 有权
    微型门窗过压门

    公开(公告)号:US20160143168A1

    公开(公告)日:2016-05-19

    申请号:US14815376

    申请日:2015-07-31

    Applicant: Apple Inc.

    Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

    Abstract translation: 描述具有突出特征的电子设备和用于将突出特征模制到电子设备的方法。 突出特征可以通过模制工具形成,该模制工具释放流过基底的若干孔的材料。 此外,模制工具相对于基底定位,使得来自模制工具的材料经由多个孔从衬底的内部区域流动到衬底的外部区域。 因此,每个孔从内部区域的开口延伸到衬底的外部区域的开口。 在一些情况下,孔可以包括圆锥形。 例如,内部区域中的开口可以包括大于外部区域中的开口的直径的直径。 以这种方式,当固化时,材料机械地固定到基底上。

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