公开(公告)号：US20160143168A1

公开(公告)日：2016-05-19

申请号：US14815376

申请日：2015-07-31

Applicant: Apple Inc.

Inventor： Adam T. GARELLI ,  Simon Regis Louis LANCASTER-LAROCQUE ,  Dinesh C. MATHEW ,  Bruce E. BERG ,  Sarah J. MONTPLAISIR ,  Nicholas A. RUNDLE

IPC: H05K5/02 ,  F21V33/00 ,  G06F1/16 ,  B29C45/34

CPC classification number: G06F1/1656 ,  B29C45/14344 ,  B29C45/34 ,  B29C2045/14352 ,  B29C2045/14368 ,  B29K2019/00 ,  B29K2033/08 ,  B29L2031/34

Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

Abstract translation: 描述具有突出特征的电子设备和用于将突出特征模制到电子设备的方法。 突出特征可以通过模制工具形成，该模制工具释放流过基底的若干孔的材料。 此外，模制工具相对于基底定位，使得来自模制工具的材料经由多个孔从衬底的内部区域流动到衬底的外部区域。 因此，每个孔从内部区域的开口延伸到衬底的外部区域的开口。 在一些情况下，孔可以包括圆锥形。 例如，内部区域中的开口可以包括大于外部区域中的开口的直径的直径。 以这种方式，当固化时，材料机械地固定到基底上。

公开(公告)号：US20160342179A1

公开(公告)日：2016-11-24

申请号：US15160054

申请日：2016-05-20

Applicant: Apple Inc.

Inventor： Steven J. OSBORNE ,  Joss N. GIDDINGS ,  Adam T. GARELLI ,  William F. LEGGETT ,  Sarah J. MONTPLAISIR ,  Eric T. CORRIVEAU ,  Tyler J. EWING

IPC: G06F1/16

CPC classification number: G06F1/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/106 ,  B23K20/227 ,  B23K20/2275 ,  B23K20/233 ,  B23K20/2336 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/18 ,  G06F1/1633

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract translation: 公开了将电子设备的外壳中的结构特征结合在一起的技术。 结构特征可以被超声波焊接到外壳以提供结构支撑并在该装置内形成磁路。 此外，超声波焊接可以将各种特征粘合到外壳的内部区域，而不会在对应于各种特征的位置处留下标记或迹线到外壳的外部区域。 此外，一个或多个特征可以被驱动以抵靠外壳，以通过摩擦焊接来接合一个或多个特征。 此外，旋转摩擦焊接机可以将具有相对较小直径的特征以相对较高的速度旋转到外壳上，以将特征驱动到外壳中，并将该特征与外壳摩擦焊接。 此外，摩擦焊接在外部区域上不会留下任何外观的化妆品变形。